Common Themes in ther Epitaxial Growth of Oxides on Semiconductors

1994 ◽  
Vol 341 ◽  
Author(s):  
E. J. Tarsa ◽  
K. L. Mccormick ◽  
J. S. Speck

AbstractA review of the growth of oriented oxides on Si and Ill-V semiconductors provides insight into some of the common themes of oxide/semiconductor epitaxy. The nature and success of the epitaxy can be attributed to four primary factors: (i) semiconductor surface preparation; (ii) oxide/semiconductor reaction thermodynamics; (iii) surface and interfacial polarity; and (iv) structural matching (lattice matching, thermal expansion, and symmetry). Semiconductor surface preparation governs the initial stages of epitaxy for systems such as MgO/GaAs and In2O3/InAs. In these cases, the epitaxial development depends on the presence or absence of a native oxide layer prior to growth. Chemical reaction can also influence the epitaxial process, as is illustrated in the growth of gadolinium oxide on Si. In general, the initial stages of epitaxy reflect a thermodynamic competition between the formation of the desired oxide phase, oxidation of the semiconductor, and formation of intermediate phases such as silicides and silicates. An analysis of possible reactions is presented for selected binary and ternary oxides with Si and GaAs. Surface and interfacial energy can also play an important role in determining the morphology and orientation of oxides having polar low-index faces, as illustrated in the growth of fluorite and related bixbyite oxides such as CeO2, In2O3 and Y2O3. The epitaxial relationships between the oxide and semiconductor may be rationalized in terms of either direct lattice matching or higher order epitaxy.

Author(s):  
М.В. Лебедев ◽  
Т.В. Львова ◽  
А.Л. Шахмин ◽  
О.В. Рахимова ◽  
П.А. Дементьев ◽  
...  

AbstractVarious conditions of passivation of the GaSb(100) surface by ammonium sulfide ((NH_4)_2S) solutions depending on the solution concentration, solvent, and treatment time are investigated by X-ray photoelectron spectroscopy and atomic-force microscopy. It is shown that treatment of the GaSb(100) surface by any (NH_4)_2S solution leads to removal of the native oxide layer from the semiconductor surface and the formation of a passivating layer consisting of various gallium and antimony sulfides and oxides. The surface with the lowest roughness (RMS = 0.85 nm) is formed after semiconductor treatment with 4% aqueous ammonium sulfide solution for 30 min. Herewith, the atomic concentration ratio Ga/Sb at the surface is ~2. It is also found that aqueous ammonium sulfide solutions do not react with elemental antimony incorporated into the native-oxide layer. The latter causes a leakage current and Fermi-level pinning at the GaSb(100) surface. However, a 4% (NH_4)_2S solution in isopropanol removes elemental antimony almost completely; herewith, the semiconductor surface remains stoichiometric if a treatment duration is up to 13 min.


1981 ◽  
Vol 59 (5) ◽  
pp. 716-717
Author(s):  
P. Sircar ◽  
R. Dat

A thin native oxide layer grown on GaAs is known to increase the Schottky barrier solar cell efficiency by 60% over a baseline cell, due mainly to a higher open-circuit voltage. A physically-deposited oxide layer shows better efficiency and stability. A spin-on oxide layer is found to cause a higher relative increase in efficiency due to an increase in open-circuit voltage, as well as in short-circuit current.


2007 ◽  
Vol 22 (8) ◽  
pp. 2273-2278 ◽  
Author(s):  
J.M. Molina ◽  
J. Tian ◽  
C. Garcia-Cordovilla ◽  
E. Louis ◽  
J. Narciso

The infiltration behavior of compacts of SiC particles in two surface conditions, as-received and thermally oxidized, was investigated by using pure Al and Al-12wt%Si as infiltrating metals. Analysis of the threshold pressure for infiltration revealed that the process is governed by the same contact angle for all different systems, no matter the metal or particle condition. This leads to the conclusion that oxidation does not modify the wetting characteristics of the particles, most probably because they are already covered by a thin native oxide layer that remains unaltered in processing routes involving short contact times and low temperatures, such as actual conditions of pressure infiltration at 700 °C.


2013 ◽  
Vol 1559 ◽  
Author(s):  
Paul Gondcharton ◽  
Floriane Baudin ◽  
Lamine Benaissa ◽  
Bruno Imbert

ABSTRACTWafer level metal bonding involving copper material is widely used to achieve 3D functional integration of ICs and ensure effective packaging sealing for various applications. In this paper we focus on thermocompression bonding technology where temperature and pressure are used in parallel to assist the bonding process. More specifically a broad range of conditions was explored and interesting results were observed and are reported. Indeed, despite a relatively high roughness, the presence of a native oxide and the lack of surface preparation, there still exists a process window where wafer level bonding is allowed. In these conditions, limiting the bonding mechanisms to basic copper diffusion is no longer satisfactory. In this study, a specific scenario inspired by both wafer bonding and metal welding state of the art is put forward. Accordingly, pure copper diffusion through the bonding interface is lined with plastic deformation and metallic oxide fracture. In addition, polycrystalline film deformation due to thermomechanical stress is highlighted and grain growth and voiding formation are observed and confirmed.


