Dopant Activation During Solid Phase Crystallization of Poly-Si and Influence of Fluorine and Hydrogen

1997 ◽  
Vol 467 ◽  
Author(s):  
A. Kaan Kalkan ◽  
Reece M. Kingi ◽  
Stephen J. Fonash

ABSTRACTDopant activation for ion implanted solid phase crystallized (SPC) a-Si:H films, deposited by low temperature PECVD, was investigated. The impact of film thickness, the effect of subsequent hydrogenation, and a possible role for fluorine in this process have been studied.

1993 ◽  
Vol 1 (2) ◽  
pp. 203 ◽  
Author(s):  
Thomas W. Little ◽  
Hideki Koike ◽  
Ken-ichi Takahara ◽  
Takashi Nakazawa ◽  
Hiroyuki Ohshima

2010 ◽  
Vol 1245 ◽  
Author(s):  
Terry L. Alford ◽  
Karthik Sivaramakrishnan ◽  
Anil Indluru ◽  
Iftikhar Ahmad ◽  
Bob Hubbard ◽  
...  

AbstractVariable frequency microwaves (VFM) and rapid thermal annealing (RTA) were used to activate ion implanted dopants and re-grow implant-damaged silicon. Four-point-probe measurements were used to determine the extent of dopant activation and revealed comparable resistivities for 30 seconds of RTA annealing at 900 °C and 6-9 minutes of VFM annealing at 540 °C. Ion channeling analysis spectra revealed that microwave heating removes the Si damage that results from arsenic ion implantation to an extent comparable to RTA. Cross-section transmission electron microscopy demonstrates that the silicon lattice regains nearly all of its crystallinity after microwave processing of arsenic implanted silicon. Secondary ion mass spectroscopy reveals limited diffusion of dopants in VFM processed samples when compared to rapid thermal annealing. Our results establish that VFM is an effective means of low-temperature dopant activation in ion-implanted Si.


1982 ◽  
Vol 13 ◽  
Author(s):  
J.S. Williams

ABSTRACTThis paper provides a brief overview of the application of transient annealing to the removal of ion implantation damage and dopant activation in GaAs. It is shown that both the liquid phase and solid phase annealing processes are more complex in GaAs than those observed in Si. Particular attention is given to observations of damage removal, surface dissociation, dopant redistribution, solubility and the electrical properties of GaAs. The various annealing mechanisms are discussed and areas in need of further investigation are identified.


1998 ◽  
Vol 135 (1-4) ◽  
pp. 205-208 ◽  
Author(s):  
Yongqian Wang ◽  
Xianbo Liao ◽  
Zhixun Ma ◽  
Guozhen Yue ◽  
Hongwei Diao ◽  
...  

1999 ◽  
Vol 558 ◽  
Author(s):  
A. Kaan Kalkan ◽  
Stephen J. Fonash

ABSTRACTDefect creation mechanisms during solid phase crystallization (SPC) of Si thin films were investigated with PECVD amorphous precursor samples produced with various deposition temperatures and thicknesses. These precursor films were implanted with dopant and then crystallized to obtain both SPC and dopant activation. The doping efficiency was found to decrease with the tensile stress level as measured by Raman shift. The stress shows a decrease as the precursor deposition temperature and thickness are lowered. Furthermore, a lower level of stress is induced by rapid thermal annealing when the annealing temperature is high enough to soften the glass substrate on which the films were deposited. We show that by control of stress during the SPC step, intragrain defect density can be lowered and electronic quality of the resulting polycrystalline Si films can be improved. Based on these observations, we propose the following tentative model to explain the defect creation: during SPC, tensile stress evolution is considered to result from the volumetric contraction of Si film when it transforms from the amorphous to crystalline phase. This contraction is retarded by the substrate, which imposes a tensile stress on the film. A high level of stress leads to formation of structural defects inside the grains of the resulting polycrystalline material. These defects trap carriers or complex with the dopant reducing doping efficiency.


Author(s):  
Kaoru Toko ◽  
Hiroshi Kanno ◽  
Atsushi Kenjo ◽  
Taizoh Sadoh ◽  
Tanemasa Asano ◽  
...  

2015 ◽  
Vol 69 (5) ◽  
pp. 301-304
Author(s):  
R. Matsumura ◽  
K. Moto ◽  
Y. Kai ◽  
T. Sadoh ◽  
H. Ikenoue ◽  
...  

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