Interfacial Reactions between In/Pd and GaAs

1991 ◽  
Vol 230 ◽  
Author(s):  
Z. Ma ◽  
L. H. Allen ◽  
B. Blanpain ◽  
Q. Z. Hong ◽  
J. W. Mayer ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Annealing Temperature ◽  
Interfacial Microstructure ◽  
Limiting Factor ◽  
X Ray Diffraction ◽  
X Ray ◽  
Ohmic Behavior ◽  
Sims Analysis ◽  
Secondary Ion

AbstractInterfacial microstructure of In/Pd ohmic contacts to n-GaAs was studied by various X-ray diffraction techniques and secondary ion mass spectroscopy (SIMS). Analysis of this interface after various annealing showed that In1-xGaxAs compounds are formed at the interface and the composition of these compounds depends upon the annealing temperature. As the temperature increases, the stoichiometry of the Inrich compounds tends toward higher concentrations of Ga. The low contact resistance is achieved by dividing the Schottky barrier between metal and GaAs into two barriers due to metal/Inl-xGaxAs and In1-xGaxAs/GaAs. The barrier due to In1-xGaxAs/GaAs is believed to be the main limiting factor in lowering of contact resistance. The observed ohmic behavior for sample annealed at 500°C for 20 s is attributed to the further reduction of this barrier.

The Reliability of Multilevel Metallization on InGaAs/GaAs Layers

1994 ◽  
Vol 337 ◽  
Author(s):  
Edward Y. Chang ◽  
J.S. Chen ◽  
J.W. Wu ◽  
K.C. Lin
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Molecular Beam ◽  
Specific Contact Resistance ◽  
Transmission Line Model ◽  
X Ray Diffraction ◽  
X Ray ◽  
Specific Contact ◽  
Secondary Ion ◽  
Contact Metal

ABSTRACTNon-alloyed ohmic contacts using Ti/Pt/Au and Ni/Ge/Au on InGaAs/GaAs layers grown by Molecular Beam Epitaxy (MBE) have been investigated. The n-type InGaAs film has a doping concentration higher than 1X1019 cm-3. Specific contact resistance below 2X10-7 Ωcm2 could be easily achieved with Ti/Pt/Au. Due to the layer intermixing and outdiffusion of In and Ga, the specific contact resistance and sheet resistance increase after thermal treatment. When Ni/Ge/Au is used as the contact metal, the outdiffusion of In and Ga atoms is more severe than that of Ti/Pt/Au. After annealing at 450°C for two minutes, the Au4In formed and the characteristics of the contact became worse. All the phenomena illustrated above have been observed and investigated by Transmission Line Model, X-ray diffraction, Auger Electron Spectroscopy and Secondary Ion Mass Spectrum. As far as the thermal stability is concerned, it is convinced that Ti/Pt/Au is the best one of these two non-alloyed ohmic contact studied.

Phase Formation at Rapid Thermal Annealing of Nickel Contacts on C-Face n-Type 4H-SiC

2005 ◽  
Vol 483-485 ◽  
pp. 733-736 ◽  
Author(s):  
Sergio Ferrero ◽  
A. Albonico ◽  
Umberto M. Meotto ◽  
G. Rambolà ◽  
Samuele Porro ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Ohmic Contacts ◽  
Structural Evolution ◽  
Auger Spectroscopy ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
X Ray ◽  
Ohmic Behavior ◽  
Semiconductor Interfaces

In this work we report an analysis on Ni/4H-SiC interfaces aimed at optimizing the ohmic contacts. Several thermal cycles have been performed by rapid thermal annealing checking the possible chemical reactions at the metal semiconductor interfaces. Micro x-ray diffraction and micro Raman techniques have been performed in order to study the interface micro structural evolution. Inter diffusion of each element at the Ni - SiC interface was examined using Auger spectroscopy. Electrical measurements have been performed in order to check the ohmic behavior of the contacts. Finally, a correlation between microstructures evolution and electrical behaviors is reported.

