scholarly journals Creep-Fatigue Behavior of Microelectronic Solder Joints

1991 ◽  
Vol 226 ◽  
Author(s):  
R.G. Ross ◽  
L.C. Wen ◽  
G.R. Mon ◽  
E. Jetter ◽  
J. Winslow
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Thermal Environment ◽  
Fatigue Behavior ◽  
Time To Failure ◽  
Test Fixture ◽  
Failure Data ◽  
Analytical Results ◽  
Creep Fatigue ◽  
Alloy Properties

AbstractEven at room temperature, solder joints exhibit both creep and fatigue behavior that is strongly dependent on solder joint configuration, the thermal environment, and the solder alloy properties. The microstructures of solder joints with up to 25 years of aging have been studied using SEM/EDS and metallographic techniques. Data are presented on grain growth and metallurgical composition versus aging time. A special non-linear finite element creep-fatigue simulation model has been developed, based on measured strain-rate hardness relationships, and used to analytically predict the effects of observed metallurgical changes and the effects of lead stiffness in solder joint creepfatigue interaction. To corroborate the analytical results, a special bi-metallic test fixture has been developed to accelerate the thermo-mechanical loading of solder joints in thermal cycling environments. Measured time-to-failure data for various electronicpackage lead configurations/stiffnesses, including gullwing and J-lead, are presented and shown to be in reasonable agreement with the analytical results.

scholarly journals Creep-Fatigue Behavior of Microelectronic Solder Joints

1991 ◽  
Vol 225 ◽  
Author(s):  
R. G. Ross ◽  
L. C. Wen ◽  
G. R. Mon ◽  
E. Jetter ◽  
J. Winslow
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Thermal Environment ◽  
Fatigue Behavior ◽  
Time To Failure ◽  
Test Fixture ◽  
Failure Data ◽  
Analytical Results ◽  
Creep Fatigue ◽  
Alloy Properties

ABSTRACTEven at room temperature, solder joints exhibit both creep and fatigue behavior that is strongly dependent on solder joint configuration, the thermal environment, and the solder alloy properties. The microstructures of solder joints with up to 25 years of aging have been studied using SEM/EDS and metallographic techniques. Data are presented on grain growth and metallurgical composition versus aging time. A special non-linear finite element creep-fatigue simulation model has been developed, based on measured strain-rate hardness relationships, and used to analytically predict the effects of observed metallurgical changes and the effects of lead stiffness in solder joint creepfatigue interaction. To corroborate the analytical results, a special bi-metallic test fixture has been developed to accelerate the thermo-mechanical loading of solder joints in thermal cycling environments. Measured time-to-failure data for various electronicpackage lead configurations/stiffnesses, including gullwing and J-lead, are presented and shown to be in reasonable agreement with the analytical results.

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Yanruoyue Li ◽  
Guicui Fu ◽  
Bo Wan ◽  
Zhaoxi Wu ◽  
Xiaojun Yan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Stresses ◽  
Solder Joints ◽  
Void Formation ◽  
Model Parameters ◽  
Time To Failure ◽  
Current Crowding ◽  
Theoretical Derivation ◽  
Content Type ◽  
And Migration

Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean-time-to-failure (MTTF) equation when joints are subjected to coupling stress. Design/methodology/approach The samples of the BGA package were subjected to a migration test at different currents and temperatures. Voltage variation was recorded for analysis. Scanning electron microscope and electron back-scattered diffraction were applied to achieve the micromorphological observations. Additionally, the experimental and simulation results were combined to fit the modified model parameters. Findings Voids appeared at the corner of the cathode. The resistance of the daisy chain increased. Two stages of resistance variation were confirmed. The crystal lattice orientation rotated and became consistent and ordered. Electrical and thermal stresses had an impact on the void formation. As the current density and temperature increased, the void increased. The lifetime of the solder joint decreased as the electrical and thermal stresses increased. A modified MTTF model was proposed and its parameters were confirmed by theoretical derivation and test data fitting. Originality/value This study focuses on the effects of coupling stress on the void formation of the SAC305 BGA solder joint. The microstructure and macroscopic performance were studied to identify the effects of different stresses with the use of a variety of analytical methods. The modified MTTF model was constructed for application to SAC305 BGA solder joints. It was found suitable for larger current densities and larger influences of Joule heating and for the welding ball structure with current crowding.

