Hydrogen Diffusion in Undoped and B-Doped a-Si1-xCx:H

1994 ◽  
Vol 336 ◽  
Author(s):  
R. Shinar ◽  
J. Shinar ◽  
G. Subramania ◽  
H. Jia ◽  
S. Sankaranarayanan ◽  
...  

ABSTRACTA deuterium secondary ion mass spectrometry (SIMS) study of hydrogen diffusion in undoped and boron-doped a-Si0.86C0.4:H deposited by an electron cyclotron resonance plasma is described. The undoped films deposited at 250°C clearly indicated deuterium-hydrogen interdiffusion at T ≥ 350°C. The dispersion parameter a of the power-law time dependent diffusion constant D = D00(ωt)−α decreased from ∼0.3 at T = 350 and 400°C to ∼0.1 at 450°C, and the activation energy for a diffusion length of 1000 Å was ∼1.0 eV. These results are discussed in relation to previous studies of a-Si:H. The diffusion in ∼0.2 and ∼0.6 at.% B-doped a-Si0.86C0.14:H sharply differs from that in B-doped a-Si:H, where an enhancement of up to ∼103 was previously observed. In doped a-Si0.86C0.14:H, the diffusion of most of the H atoms is strongly suppressed, but a small fraction undergoes fast diffusion. IR Measurements indicate that the B-doping reduces the bulk-like Si-H stretch vibration at ∼2000 cm1. Upon annealing, the Si-CHn and C-H wag modes at ∼780 and ∼1000 cm−1, resp., increase, while the 640 and ∼2000 cm1 Si-H wag and stretch modes, resp., weaken, indicating transfer of hydrogen from Si- to C-bonds, in which the H atoms are apparently deeply trapped. As in a-Si:H, the fast diffusion component is apparently due to carrier recombination-enhanced weak Si-Si bond breaking. The results suggest that B-doping also induces microvoids and enhances the rate of breaking of weak Si-C bonds, leading to enhanced trapping of H.

1989 ◽  
Vol 149 ◽  
Author(s):  
S. Mitra ◽  
X.-L. Wu ◽  
R. Shinar ◽  
J. Shinar

ABSTRACTSecondary ion mass spectrometry (SIMS) and IR measurements of long range deuterium motion in rf sputter deposited (rf sp) p-doped a-Si:H and undoped a-Ge:H are compared to recently published results on undoped rf sp a-Si:H, which exhibited strongly power-law time dependent diffusion constants (exponent α= 0.75±0.1) in films of as-deposited content of di-H and tri-H bonds (usually associated with microvoids) Ndo –4–5 at.%. In pdoped a-Si:H samples where Ndo-l.8–3.8at.%, the diffusion is much faster, but the exponent is similar. In undoped a-Ge:H exhibiting a stretch vibration band indicative of mono-H bonding only, the diffusion is about one order of magnitude faster than in undoped a-Si:H, and α = 0.23. The results are discussed in relation to both the multiple trapping (dispersive) and defect mediated diffusion models.


1999 ◽  
Vol 557 ◽  
Author(s):  
R. Shinar ◽  
J. Shinar ◽  
D. L. Williamson ◽  
S. Mitra ◽  
H. Kavak ◽  
...  

AbstractSmall angle x-ray scattering (SAXS), IR spectroscopy, and deuterium secondary ion mass spectrometry (DSIMS) were used to study the microstructure and hydrogen dynamics of undoped and boron-doped if-sputter-deposited (RFS) and electron cyclotron resonance (ECR)-deposited hydrogenated amorphous silicon carbides (a-Si1-xCx:H) with x ≤ 19 at.%. The SAXS measurements indicated residual columnar-like features and roughly spherical nanovoids of total content CnV ≤ 1.0 vol.%. The growth of CnV with annealing was due largely to an increase in the average nanovoid radius. It was noticeably smaller than in RFS a-Si:H films. The IR spectra demonstrated H transfer by annealing from mostly bulk-like Si-H groups to C-bonds. The H diffusion and its temperature dependence in undoped films resembled those of a-Si:H and were consistent with the SAXS and IR data. Suppression of long-range motion of most of the H atoms, consistent with increased CnV was observed in B-doped ECR films. However, a small fraction of the H atoms appeared to undergo fast diffusion, reminiscent of the fast diffusion in doped a-Si:H. The results are consistent with impeded relaxation processes of the Si network, caused by the presence of C atoms, and H trapping at C-H bonds.


