Analysis Of Oxygen Distribution In Interfaces In SiC Whisker Reinforced Si3 N4-Based Composites.

1991 ◽  
Vol 238 ◽  
Author(s):  
K. Das Chowdihury ◽  
R. W. Carpenter ◽  
W. Braue
Keyword(s):  
Silicon Carbide ◽  
Silicon Nitride ◽  
High Resolution ◽  
Grain Boundary ◽  
Oxygen Distribution ◽  
Interfacial Layers ◽  
Silicon Carbide Whisker ◽  
Resolution Electron ◽  
Analytical Microscopy ◽  
Electron Imaging

ABSTRACTDiscontinuous and continuous interfacial layers at the whisker/matrix and grain boundary interfaces in silicon carbide whisker reinforced silicon nitride based composites were investigated by high resolution electron imaging and analytical microscopy. Wide differences in chemical and structural widths of the interfaces were observed.

High-resolution Electron Microscopy Observation of Grain-boundary Films in Superplastically Deformed Silicon Nitride

2000 ◽  
Vol 15 (7) ◽  
pp. 1551-1555 ◽  
Author(s):  
Guo-Dong Zhan ◽  
Mamoru Mitomo ◽  
Yuichi Ikuhara ◽  
Taketo Sakuma
Keyword(s):  
Electron Microscopy ◽  
Silicon Nitride ◽  
High Resolution ◽  
Grain Boundary ◽  
Applied Stress ◽  
Thickness Distribution ◽  
High Resolution Electron Microscopy ◽  
Stress Axis ◽  
Resolution Electron ◽  
Boundary Films

The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β–silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grains and the existence of percolating load-bearing paths through the microstructure.

High-Resolution Electron Microscopy Observations of Grain-Boundary Films in Silicon Nitride Ceramics

1992 ◽  
Vol 287 ◽  
Author(s):  
H.-J. Kleebe ◽  
M. K. Cinibulk ◽  
I. Tanaka ◽  
J. Bruley ◽  
R. M. Cannon ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Silicon Nitride ◽  
High Resolution ◽  
Grain Boundary ◽  
Film Thickness ◽  
High Resolution Electron Microscopy ◽  
Resolution Electron ◽  
Nitride Ceramics ◽  
Boundary Films ◽  
Repulsive Forces

ABSTRACTCharacterization of silicon nitride ceramics by transmission electron microscopy (TEM) provides structural and compositional information on intergranular phases necessary to elucidate the factors that can influence the presence and thickness of grain-boundary films. Different TEM techniques can be used for the detection and determination of intergranular-film thickness, however, the most accurate results are obtained by high-resolution electron microscopy (HREM). HREM studies were applied, in conjunction with analytical electron microscopy, to investigate the correlation between intergranular-phase composition and film thickness. Statistical analyses of a number of grain-boundary films provided experimental verification of a theoretical equilibrium film thickness. Model experiments on a high-purity Si3N4 material, doped with low amounts of Ca, suggest the presence of two repulsive forces, a steric force and a force produced by an electrical double layer, that may act to balance the attractive van der Waals force necessary to establish an equilibrium film thickness.

A TEM investigation of silicon nitride whiskers

1987 ◽  
Vol 45 ◽  
pp. 160-161
Author(s):  
Tapan Roy
Keyword(s):  
Silicon Nitride ◽  
High Resolution ◽  
Ceramic Matrix Composites ◽  
High Resolution Electron Microscopy ◽  
Molten Silicon ◽  
Matrix Composites ◽  
Ceramic Fibers ◽  
Resolution Electron ◽  
Point To Point ◽  
Technological University

Ceramic fibers are being used to improve the mechanical properties of metal matrix and ceramic matrix composites. This paper reports a study of the structural and other microstructural characteristics of silicon nitride whiskers using both conventional TEM and high resolution electron microscopy.The whiskers were grown by T. E. Scott of Michigan Technological University, by passing nitrogen over molten silicon in the presence of a catalyst. The whiskers were ultrasonically dispersed in chloroform and picked up on holey carbon grids. The diameter of some whiskers (<70nm) was small enough to allow direct observation without thinning. Conventional TEM was performed on a Philips EM400T while high resolution imaging was done on a JEOL 200CX microscope with a point to point resolution of 0.23nm.

