An Amorphous Silicon Thin Film Transistor Fabricated at 125°C by dc Reactive Magnetron Sputtering

1996 ◽  
Vol 424 ◽  
Author(s):  
C. S. McCormick ◽  
C. E. Webe ◽  
J. R. Abelson

AbstractWe deposit hydrogenated amorphous silicon-based thin film transistors using dc reactive magnetron sputtering at a substrate temperature of 125°C, which is low enough to allow the use of plastic substrates. We characterize the structural properties of the a-Si:H channel and a-SiNx:H dielectric layers using infra-red absorption, thermal hydrogen evolution, and refractive index measurements, and evaluate the electrical quality using capacitance-voltage and leakage current measurements. Inverted staggered thin film transistors made with these layers exhibit a field effect mobility of 0.3 cm2/V-s, a Ion/Ioff ratio of 5 × 105, a sub-threshold slope of 0.8 V/decade, and a threshold voltage of 3 V.

1993 ◽  
Vol 297 ◽  
Author(s):  
Byung Chul Ahn ◽  
Jeong Hyun Kim ◽  
Dong Gil Kim ◽  
Byeong Yeon Moon ◽  
Kwang Nam Kim ◽  
...  

The hydrogenation effect was studied in the fabrication of amorphous silicon thin film transistor using APCVD technique. The inverse staggered type a-Si TFTs were fabricated with the deposited a-Si and SiO2 films by the atmospheric pressure (AP) CVD. The field effect mobility of the fabricated a-Si TFT is 0.79 cm2/Vs and threshold voltage is 5.4V after post hydrogenation. These results can be applied to make low cost a-Si TFT array using an in-line APCVD system.


2013 ◽  
Vol 770 ◽  
pp. 173-176 ◽  
Author(s):  
Suree Tongwanichniyom ◽  
Wichian Siriprom ◽  
Dhonluck Manop ◽  
Adisorn Buranawong ◽  
Jakrapong Kaewkhao ◽  
...  

Titanium dioxide (TiO2) thin films have been deposited on Si-wafer and glass slide by DC reactive magnetron sputtering technique at different O2 gas flow rates. The crystal structure was characterized by grazing-incidence X-ray diffraction (GIXRD), surface morphology was analyzed by atomic force microscopy (AFM) and disinfection of surfaces by photo catalytic oxidation with TiO2 and UV light irradiation. The results showed that, from GIXRD results, all as-deposited TiO2 films have crystal structure of TiO2 corresponding to the A(101) and A(200). AFM results showed that the film thicknesses increase from 183 nm to 238 nm with increasing of O2 gas flow rate, while the film roughness was in range of 4.8 nm to 5.9 nm. The as-deposited anatase TiO2 thin film in this work can kill the bacteria when expose to the UV light.


Sign in / Sign up

Export Citation Format

Share Document