Solid-State Diffusion Reaction and Formation of Intermetallic Phases in the Fe-Al System

2014 ◽  
Vol 65 (2) ◽  
pp. 262-272 ◽  
Author(s):  
K. Bhanumurthy ◽  
W. Krauss ◽  
J. Konys
Keyword(s):  
Solid State ◽  
Intermetallic Phases ◽  
Diffusion Reaction ◽  
Solid State Diffusion ◽  
State Diffusion

Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

1993 ◽  
Vol 323 ◽  
Author(s):  
Alan J. Mockler ◽  
Peter J. Goodhew ◽  
Elizabeth A. Logan
Keyword(s):  
Heat Treatment ◽  
Solid State ◽  
Ternary Phase ◽  
Flip Chip ◽  
Phase Distribution ◽  
Intermetallic Phases ◽  
Ternary Diagram ◽  
Solid State Diffusion ◽  
Analysis Techniques ◽  
State Diffusion

AbstractThe microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

INFLUENCE OF SYNTHESISING ROUTES ON RESISTIVITY AND AGING CHARACTERISTICS OF Bi-CUPRATE SUPERCONDUCTORS

1992 ◽  
Vol 06 (24) ◽  
pp. 1535-1540
Author(s):  
V. VIDYALAL ◽  
K. RAJASREE ◽  
C.P.G. VALLABHAN
Keyword(s):  
Solid State ◽  
Single Phase ◽  
Cuprate Superconductors ◽  
Diffusion Reaction ◽  
Solid State Diffusion ◽  
Degradation Behavior ◽  
High Quality ◽  
State Diffusion ◽  
The Matrix ◽  
Reaction Routes

Lead-doped Bi-2223 superconductors were prepared by two main popular solid state reaction routes, viz. solid state diffusion reaction and the matrix method. Even though both routes produce single-phase materials superconducting at 110 K, the resistivity behaviors above Tc are found to be different. Aging/degradation behavior was studied in terms of Tc on both sets of samples stored in a desiccator for eight months. Our studies indicate that the synthesising routes play a major role in the preparation of high quality bulk Pb-doped Bi-2223 superconductors which are more resistant to degradation when exposed to humid conditions.

Solid-State diffusion reaction and formation of intermetallic compounds in the nickel-zirconium system

1990 ◽  
Vol 21 (11) ◽  
pp. 2897-2903 ◽  
Author(s):  
K. Bhanumurthy ◽  
G. B. Kale ◽  
S. K. Khera ◽  
M. K. Asundi
Keyword(s):  
Solid State ◽  
Intermetallic Compounds ◽  
Diffusion Reaction ◽  
Solid State Diffusion ◽  
State Diffusion

Joining of Ti3SiC2 with Ti–6Al–4V Alloy

2002 ◽  
Vol 17 (1) ◽  
pp. 52-59 ◽  
Author(s):  
N.F. Gao ◽  
Y. Miyamoto
Keyword(s):  
Solid State ◽  
Rate Constant ◽  
Liquid State ◽  
Parabolic Rate Constant ◽  
Diffusion Path ◽  
Solid State Diffusion ◽  
Diffusion Controlled ◽  
State Diffusion ◽  
Rate Controlled ◽  
Higher Temperature

The joining of a Ti3SiC2 ceramic with a Ti–6Al–4V alloy was carried out at the temperature range of 1200–1400 °C for 15 min to 4 h in a vacuum. The total diffusion path of joining was determined to be Ti3SiC2/Ti5Si3Cx/Ti5Si3Cx + TiCx/TiCx/Ti. The reaction was rate controlled by the solid-state diffusion below 1350 °C and turned to the liquid-state diffusion controlled with a dramatic increase of parabolic rate constant Kp when the temperature exceeded 1350 °C. The TiCx tended to grow at the boundarywith the Ti–6Al–4V alloy at a higher temperature and longer holding time. TheTi3SiC2/Ti–6Al–4V joint is expected to be applied to implant materials.

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