Phase Formation in Ti-Al-N MAX-Phase Contacts to GaN

2009 ◽  
Vol 615-617 ◽  
pp. 947-950 ◽  
Author(s):  
Michał A. Borysiewicz ◽  
Eliana Kamińska ◽  
Anna Piotrowska ◽  
Iwona Pasternak ◽  
Rafał Jakieła ◽  
...  
Keyword(s):  
Thin Film ◽  
Mass Spectrometry ◽  
Phase Formation ◽  
Ohmic Contacts ◽  
Secondary Ion Mass Spectrometry ◽  
Max Phase ◽  
X Ray Diffraction ◽  
Max Phases ◽  
X Ray ◽  
Secondary Ion

Presented are the results of studies on Ti-Al-N MAX phase formation in thin film multilayers of Ti, Al and TiN deposited on n-type GaN by magnetron sputtering. Two approaches to phase formation are shown, annealing Ti-Al-TiN multilayers at 600oC in argon and annealing Ti/Al multilayers at 600oC in nitrogen. Samples are characterized by means of High Resolution X-Ray Diffraction and Secondary Ion Mass Spectrometry profiling. As MAX phases are very stable at high temperatures the potential of their application as ohmic contacts to n-GaN devices is discussed.

Study of Molybdenum-Alusil Interdiffusion Kinetics and Contact Resistance for VLSI Applications

1985 ◽  
Vol 54 ◽  
Author(s):  
R. N. Singh ◽  
D. M. Brown ◽  
M. J. Kim ◽  
G. A. Smith
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Contact Resistance ◽  
Mass Spectroscopy ◽  
X Ray Diffraction ◽  
Compound Formation ◽  
X Ray ◽  
Interdiffusion Kinetics ◽  
Secondary Ion ◽  
Complete Transformation

ABSTRACTInterdiffusion barrier characteristics of molybdenum thin films with Alusil(Al-1% Si) is studied between 733 and 7 63 K via sheet and contact resistance measurements, Rutherford backseattering spectrometry, secondary ion mass spectroscopy, and x-ray diffraction analysis. The results indicate that thermal annealing of Mo/Alusil thin film couples leads to MoAl compound formation initially as a nonplanar front, but extensive annealing results in complete transformation of Alusil to MoAl12 and a significant increase in contact resistance. The interdiffusion kinetics is studied and implications of these observations to VLSI device characteristics is discussed. Based on these results a safe time-temperature processing regime is proposed.

The EFfects of Elemental Sequence and Pairing on Interdiffusion and Phase Formation of Al-Ge-Ni Ohmic Contacts for (001) GaAs

1993 ◽  
Vol 300 ◽  
Author(s):  
W. V. Lampert ◽  
T. W. Haas ◽  
Paul H. Holloway
Keyword(s):  
Thin Film ◽  
Phase Formation ◽  
Thermal Processing ◽  
Ohmic Contacts ◽  
Treatment Time ◽  
X Ray Diffraction ◽  
X Ray ◽  
Ohmic Behavior ◽  
Contact Metallization ◽  
Time Required

ABSTRACTThe growth sequence of Al, Ge, and Ni metals has been shown to dramatically affect the amount of heat treatment time required to convert the ohmic contact metallization from Schottky to ohmic behavior. Interpretation of interdiffusion and phase formation of the Al-Ge, Al-Ni, or Ni-Ge thin film couples were measured. Auger depth profiles and thin film X-ray diffraction were used to determine interdiffusion and phase formation resulting from various types of thermal processing. The effects of interdiffusion and formation of phases such as Ni-Ga, Ni-As, Ni-Ga-Ge, and Ni-As-Ge from the two element metallizations on GaAs will be used to explain the origin of ohmic behavior for the ternary Al-Ge-Ni contacts to GaAs.

