Incoherent Light Annealing of Glow Discharge PF5 - Implanted Silicon: Analysis of Damage Recovery and Electrical Activation

1985 ◽  
Vol 45 ◽  
Author(s):  
L. Pedulli ◽  
L. Correra ◽  
R. Galloni ◽  
O. Adekoya ◽  
A. Barhdadi ◽  
...  
Keyword(s):  
Glow Discharge ◽  
Carrier Concentration ◽  
Deep Level ◽  
Concentration Profiles ◽  
Sheet Resistivity ◽  
Incoherent Light ◽  
Annealing Temperatures ◽  
Transmission Electron ◽  
Transient Spectroscopy ◽  
Set Up

ABSTRACTSilicon wafers (100) orientation, were implanted with 3 × 1015 and 1 × 1016 PF5 at 30 keV by glow discharge and subsequently annealed by a commercially available lamp set-up. The annealing temperatures were in the range 620–980°C with irradiation times of 4–7 sec.Sheet resistivity and Hall measurements together with anodic oxidation stripping have been used to determine the mobility and the carrier concentration profiles; the residual damage and the presence of precipitates were investigated by Rutherford Backscattering (RBS) and Transmission Electron Microscopy (TEM).Comparison between the as-implanted dopant depth distribution and the carrier concentration profiles of the annealed samples shows the evolution of the electrically active, substitutional dopant fraction, at increasing annealing temperatures. It is found that the maximum electrical activity is obtained at 720°C; between 720°C and 820°C a process of reverse annealing takes place and the sheet resistivity increases by a factor of about 3. By annealing at temperatures higher than 820°C the substitutional dopant fraction increases again to its maximum value and it is possible to observe the presence of diffusion tails.Finally, RBS, TEM, and Deep Level Transient Spectroscopy (DLTS) were used to investigate the depth location and the evolution of the damage after annealing.

Deep Trap Concentrations from Three-Dimensional Carrier Concentration Profiles in Hydride Vapor Pressure Epitaxially-Grown GaN

2006 ◽  
Vol 251-252 ◽  
pp. 35-50
Author(s):  
N.C. Halder ◽  
J. Martin ◽  
D. Sisler Jr.
Keyword(s):  
Vapor Pressure ◽  
Carrier Concentration ◽  
Reverse Bias ◽  
Deep Level ◽  
Three Dimensional ◽  
Deep Trap ◽  
Concentration Profiles ◽  
Ionization Energies ◽  
Transient Spectroscopy ◽  
Effective Carrier

We have investigated deep trap concentrations in hydride vapor pressure epitaxy (HVPE) - grown GaN by measuring three-dimensional carrier concentration profiles and ionization energies. Schottky contacts were fabricated on 28-68μm thick films using Ni/Au contacts. Extensive capacitance-voltage measurements were made in the temperature range 100-350K at reverse bias voltages in the range 0 to –5V. Effective carrier concentrations and ionization energies were determined from three-dimensional plots of concentration-temperature-depth. Carrier concentration versus temperature plots show slowly changing three-step behavior. During the first step, all the plots rise linearly up to about 200K reaching respective plateaus before reversing courses downwards again linearly. Ionization energy plots, on the other hand, are almost linear all the way up to 350 K showing some tendency of upward bending. Trap concentrations were determined from carrier concentrations and previously measured deep level transient spectroscopy (DLTS) plots as function of reverse bias voltages. In almost every case, trap concentrations also rise linearly with increasing depth in the samples.

Dlts and CV Analysis of Doped and N-Implanted GaN

1996 ◽  
Vol 423 ◽  
Author(s):  
D. Haase ◽  
M. Schmid ◽  
A. Dörnen ◽  
V. Härle ◽  
H. Bolay ◽  
...  
Keyword(s):  
Carrier Concentration ◽  
Deep Level ◽  
Implantation Dose ◽  
Nitrogen Implantation ◽  
Capacitance Voltage ◽  
Defect Levels ◽  
Transient Spectroscopy ◽  
Additional Defect ◽  
Cv Measurements ◽  
Dlts Spectra

AbstractWe studied by deep level transient spectroscopy (DLTS) and capacitance-voltage (CV) measurements the effects of doping (Zn, S), nitrogen implantation and annealing of n-type GaN grown on sapphire by MOVPE. The DLTS spectra of the as grown samples show two defect levels which are assumed to be identical with recently reported levels [10, 11]. In N-implanted GaN a third level is introduced which is not detectable in our as grown samples. This levels concentration follows the increasing N-implantation density. The depth profiles of its concentration correlate with the distribution of implantation defects expected from Monte-Carlo simulation. After annealing at 900°C for 60s the additional defect level vanishes. The DLTS spectrum then resembles those of annealed as grown samples. The n-type carrier concentration (CV measurements) increases in samples with low N-implantation dose. This implantation effect can be removed also with the RTA step. The increasing carrier concentration provides evidence that the N vacancy is a donor in GaN. For Zn and S doped GaN deep defect levels has been found, which are reported here.

Electrical and Structural Properties of MeV Si+ Ion Implantation in Silicon

1995 ◽  
Vol 378 ◽  
Author(s):  
Aditya Agarwal ◽  
S. Koveshnikov ◽  
K. Christensen ◽  
G. A. Rozgonyi
Keyword(s):  
Ion Implantation ◽  
Deep Level ◽  
Structural Defects ◽  
Extended Defects ◽  
Device Layer ◽  
Implantation Damage ◽  
Transmission Electron ◽  
Current Voltage ◽  
Transient Spectroscopy ◽  
Si Ion Implantation

AbstractThe electrical properties of residual MeV ion implantation damage in Si after annealing from 600 to 1100°C for 1 hour have been investigated using Deep Level Transient Spectroscopy, Capaciatance-Voltage, and Current-Voltage measurements. These data have been correlated with structural defects imaged by Transmission Electron Microscopy. It is shown that at least 4 deep levels are associated with the buried layer of extended defects after annealing at 800, 900, 1000 and 1100°C. Additionally, for the wafer annealed at 800°C at least 5 more deep level centers are present in the device layer above the buried defects.

