Lateral grain growth in poly-Si films by gas flame high temperature annealing

1996 ◽  
Vol 441 ◽  
Author(s):  
W. F. Qu ◽  
A. Kitagawa ◽  
Y. Masaki ◽  
M. Suzuki
Keyword(s):  
High Temperature ◽  
Tensile Stress ◽  
Compressive Stress ◽  
Grain Growth ◽  
Strain Energy ◽  
Driving Forces ◽  
Stress Distributions ◽  
High Temperature Annealing ◽  
Gas Flame ◽  
Si Films

AbstractPoly-Si films with the preferential orientation to a random, a (100) and a (110) texture were annealed using a flat gas flame. Remarkable lateral grain growth of (111) grains was observed for poly-Si films with a random and a (110) texture, while in (100) texture films the growth of (100) grains predominated over other grains. There existed tensile stress in as-prepared films. Grains with different orientation were under a different tensile stresses, and such stress distributions on the orientation of grains were different for different textures. The tensile stress was found to become larger in grown grains after high temperature annealing, while the stress on shrunken grains decreased or turned to compressive stress after annealing. These results indicate that strain energy stored in grains is one of the important driving forces in secondary grain growth.

Instabilities and Point Defects at Step-Free Si(001) and (111) Terraces During High Temperature Annealing

1999 ◽  
Vol 587 ◽  
Author(s):  
Doohan Lee ◽  
Jack M. Blakely
Keyword(s):  
High Temperature ◽  
Point Defect ◽  
Point Defects ◽  
Strain Energy ◽  
Annealing Temperature ◽  
Small Islands ◽  
High Temperature Annealing ◽  
Atomic Steps ◽  
The Stability

AbstractIn this paper we describe observations on the stability of extremely large Si(001) and (111) terraces that are formed by a technique described previously. Following annealing at high temperature and quenching, a series of concentric pits of monoatomic depth are observed with spacing between successive pits of the order of several microns; pits do not form on (111) until the terraces get extremely large. The occurrence of small islands or small pits on the terraces of quenched samples gives information on the majority point defect at the annealing temperature. On (001) samples that are slowly cooled from the annealing temperature, it is observed that pairs of atomic steps have formed on the large terrace; we believe that these result from the tendency of the surface to minimize the strain energy associated with the (2 × 1) reconstruction.

Computer Simulation of Strain Energy and Surface- and Interface-Energy on Grain Growth in Thin Films

1994 ◽  
Vol 343 ◽  
Author(s):  
R. Carel ◽  
C. V. Thompson ◽  
H. J. Frost
Keyword(s):  
Thin Films ◽  
Grain Growth ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Driving Forces ◽  
Interface Energy ◽  
Orientation Dependence ◽  
Surface And Interface ◽  
Elastic Regime ◽  
Strained Films

ABSTRACTWe have simulated strain energy effects and surface- and interface-energy effects on grain growth in thin films, using properties of polycrystalline Ag (p-Ag) on single crystal (001) Ni on (001) MgO for comparison with experiments. Surface- and interface-energy and strain energy reduction drive the growth of grains of specific crystallographic orientations. The texture that will result when grain growth has occurred minimizes the sum of these driving forces. In the elastic regime, strain energy density differences result from the orientation dependence of the elastic constants of the biaxially strained films. In the plastic regime, strain energy also depends on grain diameter and film thickness. In p-Ag/(001) Ni, surface- and interface-energy minimization favors Ag grains with (11) texture. In the absence of a grain growth stagnation, the texture at later times is always (111). However, for high enough strains and large enough thicknesses, the strain energy driving force can favor a (001) texture at early times, which reverts to a (111) texture at later times, once the grains have yielded.

Carbon concentration dependent grain growth of Cu2ZnSnS4 thin films

RSC Advances ◽  
2015 ◽  
Vol 5 (26) ◽  
pp. 20178-20185 ◽  
Author(s):  
Vincent Tiing Tiong ◽  
Yi Zhang ◽  
John Bell ◽  
Hongxia Wang
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Grain Growth ◽  
Carbon Concentration ◽  
High Temperature Annealing ◽  
Czts Nanocrystals

Influence of carbon on the grain growth of CZTS nanocrystals during high temperature annealing.

scholarly journals Effect of in situ stress on grain growth and texture evolution in sputtered YSZ/Si films

RSC Advances ◽  
2017 ◽  
Vol 7 (29) ◽  
pp. 17832-17840 ◽  
Author(s):  
Amiya Banerjee ◽  
K. V. L. V. Narayanachari ◽  
Srinivasan Raghavan
Keyword(s):  
Compressive Stress ◽  
Grain Growth ◽  
Tensile Strain ◽  
Texture Evolution ◽  
In Situ Stress ◽  
Si Films

Annealing leads to grain growth and associated tensile strain in YSZ film, so initial compressive stress helps to grow larger grains.

