The Roles of Stress, Geometry and Orientation on Misfit Dislocations Kinetics and Energetics in Epitaxial Strained Layers.

1991 ◽  
Vol 239 ◽  
Author(s):  
R. Hull ◽  
J. C. Bean ◽  
F. Ross ◽  
D. Bahnck ◽  
L. J. Pencolas
Keyword(s):  
Misfit Dislocation ◽  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Misfit Dislocations ◽  
Slip Systems ◽  
Strained Layers ◽  
Burgers Vector ◽  
Partial Dislocations ◽  
Strain Stress ◽  
Kinetics Of

ABSTRACTThe geometries, microstructures, energetics and kinetics of misfit dislocations as functions of surface orientation and the magnitude of strain/stress are investigated experimentally and theoretically. Examples are drawn from (100), (110) and (111) surfaces and from the GexSi1–x/Si and InxGa1–x/GaAs systems. It is shown that the misfit dislocation geometries and microstructures at lattice mismatch stresses < - 1GPa may in general be predicted by operation of the minimum magnitude Burgers vector slipping on the widest spaced planes. At stresses of the order several GPa, however, new dislocation systems may become operative with either modified Burgers vectors or slip systems. Dissociation of totál misfit dislocations into partial dislocations is found to play a crucial role in strain relaxation, on surfaces other than (100) under compressive stress.

Strain Relaxation in GaN/AlN Films Grown on Vicinal and On-Axis SiC Substrates

2006 ◽  
Vol 527-529 ◽  
pp. 1513-1516
Author(s):  
J. Bai ◽  
X. Huang ◽  
Balaji Raghothamachar ◽  
Michael Dudley ◽  
B. Wagner ◽  
...  
Keyword(s):  
High Resolution ◽  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Crystalline Quality ◽  
Misfit Dislocations ◽  
Vicinal Surface ◽  
Burgers Vector ◽  
Surface Steps ◽  
Transmission Electron ◽  
Initial Stage

Strain relaxation in the GaN/AlN/6H-SiC epitaxial system grown by vicinal surface epitaxy (VSE) is investigated and compared with that in on-axis epitaxy. High resolution x-ray diffraction (HRXRD) measurements show that GaN films grown by VSE have improved crystalline quality. High resolution transmission electron microscope (HRTEM) studies reveal that there are two types of misfit dislocations (MDs) at AlN/6H-SiC interfaces: 60˚ complete dislocations along <1120 > directions with Burgers vector 1/3<1120 > and 60˚ Shockley partials along <10 10 > directions with Burgers vector 1/3<10 10 >. The latter are usually geometrical partial misfit dislocations (GPMDs) that are dominant in VSE to accommodate the lattice mismatch and stacking sequence mismatch simultaneously. In VSE, it is the high-density GPMDs formed at the vicinal surface steps that facilitate rapid strain relaxation at the initial stage of deposition and hence lead to superior crystalline quality of the subsequently grown GaN films.

Mechanisms and Kinetics of Misfit Dislocation Formation in Heteroepitaxial Thin Films

1990 ◽  
Vol 188 ◽  
Author(s):  
W. D. Nix ◽  
D. B. Noble ◽  
J. F. Turlo
Keyword(s):  
Misfit Dislocation ◽  
Strain Relaxation ◽  
Dislocation Motion ◽  
Dislocation Nucleation ◽  
Dislocation Segment ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
Film Substrate ◽  
Kinetics Of ◽  
Dislocation Formation

ABSTRACTThe mechanisms and kinetics of forming misfit dislocations in heteroepitaxial films are studied. The critical thickness for misfit dislocation formation can be found by considering the incremental extension of a misfit dislocation by the movement of a “threading” dislocation segment that extends from the film/substrate interface to the free surface of the film. This same mechanism allows one to examine the kinetics of dislocation motion and to illuminate the importance of dislocation nucleation and multiplication in strain relaxation. The effects of unstrained epitaxial capping layers on these processes are also considered. The major effects of such capping layers are to inhibit dislocation nucleation and multiplication. The effect of the capping layer on the velocity of the “threading” dislocation is shown to be small by comparison.A new substrate curvature technique for measuring the strain and studying the kinetics of strain relaxation in heteroepitaxial films is also briefly described.

