scholarly journals Silica Aerogel: An Intrinsically Low Dielectric Constant Material

1995 ◽  
Vol 381 ◽  
Author(s):  
Lawrence W. Hrubesh
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Solid Material ◽  
Dielectric Strength ◽  
Silica Aerogels ◽  
Dielectric Constants ◽  
Porous Solids ◽  
Direct Result ◽  
Low Dielectric ◽  
Normal Transport

AbstractSilica aerogels are highly porous solids having unique morphologies in which both the pores and particles have sizes less than the wavelength of visible light. This fine nanostructure modifies the normal transport mechanisms within aerogels and endows them with a variety of exceptional physical properties. For example, aerogels have the lowest measured thermal conductivity and dielectric constant for any solid material. The intrinsically low dielectric properties of silica aerogels are the direct result of the extremely high achievable porosities, which are controllable over a range from 75% to more than 99.8%, and which result in measured dielectric constants from 2.0 to less than 1.01. This paper discusses the synthesis of silica aerogels, processing them as thin films, and characterizing their dielectric properties. Existing data and other physical characteristics of bulk aerogels (e.g., thermal stablity, thermal expansion, moisture adsorption, modulus, dielectric strength, etc.), which are useful for evaluating them as potential dielectrics for microelectronics, are also given.

Dielectric properties of aerogels

1993 ◽  
Vol 8 (7) ◽  
pp. 1736-1741 ◽  
Author(s):  
L.W. Hrubesh ◽  
L.E. Keene ◽  
V.R. Latorre
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Bulk Material ◽  
Solid Material ◽  
Adsorbed Water ◽  
Dielectric Behavior ◽  
Dielectric Constants ◽  
High Porosity ◽  
Microwave Frequencies ◽  
Low Dielectric

We have measured the real (dielectric constant) and imaginary (loss factor) components of the complex relative permittivity at 298 K using microwave frequencies (2, 10, and 18–40 GHz) for bulk SiO2-aerogels and for two types of organic aerogels, resorcinol-formaldehyde (RF) and melamine-formaldehyde (MF). Measured dielectric constants are found to vary linearly between values of 1.0 and 2.0 for aerogel densities from 10 to 500 kg/m3. For the same range of densities, the measured loss tangents vary linearly between values of 2 × 10−4 and 7 × 10−2. The observed linearity of the dielectric properties with density in aerogels at microwave frequencies shows that their dielectric behavior is more gas-like than solid-like. The dielectric properties of aerogels are shown to be significantly affected by the adsorbed water internal to the bulk material. For example, water accounts for 70% of the dielectric constant and 70% of the loss at microwave frequencies for silica aerogels. Because of their very high porosity, even with the water content, the aerogels are among the few materials exhibiting such low dielectric properties. Our measurements show that aerogels with greater than 99% porosity have dielectric constants less than 1.03; these are the lowest values ever reported for a bulk solid material.

Dielectric Properties of Sol - Gel Silica Glasses

1986 ◽  
Vol 72 ◽  
Author(s):  
G. V. Chandrashekhar ◽  
M. W. Shafer
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Elemental Carbon ◽  
Sol Gel ◽  
Fused Silica ◽  
Dielectric Constants ◽  
Low Dielectric Constant ◽  
Silica Glasses ◽  
Low Dielectric ◽  
Gel Technique

AbstractDielectric properties have been measured for a series of porous and fully densified silica glasses, prepared by the sol-gel technique starting from Si-methoxide or Si-fume. The results for the partially densified glasses do not show any preferred orientation for porosity. When fully densified (˜2.25 gms/cc) without any prior treatment of the gels, they have dielectric constants of ≥ 6.5 and loss factors of 0.002 at 1 MHz, compared to values of 3.8 and <0.001 for commercial fused silica. There is no corresponding anomaly in the d.c. resistivity. Elemental carbon present to the extent of 400–500 ppm is likely to be the main cause for this enhanced dielectric constant. Extensive cleaning of the gels prior to densification to remove this carbon were not completely successful pointing to the difficulty in preparing high purity, low dielectric constant glasses via the organic sol-gel route at least in the bulk form.