Effects of Web Height-Thickness Ratio on Longitudinal Residual Stresses of the Welded Monosymmetric I-Section

2013 ◽  
Vol 671-674 ◽  
pp. 446-449
Author(s):  
Zhuang Nan Zhang ◽  
Ya Nan Zhao ◽  
Lu Jin
Keyword(s):  
Tensile Stress ◽  
Compressive Stress ◽  
Thickness Ratio ◽  
Residual Compressive Stress ◽  
Residual Tensile Stress ◽  
Stress Distributions ◽  
Distribution Width ◽  
Longitudinal Residual Stress ◽  
Increasing Trends ◽  
Peak Value

This paper descries work carried out using ANSYS finite element techniques to evaluate the longitudinal residual stress distributions of the welded monosymmetric I-section in various web height-thickness ratios. From the analysis results, it is shown that, with the web height to thickness ratio increased, the peak values of residual tensile and compressive stress in flange decrease, and the peak residual tensile stress in web decrease too, but the peak residual compressive stress increase. Meanwhile, the distribution width of residual tensile stress in flange and the distribution width of residual compressive stress in web all present increasing trends. The magnitude of the maximum longitudinal residual tensile stresses in both the flange and web reach the yield stress fy, while the maximum residual compressive stress in wide and narrow flange is close to 0.4 fy and 0.3 fy respectively, and the peak value of compressive stress in web which closes to the wide flange and to the narrow flange is about 0.4fy and 0.3fy separately. With the change of height to thickness ratio of web, the distributive width of residual tensile stress in flange or web is about 0.3 times of flange width or web height.

Heating Steady Thermal Stress in a Composite EFBF Plate Made of Ceramic/FGM/Metal Considered Temperature Dependency

2009 ◽  
Vol 417-418 ◽  
pp. 537-540 ◽  
Author(s):  
Yang Jian Xu ◽  
Dai Hui Tu
Keyword(s):  
Thermal Stress ◽  
Tensile Stress ◽  
Compressive Stress ◽  
Composite Plate ◽  
Maximum Tensile Stress ◽  
Metal Composite ◽  
Temperature Dependency ◽  
Stress Distributions ◽  
Maximum Compressive Stress ◽  
Layered Ceramic

A NFE model is constructed to analyze the heating steady thermal stress in a ceramic/FGM/metal composite EFBF plate considered temperature dependency. From numerical calculation, when T0=Ta=300K and Tb=1 000K, the stress distributions in the plate were obtained. The results are as follows. With the increase of the FGM thickness, the stress distribution is more reasonable, and the largest tensile stress reduces by 45.64%. With the increase of M, the stress change increases obviously, and the compressive stress on the surface of ceramics reduces by 56.0%. Compared with A=0, the compressive stress of A=3.99 on the surface of metal increases by 94.2%, and the stress on the surface of ceramics changes from compressive stress to tensile stress. When T0=300K, Ta=700K, compared with Tb=1 050K, when Tb=1 800K, the compressive stress on the surface of metal increases 13.62 times, and the maximum compressive stress on the surface of ceramics increases 5.22 times. Compared with the two-layered ceramic/metal composite plate, the stress of ceramic/FGM/metal composite EFBF plate is very gentle, and the maximum tensile stress reduces by 44.2%. Compared with constant material properties, the maximum compressive stress on the surface of metal considered temperature dependency reduces by 59.1%. The results provide the foundations of theoretical calculation for the design and application of the composite plate.

Improvement of the oxidation resistance of TiC-coated carbon black by high-temperature annealing in N2

RSC Advances ◽  
2016 ◽  
Vol 6 (30) ◽  
pp. 25601-25604
Author(s):  
Jianke Ye ◽  
Ke Bao ◽  
Yan Wen ◽  
Jiangtao Li
Keyword(s):  
Solid Solution ◽  
High Temperature ◽  
Carbon Black ◽  
Grain Growth ◽  
Oxidation Resistance ◽  
Carbon Oxidation ◽  
High Temperature Annealing ◽  
Coated Carbon

The annealing of TiC-coated carbon black in N2 at 1000–1300 °C resulted in formation of a TiCxNy solid solution and grain growth, which significantly increased the commencement and completion temperatures of carbon oxidation.

Pinning effect of Y2O3 network on copper grain growth during high temperature annealing

2018 ◽  
Vol 5 (5) ◽  
pp. 056520
Author(s):  
Fei Huang ◽  
Hang Wang ◽  
Bin Yang ◽  
Tao Liao ◽  
Zhaoyang Wang
Keyword(s):  
High Temperature ◽  
Grain Growth ◽  
High Temperature Annealing ◽  
Pinning Effect
Sign in / Sign up

Export Citation Format

Share Document