TEM Studies and Contact Resistance of Au/Ni/Ti/Ta/n-GaN Ohmic Contacts

2003 ◽  
Vol 764 ◽  
Author(s):  
D.N. Zakharov ◽  
Z. Liliental-Weber ◽  
A. Motayed ◽  
S.N. Mohammad
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
High Resolution Electron Microscopy ◽  
X Ray ◽  
Electron Energy Loss Spectrometry ◽  
Resolution Electron ◽  
Order Of Magnitude ◽  
Contact Surfaces ◽  
Electron Energy Loss ◽  
Magnitude Difference

AbstractOhmic Ta/Ti/Ni/Au contacts to n-GaN have been studied using high resolution electron microscopy (HREM), energy dispersive X-ray spectrometry (EDX) and electron energy loss spectrometry (EELS). Two different samples were used: A - annealed at 7500C withcontact resistance 5×10-6 Ω cm2 and B-annealed at 7750C with contact resistance 6×10-5 Ω cm2. Both samples revealed extensive in- and out-diffusion between deposited layers with some consumption ofGaNlayerand formation of TixTa1-xN50 (0<x<25) at the GaN interface. Almost an order of magnitude difference in contact resistances can be attributed to structure and chemical bonding of Ti-O layers formed on the contact surfaces.

Improvement of the Specific Contact Resistance on P-Type 4H-SiC by Using a Highly P-Typed Doped 4H-SiC Layer Selectively Grown by VLS Transport

2014 ◽  
Vol 806 ◽  
pp. 57-60
Author(s):  
Nicolas Thierry-Jebali ◽  
Arthur Vo-Ha ◽  
Davy Carole ◽  
Mihai Lazar ◽  
Gabriel Ferro ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Schottky Barrier Height ◽  
Annealing Temperature ◽  
Process Condition ◽  
Specific Contact Resistance ◽  
High Doping Level ◽  
Annealing Temperatures ◽  
Specific Contact ◽  
P Type

This work reports on the improvement of ohmic contacts made on heavily p-type doped 4H-SiC epitaxial layer selectively grown by Vapor-Liquid-Solid (VLS) transport. Even before any annealing process, the contact is ohmic. This behavior can be explained by the high doping level of the VLS layer (Al concentration > 1020 cm-3) as characterized by SIMS profiling. Upon variation of annealing temperatures, a minimum value of the Specific Contact Resistance (SCR) down to 1.3x10-6 Ω.cm2 has been obtained for both 500 °C and 800 °C annealing temperature. However, a large variation of the SCR was observed for a same process condition. This variation is mainly attributed to a variation of the Schottky Barrier Height.

scholarly journals A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee
Keyword(s):  
Annealing Temperature ◽  
Phase Evolution ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
X Ray Diffraction ◽  
Temperature Coefficient Of Resistance ◽  
X Ray ◽  
High Entropy ◽  
Transmission Electron ◽  
Thin Film Resistors

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).

scholarly journals Effects of Thermal Annealing on the Properties of Zirconium-Doped MgxZn1−XO Films Obtained through Radio-Frequency Magnetron Sputtering

Membranes ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 373
Author(s):  
Wen-Yen Lin ◽  
Feng-Tsun Chien ◽  
Hsien-Chin Chiu ◽  
Jinn-Kong Sheu ◽  
Kuang-Po Hsueh
Keyword(s):  
Magnetron Sputtering ◽  
Radio Frequency ◽  
Photoelectron Spectroscopy ◽  
Annealing Temperature ◽  
Radio Frequency Magnetron ◽  
Radio Frequency Magnetron Sputtering ◽  
X Ray Diffraction ◽  
Free Electrons ◽  
X Ray ◽  
Mg Content

