Thermal Curing Conditions for Low K-Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI

1996 ◽  
Vol 443 ◽  
Author(s):  
Y.K. Lee ◽  
S.P. Murarka ◽  
B. Auman
Keyword(s):  
Isothermal Condition ◽  
Polyimide Film ◽  
Curing Temperature ◽  
Thermal Curing ◽  
Curing Conditions ◽  
Interlayer Dielectric ◽  
Fluorinated Polyimide ◽  
Two Stages ◽  
Low K ◽  
Temperature Time

AbstractThe thermal curing (imidization) of the polyimide film has been investigated using DSC and FTIR spectroscopy. The rate and the degree of imidization of the film was found to be dependent on curing temperature, time and thickness. The degree of imidization of the film rapidly increased between 200°C and 350°C and then remained constant for curing above 350°C, indicating that the imidization reaction is complete at 350°C. Also, it was found that imidization proceeds in two stages under isothermal condition, which was characterized by an initial fast imidization step that changes into a second, slower imidization process. The slower imidization rate at the second stage is discussed and explained. Higher degree of imidization was obtained with thicker films because of the higher retention of the solvent in the thicker film. Depolymerization process during thermal curing has also been studied with FTIR. The highest degree of the depolymerization is reached with thermal curing between 225 and 275°C.

Low Dielectric Constant Fluorinated Polyimides for Interlayer Dielectric Applications

1997 ◽  
Vol 476 ◽  
Author(s):  
John Pellerin ◽  
Robert Fox ◽  
Huei-Min Ho
Keyword(s):  
Dielectric Constant ◽  
Electrical Performance ◽  
Low Dielectric Constant ◽  
Interlayer Dielectric ◽  
Metal Structures ◽  
Single Level ◽  
Low Dielectric ◽  
Fluorinated Polyimide ◽  
Fluorinated Polyimides ◽  
Low K

AbstractThis paper presents the results of development, characterization and integration screening of low dielectric constant (low k) fluorinated polyimides for interlayer dielectric applications. Evolution of these materials has progressed with the intent of improving fundamental thin film properties, such as thermal stress behavior, modulus, CTE, and dielectric constant. Further refinements to fluorinated polyimides have been to improve their process compatibility and integration characteristics, primarily in the area of deep sub-micron gap filling. The avenues taken to attain these objectives will be illustrated.Subsequent integration of low k fluorinated polyimides has been achieved for a completed single-level metal BEOL test vehicle to highlight the impacts of the film's adhesion, mechanical and thermomechanical properties. In addition, the completed fluorinated polyimide single-level metal structures have been used to characterize electrical performance in contrast to single-level metal structures with TEOS dielectric. Intralevel capacitance and leakage current have been measured with dual comb and serpentine structures. Modeling has been applied to verify dielectric constant in submicron geometries from the capacitance measurements.

Synthesis and Characterization of Methyltriethoxysilane Based Low Permittivity (Low-k) Polymeric Dielectrics

2002 ◽  
Vol 716 ◽  
Author(s):  
Z. Gu ◽  
R. Jeyakumar ◽  
S. Sivoththaman ◽  
A. Nathan
Keyword(s):  
Dielectric Constant ◽  
Spin Coating ◽  
Base Material ◽  
Curing Temperature ◽  
Curing Conditions ◽  
Annealing Temperatures ◽  
Polymeric Dielectrics ◽  
Low Permittivity ◽  
Low K

AbstractA low-permittivity (low-k) polymeric material has been synthesized using methyltriethoxysilane as base material. The films were reproduceably deposited, by spin-coating on Si wafers with a uniform thickness in the range of 0.3-0.5μm depending on speed. The parameters for spin coating (spin speed and spin time etc.,) have been optimized. The effects of various curing conditions on the structural and dielectric properties have been studied. Fourier Transform Infrared Spectroscopy (FTIR) shows prominent peaks of Si-CH3 stretch and Si-O stretch modes. Test structures on silicon were fabricated to measure the dielectric constant (k) of the material. The values of k were found to be in the range of 2.6-1.2 for annealing temperatures 150°C-450°C. The dielectric constant decreases as the curing temperature increases.

