Adhesion Measurements of Thin Films by Several Methods
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ABSTRACTAdhesion of thin films to solid substrates has been measured by various methods. In addition to the traditional and the conventional methods, a novel method has been proposed. The adhesion is expressed by various units depending on the measuring method. Obtained values by typical or well known methods such as scratch, peel and pull method are expressed in terms of N, N/m and N/m2, respectively. Relation among these quantities was discussed. The interface structure between the films and the substrates was investigated by TEM, ED, EDS, etc. and was related to the adhesion. Particular attention was paid to the ion bombardment effect of the substrate on the adhesion.
2007 ◽
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2012 ◽
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1993 ◽
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2017 ◽
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