Ecr Etching of GaP, GaAs, InP, and InGaAs in Cl2/Ar, Cl2/N2, BCl3/Ar, and BCl3/N2

1996 ◽  
Vol 421 ◽  
Author(s):  
R. J. Shul ◽  
A. G. Baca ◽  
D. J. Rieger ◽  
H. Hou ◽  
S. J. Pearton ◽  
...  
Keyword(s):  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Plasma Chemistry ◽  
Electron Cyclotron ◽  
Wide Range ◽  
Etch Rates

AbstractElectron cyclotron resonance (ECR) etching of GaP, GaAs, InP, and InGaAs are reported as a function of percent chlorine-containing gas for Cl2/Ar, Cl2/N2, BCl3/Ar, and BCl3/N2 plasma chemistries. GaAs and GaP etch rates were faster than InP and InGaAs, independent of plasma chemistry due to the low volatility of the InClx, etch products. GaAs and GaP etch rates increased as %Cl2 was increased for Cl2/Ar and Cl2/N2 plasmas. The GaAs and GaP etch rates were much slower in BCl3-based plasmas due to lower concentrations of reactive Cl, however enhanced etch rates were observed in BCl3/N2 at 75% BCl3. Smooth etched surfaces were obtained over a wide range of plasma chemistries.

Patterning of LiGaO2 and LiAlO2 by Wet and Dry Etching

1996 ◽  
Vol 449 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
R. G. Wilson ◽  
B. L. Chai ◽  
...  
Keyword(s):  
Cyclotron Resonance ◽  
High Selectivity ◽  
Electron Cyclotron Resonance ◽  
Dry Etching ◽  
Electron Cyclotron ◽  
Acid Solutions ◽  
Lattice Constants ◽  
Etch Rates ◽  
Dry Etch

ABSTRACTLiGaO2 and LiAlO2 have similar lattice constants to GaN, and may prove useful as substrates for III-nitride epitaxy. We have found that these materials may be wet chemically etched in a number of acid solutions, including HF, at rates between 150–40,000 Å/min. Dry etching with SF6/Ar plasmas provides faster rates than Cl2/Ar or CH4/H2/Ar under Electron Cyclotron Resonance conditions, indicating the fluoride etch products are more volatile that their chloride or metalorganic/hydride counterparts. Dry etch rates are low ( < 2, 000 Å/min), providing high selectivity (>5) over the nitrides. The incorporation of hydrogen in these materials is also of interest because this could provide a reservoir of hydrogen that may passivate dopants in overlying nitride films. In 2H implanted samples, 50 % of the deuterium is lost by evolution from the surface by annealing at 400 °C for 20 min and all of the deuterium is gone at 700°C. The diffusivity of 2H is ∼10-13 cm2/s at 250°C in LiA1O2, approximately two orders of magnitude higher than in LiGaO2.

Dry Etching of SiC for Advanced Device Applications

1996 ◽  
Vol 421 ◽  
Author(s):  
J. R. Flemish ◽  
K. Xie ◽  
G. F. Mclane
Keyword(s):  
Silicon Carbide ◽  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Dry Etching ◽  
Electron Cyclotron ◽  
Alternative Methods ◽  
Free Surfaces ◽  
Wide Availability ◽  
Device Applications ◽  
Etch Rates

AbstractIn this paper we review and compare most of the published results on dry etching of silicon carbide using various techniques. The vast majority of reports have used RIE methods due to the wide availability of such reactors. Recently, alternative methods of magnetron enhanced RIE (MIE) and electron cyclotron resonance (ECR) plasmas have been demonstrated. MIE has resulted in extremely high etch rates and ECR etching has resulted in smooth, residue-free surfaces with an ability to control the etched profiles.

