In-Situ Electromigration Stressing in Transmission Electron Microscopy for Al-Cu Interconnects
Keyword(s):
AbstractUnpassivated 2.1 μm wide Al-4wt%Cu interconnects with near-bamboo grain structure, are electromigration-tested to failure in-situ in transmission electron microscopy. Early stress-induced voids stop growing and are not fatal. Hillocking is associated with precipitates, fatal voiding with copper depletion. Electromigration-induced voids form at the upstream end of inclined grain boundaries. Healing events are analysed and it is shown that open-circuit failure can occur when the proximity of grain boundaries impairs the stress-driven healing.
1993 ◽
pp. 415-420
1993 ◽
Vol 164
(1-2)
◽
pp. 415-420
◽
1990 ◽
Vol 48
(4)
◽
pp. 68-69