Transient color changes in oxidative-stable fluorinated polyimide film for flexible display substrates

RSC Advances ◽  
2015 ◽  
Vol 5 (71) ◽  
pp. 57339-57345 ◽  
Author(s):  
Yooseong Yang ◽  
Youngsuk Jung ◽  
Myung Dong Cho ◽  
Seung Geol Lee ◽  
Soonchul Kwon
Keyword(s):  
Optical Properties ◽  
Polyimide Film ◽  
Flexible Display ◽  
Color Changes ◽  
Fluorinated Polyimide ◽  
Fluorinated Polyimides ◽  
Thermal Imidization ◽  
Yellow Index

Stable optical properties of high transmittance and low yellow index, which are required for a polyimide film as a flexible display substrate could be affected by thermal imidization even in oxidative-stable fluorinated polyimides.

Optimization of Curing Conditions and Nanofiller Incorporation for Production of High Performance Laminated Kevlar/Epoxy Nanocomposites

2018 ◽  
Author(s):  
Abdel-Hamid I. Mourad ◽  
Mouza S. Al Mansoori ◽  
Lamia A. Al Marzooqi ◽  
Farah A. Genena ◽  
Nizamudeen Cherupurakal
Keyword(s):  
Oil And Gas ◽  
Mechanical Performance ◽  
Thermo Gravimetric Analysis ◽  
Applied Pressure ◽  
Curing Temperature ◽  
Gravimetric Analysis ◽  
Epoxy Nanocomposites ◽  
Scanning Calorimetry ◽  
Curing Conditions ◽  
Weight Percentage

Kevlar composite materials are getting scientific interest in repairing of oil and gas pipelines in both offshore and onshore due to their unique properties. Curing is one of the major factor in deciding the final mechanical performance of laminated Kevlar/epoxy nanocomposites. The parameters such as curing time, temperature and applied pressure during the hot pressing will affect chemistry of crosslinking of the epoxy matrix and interaction of epoxy with the Kevlar fiber. The present study is carried out to evaluate the optimal curing conditions of the Kevlar/epoxy nanocomposites. Three different nanofillers (namely Multi walled Carbon nanotubes (MWCNT), Silicon Carbide (SiC) and Aluminum Oxide (Al2O3)) are incorporated in different weight percentage. Differential Scanning Calorimetry (DSC) and Thermo-Gravimetric Analysis (TGA) tests are carried out to determine the thermal stability and optimal curing conditions. Mechanical performance is investigated by conducting flexure, and drop weight tests. The results show that, the optimal curing temperature for maximizing the mechanical properties is at 170°C. Peeling off the Kevlar layers are observed for nanocomposite samples cured under 100°C. Mechanical strength of the composites is enhanced by optimizing the curing conditions and nanofiller contents.

scholarly journals The effect of curing conditions on the expansion efficiency of MgO expansion agent

2021 ◽  
Vol 233 ◽  
pp. 03047
Author(s):  
Yu Fang ◽  
Li Yongchao
Keyword(s):  
Curing Temperature ◽  
Obvious Effect ◽  
Curing Conditions ◽  
Factors Affecting ◽  
Temperature Conditions ◽  
Low Humidity ◽  
Humidity Environment

In order to further promote the research and application of MgO expansion agent in concrete field, this paper carried out the effect of different humidity and temperature conditions on the expansion properties of mortar and mortar specimens mixed with MgO expansion agent. In addition, the mechanism of the factors affecting the sensitivity of the MgO expansion agent is revealed by combining microscopic technology. The results show that the higher the curing temperature and the greater the curing humidity, the greater the expansion efficiency of the MgO expansion agent. The temperature of 20~40°C has no obvious effect on the efficiency of the MgO expansion agent, but the expansion value of the specimen doubles as the temperature rises to 40~80°C. Besides, the higher the curing humidity, the better the expansion efficiency of the MgO expansion agent, but the MgO expansion agent is more sensitive to the low humidity environment, and the specimen shrinks in the lower humidity environment (RH=60%).

The Effect of PMMA Thickness on Thermal Bone Necrosis around Acetabular Sockets

1994 ◽  
Vol 208 (1) ◽  
pp. 45-51 ◽  
Author(s):  
I C Revie ◽  
M E Wallace ◽  
J F Orr
Keyword(s):  
Layer Thickness ◽  
Hip Replacement ◽  
Curing Temperature ◽  
In Vitro Experiments ◽  
Bone Necrosis ◽  
Maximum Thickness ◽  
Cement Layer ◽  
Temperature Time

One aim of custom acetabular hip replacement sockets is to achieve fixation through a uniform cement layer of selected thickness. In vitro experiments demonstrate that curing temperatures are determined by cement thickness and position relative to the socket rim. A maximum thickness of 7 mm is indicated by interpretation of curing temperature-time relationships in terms of predicted bone necrosis. It is concluded that the results contribute to the establishment of an optimum cement layer thickness, but other factors require investigation to complement this work to gain further understanding of the problem.