Characterisation of the Subthreshold Damage in MeV Ion Implanted p Si

1998 ◽  
Vol 510 ◽  
Author(s):  
Shabih Fatima ◽  
Jennifer Wong-Leung ◽  
John Fitz Gerald ◽  
C. Jagadish
Keyword(s):  
Point Defects ◽  
Deep Level Transient Spectroscopy ◽  
Damage Evolution ◽  
Peak Concentration ◽  
Deep Level ◽  
Extended Defects ◽  
Transmission Electron ◽  
Transient Spectroscopy ◽  
P Type ◽  
Dlts Spectra

AbstractSubthreshold damage in p-type Si implanted and annealed at elevated temperature is characterized using deep level transient spectroscopy (DLTS) and transmission electron microscopy (TEM). P-type Si is implanted with Si, Ge and Sn with energies in the range of 4 to 8.5 MeV, doses from 7 × 1012to 1×1014cm−2and all annealed at 800°C for 15 min. For each implanted specie, DLTS spectra show a transition dose called threshold dose above which point defects transform in to extended defects. DLTS measurements have shown for the doses below threshold, a sharp peak, corresponding to the signature of point defects and for doses above threshold a broad peak indicating the presence of extended defects. This is found to be consistent with TEM analyses where no defects are seen for the doses below threshold and the presence of extended defects for the doses above threshold. This suggests a defect transformation regime where point defects present below threshold are acting like nucleating sites for the extended defects. Also the mass dependence on the damage evolution has been observed, where rod-like defects are observed in the case of Si and (rod-like defects and loops) for Ge and Sn despite the fact that peak concentration of vacancies for Ge and Sn are normalized to the peak number of vacancies for Si.

Ion Beam Induced Structural and Electrical Modifications in Crystalline and Amorphous Silicon

1993 ◽  
Vol 316 ◽  
Author(s):  
S. Coffa ◽  
A. Battaglia ◽  
F. Priolo
Keyword(s):  
Deep Level Transient Spectroscopy ◽  
Ion Irradiation ◽  
Deep Level ◽  
Ion Beam ◽  
Defect Structures ◽  
Transmission Electron ◽  
Defect Accumulation ◽  
Amorphous Si ◽  
Transient Spectroscopy

ABSTRACTThe mechanisms of defect accumulation and dynamic annealing in ion-implanted crystalline and amorphous Si are elucidated by performing conductivity and Raman spec-trascopy measurements in-situ during ion irradiation. In amorphous Si the entire gamut of defect structures has been characterized by analyzing the annealing kinetics from 77 K to ~ 800 K both during and after irradiation. Moreover the modifications in the electronic properties of crystalline Si produced by ion-irradiation have been investigated. The use of in-situ techniques in combination with transmission electron microscopy and deep-level transient spectroscopy allowed us to demonstrate the correlation between structural and electrical defects produced by ion-irradiation in Si.

Growth of Nickel Silicides on Silicon by Short Duration Incoherent Light Exposure

1983 ◽  
Vol 23 ◽  
Author(s):  
A. Nylandsted Larsen ◽  
J. Chevallier ◽  
G. Sørensen
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Short Duration ◽  
Rutherford Backscattering Spectrometry ◽  
Light Exposure ◽  
Xenon Lamp ◽  
Sheet Resistivity ◽  
Incoherent Light ◽  
Transmission Electron ◽  
Nickel Silicides

ABSTRACTShort duration, incoherent light from a xenon lamp has been used to grow nickel silicides on silicon single crystals from evaporated nickel films. The formation of these silicides was studied by Rutherford Backscattering Spectrometry, channeling, sheet resistivity, and transmission electron microscopy as function of induced temperature (550– 775°C), exposure time (8– 25 sec), and silicon orientation (>111<, >110<, and >100<). Epitaxial NiSi2 films were formed for temperatures above ˜675°C whereas polycrystalline NiSi films were formed below this temperature.

Deep Level Transient Spectroscopy Study Of High-Temperature Aluminum Implanted 6H-SiC

1996 ◽  
Vol 442 ◽  
Author(s):  
Yuri A. Stotski ◽  
Igor O. Usov ◽  
Alexander V. Suvorov
Keyword(s):  
High Temperature ◽  
Carrier Concentration ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Deep Levels ◽  
Epitaxial Layers ◽  
Spectroscopy Study ◽  
Four Levels ◽  
Transient Spectroscopy ◽  
The Relationship

AbstractDeep levels in 6H-SiC wafers implanted with Al+ ions at high-temperature were studied using current deep level transient spectroscopy (iDLTS). Aluminum was implanted at a temperature of 1800 °C with an energy of 40 keV and a dose of 2 × 1016 cm−2 into n-type epitaxial layers with different carrier concentration. Four levels were found, at Ec−0.12, Ec−0.13, Ec−1.06 and Ev+0.35 eV. It was established that modification of the carrier concentration in original ntype 6H-SiC epitaxial layers affects the deep levels concentration. The relationship between the thickness of the space charge region and the relative deep level concentration was considered.

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