Very Thick Coherently Strained GexSi1−x Layers Grown in a Narrow Temperature Window

1991 ◽  
Vol 220 ◽  
Author(s):  
C. H. Chern ◽  
K. L. Wang ◽  
G. Bai ◽  
M. -A. Nicolet
Keyword(s):  
Growth Temperature ◽  
Strain Relaxation ◽  
Gas Pressure ◽  
High Density ◽  
Misfit Dislocations ◽  
High Quality ◽  
Strained Layers ◽  
Temperature Window ◽  
Residual Gas

ABSTRACTStrain relaxation of GexSi1−x layers is studied as a function of growth temperature. Extremely thick coherently strained layers whose thicknesses exceed more than fifty times of the critical thicknesses predicted by Matthews and Blakeslee's model were successfully grown by MBE. There exits a narrow temperature window from 310 °C to 350 °C for growing this kind of high quality thick strained layers. Below this temperature window, the layers are poor in quality as indicated from RHEED patterns. Above this window, the strain of the layers relaxes very fast accompanied with a high density of misfit dislocations as the growth temperature increases. Moreover, for samples grown in this temperature window, the strain relaxation shows a dependence of the residual gas pressure, which has never been reported before.

Stress Relaxation in Uniquely Oriented SiGe/Si Epitaxial Layers

1999 ◽  
Vol 594 ◽  
Author(s):  
M. E. Ware ◽  
R. J. Nemanich
Keyword(s):  
Stress Relaxation ◽  
Surface Morphology ◽  
Strain Relaxation ◽  
Epitaxial Layers ◽  
Misfit Dislocations ◽  
Strained Layers ◽  
Force Microscopy ◽  
Si Substrates ◽  
Atomic Force ◽  
Deposited Films

AbstractThis study explores stress relaxation of epitaxial SiGe layers grown on Si substrates with unique orientations. The crystallographic orientations of the Si substrates used were off-axis from the (001) plane towards the (111) plane by angles, θ = 0, 10, and 22 degrees. We have grown 100nm thick Si(1−x) Ge(x) epitaxial layers with x=0.3 on the Si substrates to examine the relaxation process. The as-deposited films are metastable to the formation of strain relaxing misfit dislocations, and thermal annealing is used to obtain highly relaxed films for comparison. Raman spectroscopy has been used to measure the strain relaxation, and atomic force microscopy has been used to explore the development of surface morphology. The Raman scattering indicated that the strain in the as-deposited films is dependent on the substrate orientation with strained layers grown on Si with 0 and 22 degree orientations while highly relaxed films were grown on the 10 degree substrate. The surface morphology also differed for the substrate orientations. The 10 degree surface is relatively smooth with hut shaped structures oriented at predicted angles relative to the step edges.

CBED Investigations of Mesoscopic Semiconductor Structures

1999 ◽  
Vol 5 (S2) ◽  
pp. 208-209
Author(s):  
H. Lakner ◽  
F. Schulze-Kraasch ◽  
C. Mendorf ◽  
G. Brockt
Keyword(s):  
High Speed ◽  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Local Strain ◽  
Tetragonal Distortion ◽  
Strained Layers ◽  
Spatially Resolved ◽  
Relaxation Effects ◽  
Convergent Beam ◽  
Induced Defects