Influence of Curing Temperature on Metakaolin-Based Geopolymers

2014 ◽  
Vol 775-776 ◽  
pp. 210-215
Author(s):  
Danúbia Lisbôa da Costa ◽  
Romualdo Rodrigues Menezes ◽  
Gelmires Araújo Neves ◽  
Sandro Marden Torres
Keyword(s):  
Room Temperature ◽  
Industrial Wastes ◽  
Curing Temperature ◽  
Inorganic Polymers ◽  
Flexural Test ◽  
X Ray Diffraction ◽  
Curing Conditions ◽  
X Ray ◽  
Natural Minerals ◽  
Application Potential

Geopolymers, also known as inorganic polymers, are aluminosilicates with cementing characteristics that have great application potential. They are produced by the alkaline activation of aluminosilicates precursors such as industrial wastes, calcined clays, natural minerals, among others and have their properties intimately associated to characteristics of the precursor materials and curing conditions. In this sense, this study aims to evaluate the mechanical behavior of geopolymers obtained from metakaolin according to the curing temperature. The geopolymerization was reached by the mixture of metakaolin with NaOH and the curing of the specimens was held at room temperature, 60°C and 100°C. The specimens were characterized by X-ray diffraction, mercury intrusion porosimetry, and SEM. The mechanical strength was determined by flexural test. The results show that the process of geopolymerization suffers a direct influence of the curing temperature used.

Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints

2000 ◽  
Author(s):  
Guoli Liu ◽  
Jianmin Qu ◽  
Laurence J. Jacobs
Keyword(s):  
Narrow Band ◽  
Harmonic Signal ◽  
Adhesive Joints ◽  
Nonlinear Parameter ◽  
Curing Temperature ◽  
Curing Time ◽  
Curing Conditions ◽  
Polymer Adhesive ◽  
Ultrasonic Techniques ◽  
Transmitted Signal

Abstract The objective of this paper is to characterize the cure state of polymer adhesive joints using nonlinear ultrasonic techniques. To this end, through transmission tests were carried out on joint samples that had been subjected to various curing conditions. In these tests, a 40-cycle harmonic signal was generated by a 2MHz narrow-band PZT transducer as the incident wave. The wave transmitted through the adhesive joint was received with a 4MHz narrow-band PZT transducer. The magnitude of the second order harmonics in the transmitted signal was measured and the corresponding nonlinear parameter β was calculated. A fairly good correlation was observed between the nonlinear parameter and the cure state. It was found that under-curing (lower curing temperature or short curing time) tends to increase the nonlinear parameter.

scholarly journals Fluorinated Polyimide-Film Based Temperature and Humidity Sensor Utilizing Fiber Bragg Grating

Sensors ◽  
2020 ◽  
Vol 20 (19) ◽  
pp. 5469
Author(s):  
Xiuxiu Xu ◽  
Mingming Luo ◽  
Jianfei Liu ◽  
Nannan Luan
Keyword(s):  
Fiber Bragg Grating ◽  
Humidity Sensor ◽  
Field Tests ◽  
Polyimide Film ◽  
Bragg Grating ◽  
Wavelength Shift ◽  
Sensing Applications ◽  
Fluorinated Polyimide ◽  
Temperature And Humidity ◽  
Fluoride Doping

We propose and demonstrate a temperature and humidity sensor based on a fluorinated polyimide film and fiber Bragg grating. Moisture-induced film expansion or contraction causes an extra strain, which is transferred to the fiber Bragg grating and leads to a humidity-dependent wavelength shift. The hydrophobic fluoride doping in the polyimide film helps to restrain its humidity hysteresis and provides a short moisture breathing time less than 2 min. Additionally, another cascaded fiber Bragg grating is used to exclude its thermal crosstalk, with a temperature accuracy of ±0.5 °C. Experimental monitoring over 9000 min revealed a considerable humidity accuracy better than ±3% relative humidity, due to the sensitized separate film-grating structure. The passive and electromagnetic immune sensor proved itself in field tests and could have sensing applications in the electro-sensitive storage of fuel, explosives, and chemicals.

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