The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu Lines

1996 ◽  
Vol 428 ◽  
Author(s):  
A. Witvrouw ◽  
P. Flinn ◽  
K. Maex
Keyword(s):  
Stress Relaxation ◽  
Temperature Dependence ◽  
Room Temperature ◽  
Relaxation Behavior ◽  
Storage Test ◽  
Stress Relaxation Behavior ◽  
Passivation Film ◽  
Parallel Lines ◽  
Curvature Measurements ◽  
Substrate Curvature

Abstract800 nm thick and 1 jim wide Al-lwt.%Si-0.5wt.% Cu parallel lines with I μm spacing were passivated with PECVD oxide, oxynitride or nitride. Substrate curvature measurements as a function of temperature and XRD-measurements at room temperature were used to characterize macroscopic samples of these parallel Al-Si-Cu-lines. By using both techniques the average inplane stresses for the Al-Si-Cu lines as well as for the covering passivation material can be determined as a function of temperature. The highest and lowest stresses in the Al-Si-Cu are observed for lines with nitride and oxide passivations, respectively. Also the number of voids in the lines after a storage test at 250 °C is clearly highest for a nitride passivation and lowest for an oxide passivation.The stress in the passivation itself and its temperature dependence is found to be very different from the stress in a blanket passivation film.

The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu Lines

1996 ◽  
Vol 436 ◽  
Author(s):  
A. Witvrouw ◽  
P. Flinn ◽  
K. Maex
Keyword(s):  
Stress Relaxation ◽  
Temperature Dependence ◽  
Room Temperature ◽  
Relaxation Behavior ◽  
Storage Test ◽  
Stress Relaxation Behavior ◽  
Passivation Film ◽  
Parallel Lines ◽  
Curvature Measurements ◽  
Substrate Curvature

Abstract800 nm thick and 1μm wide Al-1wt.%Si-0.5wt.% Cu parallel lines with 1 μm spacing were passivated with PECVD oxide, oxynitride or nitride. Substrate curvature measurements as a function of temperature and XRD-measurements at room temperature were used to characterize macroscopic samples of these parallel Al-Si-Cu-lines. By using both techniques the average inplane stresses for the Al-Si-Cu lines as well as for the covering passivation material can be determined as a function of temperature. The highest and lowest stresses in the Al-Si-Cu are observed for lines with nitride and oxide passivations, respectively. Also the number of voids in the lines after a storage test at 250 °C is clearly highest for a nitride passivation and lowest for an oxide passivation.The stress in the passivation itself and its temperature dependence is found to be very different from the stress in a blanket passivation film.

STRESS RELAXATION BEHAVIOR OF IRRADIATED COPPER IN THE TEMPERATURE RANGE 150–300 K

2009 ◽  
Vol 23 (04) ◽  
pp. 655-660
Author(s):  
I. M. GHAURI ◽  
NAVEED AFZAL ◽  
NAWAZ MUHAMMAD ◽  
SAJJAD AHMED
Keyword(s):  
Electron Beam ◽  
Stress Relaxation ◽  
Relaxation Rate ◽  
Room Temperature ◽  
Testing Machine ◽  
Relaxation Behavior ◽  
Stress Relaxation Behavior ◽  
Temperature Range ◽  
Universal Testing ◽  
Dislocation Defects

The present study reports the stress relaxation behavior of irradiated polycrystalline 5N copper deformed in the temperature range 150 to 300 K. The wire specimens were exposed to an 18 MeV electron beam at room temperature and stress relaxation tests of the specimens were carried out during the tensile test, using universal testing machine between 150 to 300 K. Stress relaxation rate of the specimens was found to decrease with the decrease of test temperature. The decrease of the stress relaxation rate with temperature in irradiated specimens is attributed to the dislocation-defects interaction, which is more pronounced at low temperature due to the reduction in available thermal energy necessary for the relaxation of dislocations.

Effects of accelerator type on stress relaxation behavior and network structure of aged natural rubber/chloroprene rubber vulcanizates

2016 ◽  
Vol 49 (5) ◽  
pp. 381-396 ◽  
Author(s):  
Farzad A Nobari Azar ◽  
Murat Şen
Keyword(s):  
Stress Relaxation ◽  
Natural Rubber ◽  
Network Structure ◽  
Structural Changes ◽  
Relaxation Behavior ◽  
Stress Relaxation Behavior ◽  
Rubber Blends ◽  
Chloroprene Rubber ◽  
Weather Changes ◽  
Behavior Network

Natural rubber/chloroprene rubber (NR/CR) blends are among the commonly used rubber blends in industry and continuously are exposed to severe weather changes. To investigate the effects of accelerator type on the network structure and stress relaxation of unaged and aged NR/CE vulcanizates, tetramethyl thiuram disulfide, 2-mercaptobenzothiazole, and diphenyl guanidine accelerators have been chosen to represent fast, moderate, and slow accelerator groups, respectively. Three batches have been prepared with exactly the same components and mixing conditions differing only in accelerator type. Temperatures scanning stress relaxation and pulse nuclear magnetic resonance techniques have been used to reveal the structural changes of differently accelerated rubber blends before and after weathering. Nonoxidative thermal decomposition analyses have been carried out using a thermogravimetric analyzer. Results indicate that there is a strong interdependence between accelerator type and stress relaxation behavior, network structure, cross-linking density, and aging behavior of the blends. Accelerator type also affects decomposition energy of the blends.

scholarly journals Stress-relaxation behavior in gels with ionic and covalent crosslinks

2010 ◽  
Vol 107 (6) ◽  
pp. 063509 ◽  
Author(s):  
Xuanhe Zhao ◽  
Nathaniel Huebsch ◽  
David J. Mooney ◽  
Zhigang Suo
Keyword(s):  
Stress Relaxation ◽  
Relaxation Behavior ◽  
Stress Relaxation Behavior ◽  
Covalent Crosslinks
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