Ternary and quaternary heterostructures from III-V-semiconductors get more and more importance in the fabrication of high-speed/high frequency devices in telecommunication systems. One of the key parameters for the performance of such devices is the crystalline quality and especially the amount of tetragonal distortion in strained layers on a nanometer scale. Strain can cause problems for the growth of such layers like relaxation induced defects, especially for the case of a high value of lattice mismatch. However, strain and the associated influence on the band structure can be used consciously for the design of tailor-made heterostructures (band gap engineering). Therefore, the spatially resolved investigation of local crystal properties (tetragonal distortion or strain and strain relaxation) is a key tool for the characterization of strained layers.Convergent beam electron diffraction (CBED) patterns and convergent beam imaging (CBIM) can be used to evaluate informations on the local crystalline structure. E.g. the position of the High Order Laue Zone (HOLZ) lines in the CBED patterns is sensitive to the local strain and therefore can be used to determine strain and relaxation effects in heterostructures quantitatively. But in practice the applicability of CBED is often limited by a lack of ultimate spatial resolution and/or of sensitivity.

Misfit Dislocations at II-VI/GaAs Interfaces

1990 ◽  
Vol 183 ◽  
Author(s):  
A. F. Schwartzman
Keyword(s):  
Lattice Mismatch ◽  
High Resolution Electron Microscopy ◽  
Interfacial Structure ◽  
Misfit Dislocations ◽  
Extended Defects ◽  
Partial Dislocations ◽  
Resolution Electron ◽  
Before And After ◽  
Slip Planes ◽  
Efficient Type

AbstractHigh-resolution electron microscopy -is used to characterize the defect structure of CdTe/GaAs and ZnTe/GaAs heterojunctions before and after annealing. For as-deposited films, a variety of defects exist both in the form of perfect misfit dislocations at the interface and extended defects into the thin film. The extended defects result from dissociation of 60° dislocations and reactions between perfect and partial dislocations lying on intersecting slip planes. The annealed interfaces consist of a periodic array of perfect edge Lomer dislocations, the most efficient type of misfit dislocation for accomodating the lattice mismatch, 14.6 % for CdTe/GaAs and 8 % for ZnTe/GaAs. In both cases, the spacing between dislocations corresponds to the value predicted for completely strain-free thin fims, 31 and 54 Å for CdTe and ZnTe respectively. This paper concentrates on the different dislocation reactions which transform the interfacial structure from the as-deposited case to the annealed case.

Effect of C and Ge Concentration On The Thermal Stability of RTCVD Grown Si1-x-yGexCy Alloys

1997 ◽  
Vol 470 ◽  
Author(s):  
Patricia Warren ◽  
Stephane Retzmanick ◽  
Martin Gotza ◽  
Marc Begems
Keyword(s):  
Lattice Constant ◽  
Strain Relaxation ◽  
Mechanical Strain ◽  
Chemical Vapor ◽  
Misfit Dislocations ◽  
X Ray Diffraction ◽  
Cubic Silicon Carbide ◽  
Kinetics Of ◽  
Good Agreement

ABSTRACTSi / Si1-x-yGexCy / Si heterostructures containing up to 17 at.% Ge and 1.9 at.% C were grown on (001) silicon by low pressure Rapid Thermal Chemical Vapor Deposition, using a mixture of silane, germane and methylsilane, diluted in hydrogen. The samples were then annealed in a Rapid Thermal Processing furnace, under an atmospheric pressure of nitrogen, at temperatures ranging from 900 to 1130 °C.The samples were characterized using infrared spectroscopy and x-ray diffraction. SIMS profiling and TEM observation were performed on some of the samples.Substitutional C gradually disappeared, either precipitating out to form cubic silicon carbide (β-SiC), or simply vanishing into interstitial positions. In any case, the in-plane lattice constant remained constant after annealing, indicating that there was no mechanical strain relaxation by formation of misfit dislocations. The perpendicular lattice constant increased due to the decrease in substitutional C concentration, as well as it decreased due to the germanium out-diffusion. This variation of the strain during annealing was modeled, and allowed the determination of the kinetics of the substitutional carbon disappearance. The same behavior was observed for all samples. Indeed, the Cs disappearance rate was always increased for samples with higher initial Ge and C concentrations. The kinetics of this precipitation was found in very good agreement with previous published results.

Rapid Thermal Processing of Buried Sil−xGex Strained Layers; Photoluminescence Decay and Misfit Dislocation Generation.

