Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines
Keyword(s):
ABSTRACTA simple computer model is proposed to simulate the microstructural evolution of Al-4wt%Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.
Keyword(s):
1985 ◽
Vol 16
(3-4)
◽
pp. 277-291
◽
Keyword(s):
Keyword(s):