X-Ray Residual Stress Measurement in Films with Crystallographic Texture and Grain Shape

1995 ◽  
Vol 403 ◽  
Author(s):  
L. G. Yu ◽  
B. C. Hendrix ◽  
K. W. Xu ◽  
J. W. He ◽  
H. C. Gu

AbstractX-ray diffraction provides an easy and powerful method for measuring residual stress in thin films. However, nonlinearity of the d vs. sin2ψ relation can lead to the misinterpretation of results, especially when one of the measurements is made at low values of ψ relation for different combinations of ideal crystallographic textures and grain shapes are given. In all cases, a high ψ angle range exists where the d vs. sin2ψ relation in the low ψ angle range.

1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.


2009 ◽  
Vol 2009.46 (0) ◽  
pp. 385-386
Author(s):  
Koji Hattori ◽  
Mitsuyoshi Nakatani ◽  
Tomoki Takehashi ◽  
Masamitsu Abe ◽  
Toshihiko Sasaki

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