Dynamic Behavior of Nano Second Pulsed Nd:Glass Laser Annealing in Ion Implanted Silicon

1981 ◽  
Vol 4 ◽  
Author(s):  
M. Takai ◽  
Y. Sato ◽  
K. Murakami ◽  
K. Gamo ◽  
T. Minamisono ◽  
...  
Keyword(s):  
Light Intensity ◽  
Dynamic Behavior ◽  
Laser Annealing ◽  
Laser Energy ◽  
Transmitted Light ◽  
Time Resolved ◽  
Dynamic Behaviors ◽  
Transient Measurements ◽  
Nd:Glass Laser ◽  
Ion Implanted

ABSTRACTTime resolved transmission (λ = 1060 nm) and reflectivity (λ = 632.8 nm) during 20 nsec Nd:glass laser annealing in ion implanted Si were measured to study dynamic behaviors of laser annealing. Transmitted laser energy was also measured to complement transient measurements. Transient transmitted light intensity was found to be almost completely quenched as would be expected from absorption by a molten Si layer.

Dynamic behaviors of pulsed-laser annealing in ion-implanted silicon studied by measuring the optical reflectance

1979 ◽  
Author(s):  
Kouichi Murakami ◽  
Kenji Gamo ◽  
Susumu Namba ◽  
Mitsuo Kawabe ◽  
Yoshinobu Aoyagi ◽  
...  
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Optical Reflectance ◽  
Dynamic Behaviors ◽  
Pulsed Laser Annealing ◽  
Ion Implanted

Photoluminescence of Pulsed Ruby Laser Annealed Crystalline and Ion Implanted GaAs

1981 ◽  
Vol 4 ◽  
Author(s):  
Douglas H. Lowndes ◽  
Bernard J. Feldman
Keyword(s):  
Radiative Recombination ◽  
Laser Annealing ◽  
Laser Energy ◽  
Pulsed Laser ◽  
High Dose ◽  
Pulsed Laser Annealing ◽  
Recombination Centers ◽  
Pl Intensity ◽  
P Type ◽  
Ion Implanted

ABSTRACTIn an effort to understand the origin of defects earlier found to be present in p–n junctions formed by pulsed laser annealing (PLA) of ion implanted (II) semiconducting GaAs, photoluminescence (PL) studies have been carried out. PL spectra have been obtained at 4K, 77K and 300K, for both n–and p–type GaAs, for laser energy densities 0 ≤ El ≤ 0.6 J/cm2. It is found that PLA of crystalline (c−) GaAs alters the PL spectrum and decreases the PL intensity, corresponding to an increase in density of non-radiative recombination centers with increasing El. The variation of PL intensity with El is found to be different for n– and p–type material. No PL is observed from high dose (1 or 5×1015 ions/cm2 ) Sior Zn-implanted GaAs, either before or after laser annealing. The results suggest that the ion implantation step is primarily responsible for formation of defects associated with the loss of radiative recombination, with pulsed annealing contributing only secondarily.

Discharge-Pumped VUV F2 Molecular Laser Annealing of Heavily Se+-Implanted GaAs

1993 ◽  
Vol 316 ◽  
Author(s):  
Hajime Shibata ◽  
Yunosuke Makita ◽  
Kawakatsu Yamada ◽  
Yutaka Uchida ◽  
Sabro Satoh
Keyword(s):  
Energy Density ◽  
Raman Scattering ◽  
Laser Annealing ◽  
Laser Energy ◽  
Laser Energy Density ◽  
Furnace Annealing ◽  
Implantation Energy ◽  
Molecular Laser ◽  
First Time ◽  
Ion Implanted

