Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

1993 ◽  
Vol 323 ◽  
Author(s):  
Alan J. Mockler ◽  
Peter J. Goodhew ◽  
Elizabeth A. Logan
Keyword(s):  
Heat Treatment ◽  
Solid State ◽  
Ternary Phase ◽  
Flip Chip ◽  
Phase Distribution ◽  
Intermetallic Phases ◽  
Ternary Diagram ◽  
Solid State Diffusion ◽  
Analysis Techniques ◽  
State Diffusion

AbstractThe microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

2007 ◽  
Vol 15 (3) ◽  
pp. 396-403 ◽  
Author(s):  
Riet Labie ◽  
Wouter Ruythooren ◽  
Jan Van Humbeeck
Keyword(s):  
Solid State ◽  
Flip Chip ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion

scholarly journals Effect of Post-Weld Heat Treatment on the Solid-State Diffusion Bonding of 6061 Aluminum Alloy

2021 ◽  
Vol 11 (20) ◽  
pp. 9660
Author(s):  
Chun-Hao Chen ◽  
Yu-Kai Sun ◽  
Yu-Chang Lai ◽  
Shih-Ying Chang ◽  
Tung-Han Chuang
Keyword(s):  
Heat Treatment ◽  
Shear Strength ◽  
Aluminum Alloy ◽  
Solid State ◽  
Diffusion Bonding ◽  
Joint Strength ◽  
Post Weld Heat Treatment ◽  
Solid State Diffusion ◽  
State Diffusion ◽  
Weld Heat

The precipitation-hardenable aluminum alloy 6061 (AA 6061) is favored for aerospace components and automotive parts. However, the tenacious oxide layer on the surface greatly limits the quality and applicability of joining AA 6061. In this study, the joining method of solid-state diffusion bonding was implemented for AA 6061 plates, and the effects of post-weld heat treatment (PWHT) on the joint interface were investigated. The bonding temperatures were within the range of 500–530 °C, and the time periods varied from 30 to 240 min under a static pressure of 5 MPa in a vacuum. The diffusion bonded specimens were subjected to T4- and T6-PWHT to improve the bonding quality. The interfacial microstructure of the joints was analyzed by scanning electron microscopy, and the mechanical properties were evaluated with shear tests. The experimental results showed that the shear strength of the diffusion bonded joint could reach around 71.2 MPa, which was highly dependent on bonding temperature and holding time, and T6-PWHT further enhanced it to over 100 MPa. The effects of PWHT on the diffusion bonded AA 6061 joint were investigated, and the fractography on the sheared surfaces indicated that PWHT-T6 played an important role in enhancing joint strength, which was consistent with the measured shear strength. The sequential PWHT for AA 6061 after diffusion bonding was proven to be feasible for bonding of AA 6061 parts, and the joint strength was sufficient for industrial needs.

Joining of Ti3SiC2 with Ti–6Al–4V Alloy

2002 ◽  
Vol 17 (1) ◽  
pp. 52-59 ◽  
Author(s):  
N.F. Gao ◽  
Y. Miyamoto
Keyword(s):  
Solid State ◽  
Rate Constant ◽  
Liquid State ◽  
Parabolic Rate Constant ◽  
Diffusion Path ◽  
Solid State Diffusion ◽  
Diffusion Controlled ◽  
State Diffusion ◽  
Rate Controlled ◽  
Higher Temperature

The joining of a Ti3SiC2 ceramic with a Ti–6Al–4V alloy was carried out at the temperature range of 1200–1400 °C for 15 min to 4 h in a vacuum. The total diffusion path of joining was determined to be Ti3SiC2/Ti5Si3Cx/Ti5Si3Cx + TiCx/TiCx/Ti. The reaction was rate controlled by the solid-state diffusion below 1350 °C and turned to the liquid-state diffusion controlled with a dramatic increase of parabolic rate constant Kp when the temperature exceeded 1350 °C. The TiCx tended to grow at the boundarywith the Ti–6Al–4V alloy at a higher temperature and longer holding time. TheTi3SiC2/Ti–6Al–4V joint is expected to be applied to implant materials.

Investigation of the diffusion behavior in Sn-xAg-yCu/Cu solid state diffusion couples

2016 ◽  
Vol 686 ◽  
pp. 794-802 ◽  
Author(s):  
Yuan Yuan ◽  
Dajian Li ◽  
Yuanyuan Guan ◽  
Hans J. Seifert ◽  
Nele Moelans
Keyword(s):  
Solid State ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
Diffusion Behavior ◽  
State Diffusion
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