Positron Annihilation and Electron Spin Resonance of Electron-Irradiated 3C-SiC

1992 ◽  
Vol 262 ◽  
Author(s):  
Hisayoshi Itoh ◽  
Masahito Yoshikawa ◽  
Long Wei ◽  
Shoichiro Tanigawa ◽  
Isamu Nashiyama ◽  
...  

ABSTRACTPositron annihilation and electron spin resonance (ESR) have been used to study defects introduced by lMeV electron irradiation in n-type cubic silicon carbide (3C-SiC) epitaxially grown on Si by chemical vapor deposition. Positron annihilation measurements by using variable-energy positron beams indicated the narrowing of the Doppler-broadened energy spectrum of annihilation gamma-rays and the decrease in the effective diffusion length of positrons with increasing the electron fluence. These results show the formation of vacancy-type defects in 3C-SiC. An ESR spectrum labeled T1, which has an isotropie g-value of 2.0029±0.0001, was observed in electron irradiated 3C-SiC. The T1 spectrum is interpreted by hyperfine interactions of paramagnetic electrons with 13C at four carbon sites and 29Si at twelve silicon sites, leads that the Tl center results from a point defect at a silicon sublattice site. The production rate of the Tl center was in good agreement with the carrier removal rate, indicating that the Tl center captures an electron from the conduction band. All these results are accounted for by the introduction of negatively charged vacancies at silicon sublattice sites in 3C-SiC by the irradiation.

2003 ◽  
Vol 786 ◽  
Author(s):  
A. L. Stesmans ◽  
V.V. Afanas'ev

ABSTRACTElectron spin resonance (ESR) analysis of (100)Si/SiOx/ZrO2, (100)Si/Al2O3 and Si/HfO2 structures with nm-thin dielectric layers deposited by different chemical vapor deposition procedures reveals, after hydrogen detachment, the presence of the trivalent Si dangling-bond-type centers Pb0, Pb1 as prominent defects in all entities. This Pb0, Pb1 fingerprint, generally unique for the thermal (100)Si/SiO2 interface, indicates that the as-deposited (100)Si/metal oxides interface is basically Si/SiO2-like. Though sensitive to the deposition process, the Pb0 density is found to be substantially larger than in standard (100)Si/SiO2. As probed by the Pb- type center properties, the Si/dielectric interfaces of all structures are under enhanced (unrelaxed) stress, typical for low temperature Si/SiO2 growth. Standard quality thermal Si/SiO2 properties in terms of Pb signature may be approached by appropriate annealing (≥ 650°C) in vacuum in the case of (100)Si/SiOx/ZrO2. Yet, O2 ambient appears required for Si/Al2O3 and Si/HfO2. It appears that Si/high-κ metal oxide structures with device grade quality interfaces can be realized with sub-nm thin SiOx interlayers. The density of fast interface states closely matches the Pb0 density variations, suggesting the center as the dominant fast interface trap. They may be efficiently passivated in H2 at 400 °C.


1953 ◽  
Vol 91 (5) ◽  
pp. 1066-1071 ◽  
Author(s):  
A. F. Kip ◽  
C. Kittel ◽  
R. A. Levy ◽  
A. M. Portis

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