Pulse-to-Pulse Laser Stability Effects on Multiple Shot Excimer Laser Crystallized a-Si Thin Films

1994 ◽  
Vol 343 ◽  
Author(s):  
R. I. Johnson ◽  
G. B. Anderson ◽  
J. B. Boyce ◽  
D. K. Fork ◽  
P. Mei ◽  
...  

ABSTRACTLaser crystallized amorphous silicon thin films on quartz exhibit a peak in the grain size, electron mobility and the Si (111) x-ray intensity as a function of the laser fluence, substrate temperature, film thickness, and the number of laser shots per unit area. The peak in grain size has also been shown to be dependent: on the stability of the pulse-to-pulse laser energy density, particularly at high shot densities. The shape of the distribution profile of the pulse-to-pulse laser fluence can significantly alter the grain growth at higher shot densities. The modified growth can be expressed by a simple model based on the mean and standard deviation of the laser energy density relative to the characteristic fluence at which the grain size, mobility, and Si (111) x-ray intensities are maximized.

1993 ◽  
Vol 297 ◽  
Author(s):  
R.I. Johnson ◽  
G.B. Anderson ◽  
J.B. Boyce ◽  
D.K. Fork ◽  
P. Mei ◽  
...  

This paper describes new results on the relationship between the grain size, mobility, and Si (111) x-ray peak intensity of laser crystallized amorphous silicon as a function of the laser fluence, shot density, substrate temperature, and film thickness. These observations include an unexpected narrow peak found in the silicon (111) x- ray peak intensity, which occurs at a specific laser fluence for a given film thickness and substrate temperature. Amorphous silicon materials processed at laser energy densities defined by this peak exhibit exceptionally large grain sizes and electron mobilities that cannot be obtained at any other energy and shot density combination above or below the energy at which the Si (111) x-ray peak intensity maximum occurs.


1994 ◽  
Vol 336 ◽  
Author(s):  
P. Mei ◽  
G. B. Anderson ◽  
J. B. Boyce ◽  
D. K. Fork ◽  
M. Hack ◽  
...  

ABSTRACTThe combination of a-Si low leakage pixel TFTs with poly-Si TFTs in peripheral circuits provides an excellent method for reducing the number of external connections to large-area imaging arrays and displays. To integrate the fabrication of the peripheral poly-Si TFTs with the a-Si pixel TFTs, we have developed a three-step laser process which enables selective crystallization of PECVD a-Si:H. X-ray diffraction and transmission electron microscopy show that the polycrystalline grains formed with this three-step process are similar to those crystallized by a conventional one step laser crystallization of unhydrogenated amorphous silicon. The grain size increases with increasing laser energy density up to a peak value of a few Microns. The grain size decreases with further increases in laser energy density. The transistor field effect mobility is correlated with the grain size, increasing gradually with laser energy density until reaching its maximum value. Thereafter, the transistors suffer from leakage through the gate insulators. A dual dielectric gate insulator has been developed for these bottom-gate thin film transistors to provide the correct threshold voltages for both a-Si and poly-Si TFTs.


1992 ◽  
Vol 283 ◽  
Author(s):  
H. J. Kim ◽  
James S. Im ◽  
Michael O. Thompson

ABSTRACTUsing planar view transmission electron microscope (TEM) and transient reflectance (TR) analyses, we have investigated the excimer laser crystallization of amorphous silicon (a-Si) films on SiO2. Emphasis was placed on characterizing the microstructures of the single-shot irradiated materials, as a function of the energy density of the laser pulse and the temperature of the substrate. The dependence of the grain size and melt duration as a function of energy density revealed two major crystallization regimes. In the low energy density regime, the average grain size first increases gradually with increases in the laser energy density. In the high energy density regime, on the other hand, a very fine grained microstructure, which is relatively insensitive to variations in the laser energy density, is obtained. In addition, we have discovered that at the transition between these two regimes an extremely small experimental window exists, within which an exceedingly large grain-sized polycrystalline film is obtained. We suggest a liquid phase growth model for this phenomenon, which is based on the regrowth of crystals from the residual solid islands at the oxide interface.


2003 ◽  
Vol 780 ◽  
Author(s):  
A. Suárez-García ◽  
J-P. Barnes ◽  
R. Serna ◽  
A. K. Petford-Long ◽  
C. N. Afonso ◽  
...  

AbstractThe effect of the laser energy density used to deposit Bi onto amorphous aluminum oxide (a-Al2O3) on the growth of Bi nanocrystals has been investigated using transmission electron microscopy of cross section samples. The laser energy density on the Bi target was varied by one order of magnitude (0.4 to 5 J cm-2). Across the range of energy densities, in addition to the Bi nanocrystals nucleated on the a-Al2O3 surface, a dark and apparently continuous layer appears below the nanocrystals. Energy dispersive X-ray analysis on the layer have shown it is Bi rich. The separation from the Bi layer to the bottom of the nanocrystals on top is consistent with the implantation range of Bi species in a-Al2O3. As the laser energy density increases, the implantation range has been measured to increase. The early stages of the Bi growth have been analyzed in order to determine how the Bi implanted layer develops.


2017 ◽  
Vol 111 (15) ◽  
pp. 152905 ◽  
Author(s):  
Min Gao ◽  
Ravindranath Viswan ◽  
Xiao Tang ◽  
Chung Ming Leung ◽  
Jiefang Li ◽  
...  

1994 ◽  
Vol 345 ◽  
Author(s):  
P. Mei ◽  
G. B. Anderson ◽  
J. B. Boyce ◽  
D. K. Fork ◽  
M. Hack ◽  
...  

AbstractThe combination of a-Si low leakage pixel TFTs with poly-Si TFTs in peripheral circuits provides an excellent method for reducing the number of external connections to large-area imaging arrays and displays. To integrate the fabrication of the peripheral poly-Si TFTs with the a-Si pixel TFTs, we have developed a threestep laser process which enables selective crystallization of PECVD a-Si:H. X-ray diffraction and transmission electron microscopy show that the polycrystalline grains formed with this three-step process are similar to those crystallized by a conventional one step laser crystallization of unhydrogenated amorphous silicon. The grain size increases with increasing laser energy density up to a peak value of a few microns. The grain size decreases with further increases in laser energy density. The transistor field effect mobility is correlated with the grain size, increasing gradually with laser energy density until reaching its maximum value. Thereafter, the transistors suffer from leakage through the gate insulators. A dual dielectric gate insulator has been developed for these bottom-gate thin film transistors to provide the correct threshold voltages for both a-Si and poly-Si TFTs.


2001 ◽  
Vol 693 ◽  
Author(s):  
Man Young Sung ◽  
Woong-Je Sung ◽  
Yong-Il Lee ◽  
Chun-Il Park ◽  
Woo-Boem Choi ◽  
...  

Abstract:GaN thin films on sapphire were grown by RF magnetron sputtering with ZnO buffer layer. The tremendous mismatch between the lattices of GaN and sapphire can be partly overcome by the use of thin buffer layer of ZnO. The dependence of GaN film quality on ZnO buffer layer was investigated by X-ray diffraction(XRD). The properties of the sputtered GaN are strongly dependent on ZnO buffer layer thickness. The optimum thickness of ZnO buffer layer is around 30nm. Using XRD analysis, we have found the optimal substrate temperature which can grow high quality GaN thin film. In addition, the effect of excimer laser annealing(ELA) on structural and electrical properties of GaN thin films was investigated. The surface roughness and images according to the laser energy density were investigated by atomic force microscopy(AFM) and it was confirmed that the crystallization was improved by increasing laser energy density.


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