2007 ◽  
Vol 1026 ◽  
Author(s):  
Augustus K. W. Chee ◽  
Conny Rodenburg ◽  
Colin John Humphreys

AbstractDetailed computer modelling using finite-element analysis was performed for Si p-n junctions to investigate the effects of surface states and doping concentrations on surface band-bending, surface junction potentials and external patch fields. The density of surface states was determined for our Si specimens with a native oxide layer. Our calculations show that for a typical density of surface states for a Si specimen with a native oxide layer, the effects of external patch fields are negligible and the SE doping contrast is due to the built-in voltage across the p-n junction modified by surface band-bending. There is a good agreement between the experimental doping contrast and the calculated junction potential just below the surface, taking into account surface states, for a wide range of doping concentrations.


CORROSION ◽  
10.5006/2674 ◽  
2018 ◽  
Vol 74 (9) ◽  
pp. 1011-1022 ◽  
Author(s):  
Megan Mahrokh Dorri ◽  
Stéphane Turgeon ◽  
Maxime Cloutier ◽  
Pascale Chevallier ◽  
Diego Mantovani

Localized corrosion constitutes a major concern in medical devices made of stainless steel. The conventional approach to circumvent such a problem is to convert the surface polycrystalline microstructure of the native oxide layer to an amorphous oxide layer, a few micrometers thick. This process cannot, however, be used for devices such as stents that undergo plastic deformation during their implantation, especially those used in vascular surgery for the treatment of cardiac, neurological, and peripheral vessels. This work explores the feasibility of producing a nano-thick plastic-deformation resistant amorphous oxide layer by plasma-based surface modifications. By varying the plasma process parameters, oxide layers with different features were produced and their properties were investigated before and after clinically-relevant plastic deformation. These properties and the related corrosion mechanisms were mainly evaluated using the electrochemical methods of open-circuit potential, cyclic potentiodynamic polarization, and electrochemical impedance spectroscopy. Results showed that, under optimal conditions, the resistance to corrosion and to the permeation of ions in a phosphate buffered saline, even after deformation, was significantly enhanced.


Author(s):  
Г.Ю. Сидоров ◽  
Ю.Г. Сидоров ◽  
В.А. Швец ◽  
В.С. Варавин

Influence storage and boiling in deionized water and heat treatments of epitaxial films CdxHg1-xTe on the Hall and ellipsometric parametres is investigated. Water treatment reduces refractive index of native CdxHg1-xTe oxide from 2.1 to 1.2-1.4. It means that matter with a lower refractive index, such as water, is introduced in the oxide. Boiling in water leads to formation of acceptors in CdxHg1-xTe with concentrations up to 1019 cm-3. Change of medium’s pH from alkaline to the acidic decreases the speed of acceptors formation. Heat treatments after storage in water also leads to formation of acceptors. The conclusion is made, that water medium or water absorbed by native oxide layer leads to formation of acceptors in CdxHg1-xTe. Concentration of acceptors grows with temperature of treatments and quantity of accessible water.


2008 ◽  
Vol 1068 ◽  
Author(s):  
Jesse S. Jur ◽  
Ginger D. Wheeler ◽  
Matthew T. Veety ◽  
Daniel J. Lichtenwalner ◽  
Douglas W. Barlage ◽  
...  

ABSTRACTHigh-dielectric constant (high-κ) oxide growth on hexagonal-GaN (on sapphire) is examined for potential use in enhancement-mode metal oxide semiconductor field effect transistor (MOSFET). Enhancement-mode MOSFET devices (ns > 4×1013 cm−2) offer significant performance advantages, such as greater efficiency and scalability, as compared to heterojunction field effect transistor (HFET) devices for use in high power and high frequency GaN-based devices. High leakage current and current collapse at high drive conditions suggests that the use of a high-κ insulating layer is principle for enhancement-mode MOSFET development. In this work, rare earth oxides (Sc, La, etc.) are explored due to their ideal combination of permittivity and high band gap energy. However, a substantial lattice mismatch (9-21%) between the rare earth oxides and the GaN substrate results in mid-gap defect state densities and growth dislocations. The epitaxial growth of the rare earth oxides by molecular beam epitaxy (MBE) on native oxide passivated-GaN is examined in an effort to minimize these growth related defects and other growth-related limitations. Growth of the oxide on GaN is characterized analytically by RHEED, XRD, and XPS. Preliminary MOS electrical analysis of a 50 Å La2O3 on GaN shows superior leakage performance as compared to significantly thicker Si3N4 dielectric.


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