scholarly journals Plasma Chemistry Dependent ECR Etching of GaN

1995 ◽  
Vol 395 ◽  
Author(s):  
R. J. Shul ◽  
C. I. H. Ashby ◽  
D. J. Rieger ◽  
A. J. Howard ◽  
S. J. Pearton ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Plasma Chemistry ◽  
Auger Spectroscopy ◽  
Near Surface ◽  
Force Microscopy ◽  
Atomic Force ◽  
Opposite Trend ◽  
Etch Rates

ABSTRACTElectron cyclotron resonance (ECR) etching of GaN in Cl2/H2/Ar, Cl2/SF6/Ar, BCl3/H2Ar and BCl3/SF6/Ar plasmas is reported as a function of percent H2 and SF6. GaN etch rates were found to be 2 to 3 times greater in Cl2/H2/Ar discharges than in BCl3/H2/Ar discharges independent of the H2 concentration. In both discharges, the etch rates decreased as the H2 concentration increased above 10%. When SF6 was substituted for H2, the GaN etch rates in BCl3-based plasmas were greater than those for the Cl2-based discharges as the SF6 concentration increased. GaN etch rates were greater in Cl2/H2/Ar discharges as compared to Cl2/SF6/Ar discharges whereas the opposite trend was observed for BCl3,-based discharges. Variations in surface morphology and near-surface stoichiometry due to plasma chemistries were also investigated using atomic force microscopy and Auger spectroscopy, respectively.

Silicon-Carbon Alloys Synthesized by Electron Cyclotron Resonance Chemical Vapor Deposition

2000 ◽  
Vol 609 ◽  
Author(s):  
Mark B. Moran ◽  
Linda F. Johnson
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Chemical Vapor ◽  
Electron Cyclotron ◽  
Absorption Bands ◽  
Temperature Plasma ◽  
Silicon Carbon ◽  
Wide Range

ABSTRACTSilicon-carbon alloys were deposited by electron cyclotron resonance chemical vapor deposition (ECR-CVD) using either halogenated or non-halogenated precursors for the Si and C sources. Halogenated precursors were chosen for initial experiments to try to reduce the H content and to improve the microstructure of the silicon carbide (SiCx) films. While a wide range of compositions has been deposited using the halogenated precursors, only a limited range has been deposited so far with the non-halogenated precursors. Electron spectroscopy for chemical analysis (ESCA) and Fourier transform infrared (FTIR) spectroscopy show that compositions ranging from near-stoichiometric SiCx to extremely C-rich can be deposited by controlling the deposition temperature, plasma power and C/Si ratio of the halogenated precursors. At the highest C/Si-precursor ratio, the deposited film is electrically conductive with a measured resistivity of 0.067ω-cm, contains only 3-atomic-percent Si and should be considered a Si-doped carbon (C:Si) film. The excellent transparency, especially that of the C:Si films, allowed the assignment of FTIR absorption bands that are usually masked by graphitic inclusions and other impurities. A weak absorption band at 1180cm−1 was found to correlate with the electrical conductivity of the films and was attributed to the asymmetric “bond-and-a-half” Si=C stretch in a Si=C=C functional group where the pi electrons are distributed equally between the three atoms. Additional results show etching of the substrate by reactive Cl from the halogenated precursors can have a dramatic effect on the microstructure, porosity and moisture stability of the films. For experiments involving halogenated precursors, the C:Si films are much more stable than the near-stoichiometric SiCx because C:Si is deposited at lower plasma powers that do not etch the Si substrate. Finally, preliminary results show that near-stoichiometric SiCx films deposited using non-halogenated precursors are much more stable with respect to moisture incorporation than those deposited with halogenated precursors.

Anisotropic electron cyclotron resonance etching of tungsten films on GaAs

1994 ◽  
Vol 30 (1) ◽  
pp. 84-85 ◽  
Author(s):  
R.J. Shul ◽  
D.J. Rieger ◽  
C. Constantine ◽  
A.G. Baca ◽  
C. Barratt
Keyword(s):  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Electron Cyclotron
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