Zirconium-doped MgxZn1−xO (Zr-doped MZO) mixed-oxide films were investigated, and the temperature sensitivity of their electric and optical properties was characterized. Zr-doped MZO films were deposited through radio-frequency magnetron sputtering using a 4-inch ZnO/MgO/ZrO2 (75/20/5 wt%) target. Hall measurement, X-ray diffraction (XRD), transmittance, and X-ray photoelectron spectroscopy (XPS) data were obtained. The lowest sheet resistance, highest mobility, and highest concentration were 1.30 × 103 Ω/sq, 4.46 cm2/Vs, and 7.28 × 1019 cm−3, respectively. The XRD spectra of the as-grown and annealed Zr-doped MZO films contained MgxZn1−xO(002) and ZrO2(200) coupled with Mg(OH)2(101) at 34.49°, 34.88°, and 38.017°, respectively. The intensity of the XRD peak near 34.88° decreased with temperature because the films that segregated Zr4+ from ZrO2(200) increased. The absorption edges of the films were at approximately 348 nm under 80% transmittance because of the Mg content. XPS revealed that the amount of Zr4+ increased with the annealing temperature. Zr is a potentially promising double donor, providing up to two extra free electrons per ion when used in place of Zn2+.

The Evaluation of TiTe2 as a Diffusion Barrier in the Formation of Low Thermal Conductivity Nanolaminates with Bi2Te3 and Sb2Te3

2010 ◽  
Vol 74 ◽  
pp. 38-47
Author(s):  
Clay Mortensen ◽  
Paul Zschack ◽  
David C. Johnson
Keyword(s):  
Thermal Conductivity ◽  
Diffusion Barrier ◽  
Self Assembly ◽  
Low Temperatures ◽  
Annealing Temperature ◽  
The Self ◽  
High Angle ◽  
X Ray Diffraction ◽  
Amorphous Precursor ◽  
X Ray

The evolution of designed [(Ti-Te)]x[(Sb-Te)]y, [(Bi-Te)]x[(Sb-Te)]y, [(Ti-Te)]w[(Bi-Te)]x[(Sb-Te)]y and [(Ti-Te)]w[(Bi-Te)]x[(Ti-Te)]y[(Sb-Te)]z precursors were followed as a function of annealing temperature and time using both low and high angle x-ray diffraction techniques to probe the self assembly into nanolaminate materials. The [(Bi-Te)]x[(Sb-Te)]y precursors were found to interdiffuse at low temperatures to form a (BixSb1-x)2Te3 alloy. The [(Ti-Te)]x[(Bi-Te)]y and [(Ti-Te)]x[(Sb-Te)]y precursors formed ordered nanolaminates [{(TiTe2)}1.35]x[Bi2Te3]y and [{(TiTe2)}1.35]x[Sb2Te3]y respectively. The [(Ti-Te)]w[(Bi-Te)]x[(Sb-Te)]x precursors formed [{(TiTe2)}1.35]w[(Bi0.5Sb0.5)2Te3]2x nanolaminates on annealing, as the bismuth and antimony layers interdiffused. Over the range of TiTe2 thicknesses used in [(Ti-Te)]w[(Bi-Te)]x[(Ti-Te)]y[(Sb-Te)]z precursors, Bi and Sb were found to interdiffuse through the 2-4 nm thick Ti-Te layers, resulting in the formation of (BixSb1-x)2Te3 alloy layers as part of the final nanolaminated products. When the Bi-Te and Sb-Te thicknesses were equal in the amorphous precursors, symmetric [{(TiTe2)}1.35]m[(Bi0.5Sb0.5)2Te3]n nanolamiantes were formed. When the thicknesses of Bi-Te and Sb-Te layers were not equal in the amorphous precursor, asymmetric [(TiTe2)1.35]m[(BixSb1-x)2Te3]n[(TiTe2)1.35]m[(BixSb1-x)2Te3]p nanolaminates were formed. These results imply that to form (A)w(B)x(C)y nanolaminates using designed layered precursors all three components must be immiscible. To form (A)x(B)y(A)x(C)z nanolaminates, the components must be immiscible or the precursor to the A component and the A component itself must be an effective interdiffusion barrier preventing B and C from mixing.

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