Temperature and Moisture Dependence of Dielectric Constant for Bulk Silica Aerogels

1997 ◽  
Vol 476 ◽  
Author(s):  
L.W. Hrubesh ◽  
S. R. Buckley
Keyword(s):  
Dielectric Constant ◽  
Microwave Frequency ◽  
Solid Material ◽  
Silica Aerogels ◽  
Dielectric Constants ◽  
Surface Areas ◽  
Nano Structures ◽  
Low Thermal Expansion ◽  
Heat Treated ◽  
Moisture Dependence

AbstractThe dielectric constants of silica aerogels are among the lowest measured for any solid material. The silica aerogels also exhibit low thermal expansion and are thermally stable to temperatures exceeding 500°C. However, due to the open porosity and large surface areas for aerogels, their dielectric constants are strongly affected by moisture and temperature. This paper presents data for the dielectric constants of silica aerogels as a function of moisture content at 25 °C, and as a function of temperature, for temperatures in the range from 25 °C to 450°C. Dielectric constant data are also given for silica aerogels that are heat treated in dry nitrogen at 500°C, then cooled to 25°C for measurements in dry air. All measurements are made on bulk aerogel spheres at 22GHz microwave frequency, using a cavity perturbation method. The results of the dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano-structures and densities.

Dielectric Properties Of Sol - Gel Silica Glasses

1986 ◽  
Vol 73 ◽  
Author(s):  
G. V. Chandrashekhar ◽  
M. W. Shafer
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Elemental Carbon ◽  
Sol Gel ◽  
Fused Silica ◽  
Dielectric Constants ◽  
Low Dielectric Constant ◽  
Silica Glasses ◽  
Low Dielectric ◽  
Gel Technique

ABSTRACTDielectric properties have been measured for a series of porous and fully densified silica glasses, prepared by the sol-gel technique starting from Si-methoxide or Si-fume. The results for the partially densified glasses do not show any preferred orientation for porosity. When fully densified (∼2.25 gms/cc) without any prior treatment of the gels, they have dielectric constants of ≥ 6.5 and loss factors of 0.002 at 1 MHz, compared to values of 3.8 and <0.001 for commercial fused silica. There is no corresponding anomaly in the d.c. resistivity. Elemental carbon present to the extent of 400–500 ppm is likely to be the main cause for this enhanced dielectric constant. Extensive cleaning of the gels prior to densification to remove this carbon were not completely successful pointing to the difficulty in preparing high purity, low dielectric constant glasses via the organic sol-gel route at least in the bulk form.

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.

Preparation and Properties of Porous Si3N4/SiO2/BN Composite Ceramics

2012 ◽  
Vol 512-515 ◽  
pp. 828-831 ◽  
Author(s):  
Wei Dong ◽  
Chang An Wang ◽  
Lei Yu ◽  
Shi Xi Ouyang
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
High Strength ◽  
Low Dielectric Constant ◽  
Pressureless Sintering ◽  
Composite Ceramics ◽  
Porous Si ◽  
Low Dielectric ◽  
Dry Pressing ◽  
Porous Si3n4

Porous Si3N4/SiO2/BN composite ceramics with high strength and low dielectric constant were prepared by dry-pressing process and pressureless sintering at 1750°C for 1.5 h in flow nitrogen. The influences of BN content on microstructure, porosity, mechanical and dielectric properties of the porous Si3N4/SiO2/BN composite ceramics were discussed. The results showed that the porous Si3N4/SiO2/BN composite ceramics with porosity ranging from 29% to 48% were fabricated by adjusting the content of BN. The flexural strength of the porous Si3N4/SiO2/BN composite ceramics was 78215 MPa. The dielectric constant of the porous Si3N4/SiO2/BN composite ceramics was 3.9~5 at 1 MHz.

