Large Area 2-Dimensional a-Si:H Imaging Arrays

1992 ◽  
Vol 258 ◽  
Author(s):  
R. A. Street ◽  
I. Fujieda ◽  
R. Weisfield ◽  
S. Nelson ◽  
P. Nylen
Keyword(s):  
Visible Light ◽  
Amorphous Silicon ◽  
Electronic Noise ◽  
X Rays ◽  
Two Dimensional ◽  
Electronic Document ◽  
Dangling Bond ◽  
Large Area ◽  
Imaging Arrays ◽  
Array Performance

ABSTRACTSix inch diagonal, two-dimensional amorphous silicon imaging arrays with 256×240 pixels of 450 micron pitch have been fabricated. Examples of images made under visible light and X-rays illustrate applications to electronic document input and medical imaging. The limits to the array performance are explored through studies of image lag due to deep trapping at dangling bond defects in the a-Si:H sensor, and through measurements of electronic noise.

Considerations for High Frame Rate Operation of Two-Dimensional a-Si:H Imaging Arrays

1993 ◽  
Vol 297 ◽  
Author(s):  
L.E. Antonuk ◽  
J. Yorkston ◽  
W. Huang ◽  
J. Siewerdsen ◽  
R.A. Street
Keyword(s):  
Amorphous Silicon ◽  
Frame Rate ◽  
Two Dimensional ◽  
Large Area ◽  
Array Design ◽  
Imaging Arrays ◽  
X Ray ◽  
High Frame Rate ◽  
X Ray Imaging ◽  
Silicon Arrays

Large area, two-dimensional, amorphous silicon arrays are under development for x-ray imaging applications. Theoretical limits on frame rates imposed by array design and operational requirements are examined. Measurements of image lag as a function of frame rate are reported.

Amorpiious Silicon Thin Film Transistor and its Applications to Large-Area Electironics

1984 ◽  
Vol 33 ◽  
Author(s):  
H. C. Tuan
Keyword(s):  
Thin Film ◽  
Amorphous Silicon ◽  
Thin Film Transistor ◽  
Two Dimensional ◽  
Large Area ◽  
Silicon Thin Film

ABSTRACTIn this paper, the amorphous silicon thin film transistor (a-Si:HTFT) technology is reviewed. Its applications to both one- and two-dimensional large-area devices are described. The issues related to the fabrication of TFT arrays on large-area substrates are also discussed.

MicroGap Area Detector for Stress and Texture Analysis

2011 ◽  
Vol 681 ◽  
pp. 19-24
Author(s):  
Bob B. He
Keyword(s):  
Texture Analysis ◽  
High Performance ◽  
High Efficiency ◽  
X Rays ◽  
Two Dimensional ◽  
X Ray Diffraction ◽  
Large Area ◽  
Ray Optics ◽  
X Ray ◽  
Area Detector

Two-dimensional x-ray diffraction is an ideal method for examining the residual stress and texture. The most dramatic development in two-dimensional x-ray diffractometry involves three critical devices, including x-ray sources, x-ray optics and detectors. The recent development in brilliant x-rays sources and high efficiency x-ray optics provided high intensity x-ray beam with the desired size and divergence. Correspondingly, the detector used in such a high performance system requires the capability to collect large two-dimensional images with high counting rate and high resolution. This paper introduces the diffraction vector approach in two-dimensional x-ray diffraction for stress and texture analysis, and an innovative large area detector based on the MikroGap™ technology.

Amorphous silicon detector and thin film transistor technology for large-area imaging of X-rays

2000 ◽  
Vol 31 (11-12) ◽  
pp. 883-891 ◽  
Author(s):  
A Nathan ◽  
B Park ◽  
A Sazonov ◽  
S Tao ◽  
I Chan ◽  
...  
Keyword(s):  
Thin Film ◽  
Amorphous Silicon ◽  
Thin Film Transistor ◽  
Silicon Detector ◽  
X Rays ◽  
Large Area

Studies of metaphase chromosomes in the scanning transmission x-ray microscope: Image fidelity, radiation damage and specimen preparation

1992 ◽  
Vol 50 (2) ◽  
pp. 1038-1039
Author(s):  
Shawn Williams ◽  
Xiaodong Zhang ◽  
Susan Lamm ◽  
Jack Van’t Hof
Keyword(s):  
Visible Light ◽  
Radiation Damage ◽  
Cross Section ◽  
Imaging Techniques ◽  
Dose Range ◽  
Specimen Preparation ◽  
X Rays ◽  
Metaphase Chromosomes ◽  
X Ray ◽  
Scanning Transmission

The Scanning Transmission X-ray Microscope (STXM) is well suited for investigating metaphase chromosome structure. The absorption cross-section of soft x-rays having energies between the carbon and oxygen K edges (284 - 531 eV) is 6 - 9.5 times greater for organic specimens than for water, which permits one to examine unstained, wet biological specimens with resolution superior to that attainable using visible light. The attenuation length of the x-rays is suitable for imaging micron thick specimens without sectioning. This large difference in cross-section yields good specimen contrast, so that fewer soft x-rays than electrons are required to image wet biological specimens at a given resolution. But most imaging techniques delivering better resolution than visible light produce radiation damage. Soft x-rays are known to be very effective in damaging biological specimens. The STXM is constructed to minimize specimen dose, but it is important to measure the actual damage induced as a function of dose in order to determine the dose range within which radiation damage does not compromise image quality.

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

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