ABSTRACTThe capability of discharge-pumped vacuum ultraviolet F2 molecular laser for laser annealing of heavily ion implanted semiconductor was demonstrated for the first time using Se+ heavily ion implanted GaAs. Cr-doped semi-insulationg GaAs wafers were used as the substrates, and the Se+ implantation energy and dose were controlled to 100 keV and 1× 1015 cm-2, respectively. Samples were annealed using a F2 molecular laser ( wavelength = 157 nm ) with a single pulse ( width ~ 20 ns ) in the energy density range from 200 to 800 mJ/cm2 in a nitrogen atmosphere. In addition, furnace annealing was done on separate samples at 850 ºC for 20 minutes in a purified hydrogen atmosphere for comparison. Characterization of the samples was carried out using Raman scattering and ellipsometry. The laser annealed samples exhibited intense Raman scattering LO phonon peaks whose intensity increased with increasing laser power density, whereas the furnace annealed samples exhibited a very weak LO phonon peak. It was demonstrated for the first time that VUV photons can be very effective in annealing ion implantation damage as compared with conventional furnace annealing. The behavior of Raman scattering spectra as a function of laser energy density was explained quantitatively by a “spatial correlation” model. The model made it possible to estimate the average size of the recovered crystal regions in samples for any given laser energy density.

scholarly journals Time‐resolved reflectivity of ion‐implanted silicon during laser annealing

1978 ◽  
Vol 33 (5) ◽  
pp. 437-440 ◽  
Author(s):  
D. H. Auston ◽  
C. M. Surko ◽  
T. N. C. Venkatesan ◽  
R. E. Slusher ◽  
J. A. Golovchenko
Keyword(s):  
Laser Annealing ◽  
Time Resolved ◽  
Ion Implanted

Time-resolved optical studies of oxide-encapsulated silicon during pulsed laser melting

1988 ◽  
Vol 3 (3) ◽  
pp. 498-505 ◽  
Author(s):  
G. E. Jellison ◽  
D. H. Lowndes ◽  
J. W. Sharp
Keyword(s):  
Laser Annealing ◽  
Laser Energy ◽  
Threshold Energy ◽  
Pulsed Laser ◽  
Silicon Layer ◽  
Oxide Thickness ◽  
Time Resolved ◽  
Model Calculations ◽  
Near Surface ◽  
Surface Profiling

Nanosecond time-resolved reflectivity and ellipsometry experiments have been performed on (100) Si wafers encapsulated by 5.5–76.2 nm thick thermal oxides, using pulsed KrF (248 nm) laser energy densities sufficient to melt the Si beneath the oxide. Post-irradiation nulling ellipsometry, optical microphotography, and surface profiling measurements were carried out. It was found that the threshold energy density required to melt the Si varies with oxide thickness; this is explained primarily by the reflective properties of the oxide overlayer. The time-resolved reflectivity and ellipsometry measurements show that rippling of the SiO2 layer occurs on the 20–40 ns timescale and results in a decrease in specular reflectivity of the rippled silicon surface beneath. Optical model calculations suggest that pulsed laser annealing through a thick oxide layer results in a damaged near-surface silicon layer (∼ 30 nm thick); this layer contains defects that are probably responsible for the degraded performance of devices.

Calculations Pertaining to Raman Scattering During Laser Annealing of Ion-Implanted Silicon

1981 ◽  
Vol 4 ◽  
Author(s):  
R. F. Wood ◽  
D. H. Lowndes ◽  
G. E. Giles
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Rapid Onset ◽  
Simultaneous Occurrence ◽  
Raman Signal ◽  
Molten Silicon ◽  
Time Resolved ◽  
Pulsed Laser Annealing ◽  
Anti Stokes ◽  
Ion Implanted

ABSTRACTCompaan and co-workers have reported the results of time-resolved optical experiments on ion-implanted silicon which they claim prove the melting model of pulsed laser annealing cannot be correct. These results concern the rapid onset of a Raman signal after a heating laser pulse, the simultaneous occurrence of a Raman signal and the high reflectivity phase characteristic of molten silicon, and the lattice temperature measured by the Raman Stokes/anti-Stokes intensity ratio. In this paper, we show by detailed numerical calculations with the melting model that there is, in fact, excellent agreement between the results of the calculations and the experimental results reported by Compaan and co-workers.

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