2004 ◽  
Vol 813 ◽  
Author(s):  
D. Ballutaud ◽  
A. Boutry-Forveille ◽  
J.-M. Laroche ◽  
N. Simon ◽  
H. Girard ◽  
...  

ABSTRACTHydrogen (deuterium used as tracer) diffusion experiments were performed on undoped and boron doped diamond films ([B] = 1019and 1020 cm−3) grown by plasma CVD or hot-filament assisted CVD. The samples were exposed either to a radiofrequency plasma or a microwave plasma at different temperatures between 400°C and 900°C. The deuterium profiles were analysed by secondary ion mass spectrometry (SIMS). The deuterium diffusion was explained mainly in term of trapping on intergranular defects. The passivation of boron acceptors, by B-D complex formation in the deuterium diffused superficial layers of the diamond films, was followed by electrochemical and mercury probe capacitance measurements. The results suggest a strong decrease of the free carrier density, which is in accordance with passivation of free carriers by deuterium trapping on dopant.


1990 ◽  
Vol 192 ◽  
Author(s):  
R. Shinar ◽  
X.-L. Wu ◽  
S. Mitra ◽  
J. Shinar

ABSTRACTThe results of secondary ion mass spectrometry and IR studies of hydrogen diffusion in a-Si:H and a-Ge:H are reviewed and discussed. In a-Si:H, the diffusion is significantly slower at low total H content. The exponent α of the power-law time dependent diffusion constant D(t) = Doo(ωt)−α does not decrease with temperature as 1-T/To. D(tL), for constant diffusion length L, thus deviates from an Arrhenius behavior. The “apparent” activation energy Ea and prefactor Do derived from lnD(tL) vs 1/T yield a Meyer-Neldel relation Do = Aooexp(Ea/kToo) irrespective of L, H content, or microstructure. Aoo ≅ 3.3 × 10−14cm2/s and Too ≅ 730K for 2.5 × 10−5 ≤ Do ≤ 102cm2/s and 1.3 ≤ Ea ≤ 2.2eV. The preliminary results on a-Ge:H are similar, with Aoo ≅ 1.3 × 10−15cm2/s and Too = 530K. It is suspected that deviations from an exponential distribution of H site energies, structural relaxation, and deep H trapping sites related to microvoids may all contribute to the deviation of α from a 1-T/To behavior. Measurements following prolonged annealing suggest structural relaxation that affects H-site energies.


Author(s):  
Ramachandra Chitakudige ◽  
Sarat Kumar Dash ◽  
A.M. Khan

Abstract Detection of both Insufficient Buried Contact (IBC) and cell-to-cell short defects is quite a challenging task for failure analysis in submicron Dynamic Random Access Memory (DRAM) devices. A combination of a well-controlled wet etch and high selectivity poly silicon etch is a key requirement in the deprocessing of DRAM for detection of these types of failures. High selectivity poly silicon etch methods have been reported using complicated system such as ECR (Electron Cyclotron Resonance) Plasma system. The fact that these systems use hazardous gases like Cl2, HBr, and SF6 motivates the search for safer alternative deprocessing chemistries. The present work describes high selectivity poly silicon etch using simple Reactive Ion Etch (RIE) plasma system using less hazardous gases such as CF4, O2 etc. A combination of controlled wet etch and high selectivity poly silicon etch have been used to detect both IBC and cell-to-cell shorts in submicron DRAMs.


1990 ◽  
Vol 56 (15) ◽  
pp. 1424-1426 ◽  
Author(s):  
S. J. Pearton ◽  
U. K. Chakrabarti ◽  
A. P. Kinsella ◽  
D. Johnson ◽  
C. Constantine

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