Epitaxial Growth and Anisotropic Dielectric Properties of La-Doped Bi4Ti3O12 Thin Films

2007 ◽  
Vol 124-126 ◽  
pp. 177-180
Author(s):  
Jang Sik Lee ◽  
Q.X. Jia
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Bottom Electrode ◽  
Dielectric Constants ◽  
The Other ◽  
Field Range ◽  
Anisotropic Dielectric ◽  
Dielectric Nonlinearity ◽  
La Doped

To investigate the anisotropic dielectric properties of layer-structured bismuth-based ferroelectrics along different crystal directions, we fabricate devices along different crystal orientations using highly c-axis oriented Bi3.25La0.75Ti3O12 (BLT) thin films on (001) LaAlO3 (LAO) substrates. Experimental results have shown that the dielectric properties of the BLT films are highly anisotropic along different crystal directions. The dielectric constants (1MHz at 300 K) are 358 and 160 along [100] and [110], respectively. Dielectric nonlinearity is also detected along these crystal directions. On the other hand, a much smaller dielectric constant and no detectable dielectric nonlinearity in a field range of 0-200 kV/cm are observed for films along [001] when c-axis oriented SRO is used as the bottom electrode.

Fabrication of low dielectric constant polyimide/TiO2 nanofibers with enhanced UV-light shielding properties

2018 ◽  
Vol 31 (8) ◽  
pp. 986-995
Author(s):  
Lei Wang ◽  
Guifen Gong ◽  
Junyao Shen ◽  
Jinsong Leng
Keyword(s):  
Dielectric Constant ◽  
Light Absorption ◽  
Composite Nanofibers ◽  
Uv Light ◽  
Dielectric Constants ◽  
Low Dielectric Constant ◽  
Number Density ◽  
Tio2 Nanofibers ◽  
Low Dielectric ◽  
Mechanical Tensile

Polyimide (PI)/titanium dioxide (TiO2) composite nanofibers (NFs) with average diameters of 200–250 nm were synthesized via electrospinning. The total number density of dipoles decreased significantly, owing to the porous structures and compact interface between TiO2 NPs and PI matrix. All PI/TiO2 NFs maintain low dielectric constants and losses. For example, the dielectric constants of PI/TiO2-6% NFs are all lower than 2.6, being exposed to temperatures from 25°C to 200°C. Meantime, the dielectric losses of PI/TiO2-6% NFs are below 0.005. For ultraviolet (UV)-light shielding performance, the PI/TiO2 NFs exhibited good UV-light shielding and corresponding anti-photoaging properties. The reason can be ascribed from high UV-light absorption and scattering ability in the TiO2 NPs. The best UV-light absorption (average: 3.71) and corresponding absorption decay (15.13%) were achieved for optimized PI/TiO2-6% NFs. Other fundamental characteristics, such as the thermal stability, mechanical tensile property, and hydrophobicity, were also investigated. Such low dielectric constant PI/TiO2 composite NFs can be alternatively chosen under a longtime UV-light exposing condition.

A facile method for the preparation of aliphatic main-chain benzoxazine copolymers with high-frequency low dielectric constants

2018 ◽  
Vol 9 (21) ◽  
pp. 2913-2925 ◽  
Author(s):  
Ming Zeng ◽  
Jiangbing Chen ◽  
Qingyu Xu ◽  
Yiwan Huang ◽  
Zijian Feng ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
High Frequency ◽  
Main Chain ◽  
Polymerization Kinetics ◽  
Dielectric Constants ◽  
Low Dielectric

The effects of the reaction solvent on the preparation, polymerization kinetics, and high-frequency dielectric properties of aliphatic main-chain benzoxazine copolymers were investigated.

Photosensitive Polyimide having low loss tangent for RF application

2018 ◽  
Vol 2018 (1) ◽  
pp. 000476-000482 ◽  
Author(s):  
Masao Tomikawa ◽  
Hitoshi Araki ◽  
Yohei Kiuchi ◽  
Akira Shimada
Keyword(s):  
Molecular Structure ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Frequency ◽  
Low Dielectric Constant ◽  
Low Loss ◽  
Elongation At Break ◽  
Low Dielectric ◽  
The Poor

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.

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