1990 ◽  
Vol 198 ◽  
Author(s):  
D.C. Houghton ◽  
N.L. Rowell
Keyword(s):  
Quantum Wells ◽  
Misfit Dislocation ◽  
Thermal Processing ◽  
Internal Quantum Efficiency ◽  
Dislocation Nucleation ◽  
Multiple Quantum ◽  
Misfit Dislocations ◽  
Dislocation Generation ◽  
Strained Layers ◽  
Wide Range

ABSTRACTThe thermal constraints for device processing imposed by strain relaxation have been determined for a wide range of Si-Ge strained heterostructures. Misfit dislocation densities and glide velocities in uncapped Sil-xGex alloy layers, Sil-xGex single and multiple quantum wells have been measured using defect etching and TEM for a range of anneal temperatures (450°C-1000°C) and anneal times (5s-2000s). The decay of an intense photoluminescence peak (∼ 10% internal quantum efficiency ) from buried Si1-xGex strained layers has been correlated with the generation of misfit dislocations in adjacent Sil-xGex /Si interfaces. The misfit dislocation nucleation rate and glide velocity for all geometries and alloy compositions (0<x<0.25) were found to be thermally activated processes with activation energies of (2.5±0.2)eV and (2.3-0.65x)eV, respectively. The time-temperature regime available for thermal processing is mapped out as a function of dislocation density using a new kinetic model.

Equilibrium Analysis of Lattice-Mismatched Nanowire Heterostructures

2002 ◽  
Vol 737 ◽  
Author(s):  
E. Ertekin ◽  
P.A. Greaney ◽  
T. D. Sands ◽  
D. C. Chrzan
Keyword(s):  
Simple Model ◽  
Misfit Dislocation ◽  
Critical Thickness ◽  
Lattice Mismatch ◽  
Equilibrium Analysis ◽  
Misfit Dislocations ◽  
Model Based ◽  
Large Lattice ◽  
Large Lattice Mismatch

ABSTRACTThe quality of lattice-mismatched semiconductor heterojunctions is often limited by the presence of misfit dislocations. Nanowire geometries offer the promise of creating highly mismatched, yet dislocation free heterojunctions. A simple model, based upon the critical thickness model of Matthews and Blakeslee for misfit dislocation formation in planar heterostructures, illustrates that there exists a critical nanowire radius for which a coherent heterostructured nanowire system is unstable with respect to the formation of misfit dislocations. The model indicates that within the nanowire geometry, it should be possible to create perfect heterojunctions with large lattice-mismatch.

Microstructural and Electrical Characterization of Misfit Dislocations at the InAs/GaP Heterointerface

1997 ◽  
Vol 500 ◽  
Author(s):  
V. Gopal ◽  
T. P. Chin ◽  
A. L. Vasiliev ◽  
J. M. Woodall ◽  
E. P. Kvam
Keyword(s):  
Misfit Dislocation ◽  
Lattice Mismatch ◽  
Electrical Characterization ◽  
Growth Conditions ◽  
Misfit Dislocations ◽  
Ir Detectors ◽  
Mbe Growth ◽  
Transmission Electron ◽  
Hall Effect Measurements ◽  
Edge Dislocations

ABSTRACTInAs is a narrow band gap semiconductor with potential for such applications as IR detectors, low temperature transistors, etc‥ However, the lack of suitable substrates has hampered progress in the development of InAs based devices. In the present study, InAs was grown by Molecular Beam Epitaxy on (001) GaP substrates. Though this system has a high lattice mismatch, (∼11%), certain MBE growth conditions result in 80% relaxed InAs layers on GaP with the mismatch accommodated predominantly by 90° pure edge dislocations. Misfit dislocation microstructures were studied using Transmission Electron Microscopy. Electrical characterization using lateral conductance and Hall effect measurements were also performed. Preliminary results indicate the possibility of misfit dislocation related conductivity. The possible correlation between interface structure and electrical properties is discussed.

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