Structural Transformation of a Germanium Σ=13 (510) [001] Tilt Grain Boundary under the Electron Beam

1990 ◽  
Vol 48 (1) ◽  
pp. 52-53 ◽  
Author(s):  
Jean-Luc Rouvière ◽  
Alain Bourret
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Grain Boundary ◽  
Structural Transformation ◽  
Mirror Symmetry ◽  
High Resolution Electron Microscopy ◽  
Structural Transformations ◽  
Covalent Bonds ◽  
Resolution Electron ◽  
Tilt Grain Boundary

The possible structural transformations during the sample preparations and the sample observations are important issues in electron microscopy. Several publications of High Resolution Electron Microscopy (HREM) have reported that structural transformations and evaporation of the thin parts of a specimen could happen in the microscope. Diffusion and preferential etchings could also occur during the sample preparation.Here we report a structural transformation of a germanium Σ=13 (510) [001] tilt grain boundary that occurred in a medium-voltage electron microscopy (JEOL 400KV).Among the different (001) tilt grain boundaries whose atomic structures were entirely determined by High Resolution Electron Microscopy (Σ = 5(310), Σ = 13 (320), Σ = 13 (510), Σ = 65 (1130), Σ = 25 (710) and Σ = 41 (910), the Σ = 13 (510) interface is the most interesting. It exhibits two kinds of structures. One of them, the M-structure, has tetracoordinated covalent bonds and is periodic (fig. 1). The other, the U-structure, is also tetracoordinated but is not strictly periodic (fig. 2). It is composed of a periodically repeated constant part that separates variable cores where some atoms can have several stable positions. The M-structure has a mirror glide symmetry. At Scherzer defocus, its HREM images have characteristic groups of three big white dots that are distributed on alternatively facing right and left arcs (fig. 1). The (001) projection of the U-structure has an apparent mirror symmetry, the portions of good coincidence zones (“perfect crystal structure”) regularly separate the variable cores regions (fig. 2).

Characterization of Tilt Boundaries by Ultra High Resolution Electron Microscopy

1984 ◽  
Vol 41 ◽  
Author(s):  
W. Krakow ◽  
J. T. Wetzel ◽  
D. A. Smith ◽  
G. Trafas
Keyword(s):  
High Resolution ◽  
Grain Boundary ◽  
Structural Information ◽  
Theoretical Work ◽  
High Resolution Electron Microscopy ◽  
Point Of View ◽  
Experimental Point ◽  
Structure Information ◽  
Resolution Electron ◽  
Tilt Boundaries

AbstractA high resolution electron microscope study of grain boundary structures in Au thin films has been undertaken from both a theoretical and experimental point of view. The criteria necessary to interpret images of tilt boundaries at the atomic level, which include electron optical and specimen effects, have been considered for both 200kV and the newer 400kV medium voltage microscopes. So far, the theoretical work has concentrated on two different [001] tilt bounda-ries where a resolution of 2.03Å is required to visualize bulk lattice structures on either side of the interface. Both a high angle boundary, (210) σ=5, and a low angle boundary, (910) σ=41, have been considered. Computational results using multislice dynamical diffraction and image simulations of relaxed bounda-ries viewed edge-on and with small amounts of beam and/or specimen inclina-tion have been obtained. It will be shown that some structural information concerning grain boundary dislocations can be observed at 200kV. However, many difficulties occur in the exact identification of the interface structure viewed experimentally for both [001] and [011] boundaries since the resolution required is near the performance limit of a 200kV microscope. The simulated results at 400kV indicate a considerable improvement will be realized in obtain-ing atomic structure information at the interface.

Ion-Induced Bending with Applications for High-Resolution Electron Imaging of Nanometer-Sized Samples

2021 ◽  
Author(s):  
Shuo Zhang ◽  
Vivek Garg ◽  
Gediminas Gervinskas ◽  
Ross K.W. Marceau ◽  
Emily Chen ◽  
...  
Keyword(s):  
High Resolution ◽  
Resolution Electron ◽  
Electron Imaging
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