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

2015 ◽  
Author(s):  
Hirokazu Oriyama ◽  
Takashi Kawakami ◽  
Takahiro Kinoshita
Keyword(s):  
Solder Joint ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Mechanical Design ◽  
Low Cycle Fatigue ◽  
Creep Damage ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder

Sn-Ag-Cu solder materials have been widely used for the mount process of electronics devices or semiconductor packages on print circuit board (PCB). The solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomenon. The fatigue life of solder joint has been investigated by many researchers with experimental and numerical methods. Generally, the induced thermal stress in solder joints should be relaxed as soon and creep damage is considered to be ignored in order to estimate lives of joints. However, it is probable that long term stress is applied to solder joints by the elastic follow-up phenomenon which are depending on the stiffness ratio between solder joints and the electronics device, because the elastic strain in PCB or the electronics device shifts to creep strain in solder joints gradually during a long time. Then the creep damage of solder joint should be counted for the mechanical design of mounted PCBs. And it is known that the interaction between creep damage and fatigue damage significantly shorten the life. In this study, it was discussed whether the interaction between fatigue damage and creep damage has to be considered or not for the mechanical design of the lead free solder joint with basic creep-fatigue tests at an elevated temperature.

A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling

1990 ◽  
Vol 112 (2) ◽  
pp. 104-109 ◽  
Author(s):  
Boon Wong ◽  
D. E. Helling
Keyword(s):  
Crack Initiation ◽  
Solder Joint ◽  
Crack Propagation ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Mechanistic Model ◽  
Propagation Model ◽  
Time To Failure ◽  
Surface Mount ◽  
Life Predictions

A mechanistic model for eutectic Pb/Sn solder life predictions has been developed and applied to leadless surface mount solder joints. This model can quantitatively describe both crack initiation and crack propagation processes in the solder. There are four parts to this model: a crack initiation model, a crack propagation model [1], a microstructural coarsening model and an analysis of the deformation in the solder during thermal cycling. By merging these models together, it is possible to predict the time to crack initiation and the time to failure of these solder joints. Solder joint life predictions show good agreement with data obtained on thermally cycled surface mount leadless chip resistors.

Texture and Microstructure Effects on Electromigration Behavior of Aluminum Metallization

1991 ◽  
Vol 225 ◽  
Author(s):  
D. B. Knorr ◽  
K. P. Rodbell ◽  
D. P. Tracy
Keyword(s):  
Grain Size ◽  
Standard Deviation ◽  
Pure Aluminum ◽  
Time To Failure ◽  
X Ray Diffraction ◽  
Aluminum Films ◽  
Failure Data ◽  
Transmission Electron ◽  
Aluminum Metallization ◽  
Microstructure Effects

ABSTRACTPure aluminum films are deposited under a variety of conditions to vary the crystallographic texture. After patterning and annealing at 400°C for 1 hour, electromigration tests are performed at several temperatures. Failure data are compared on the basis of t50 and standard deviation. Microstructure is quantified by transmission electron microscopy for grain size and grain size distribution and by X-ray diffraction for texture. A strong (111) texture significantly improves the electromigration lifetime and decreases the standard deviation in time to failure. This improvement correlates with both the fraction and sharpness of the (111) texture component.

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

2017 ◽  
Vol 47 (3) ◽  
pp. 1881-1895 ◽  
Author(s):  
Yong Zuo ◽  
Thomas R. Bieler ◽  
Quan Zhou ◽  
Limin Ma ◽  
Fu Guo
Keyword(s):  
Solder Joints ◽  
Fatigue Behavior ◽  
Thermomechanical Fatigue

Component Low Cycle Fatigue Behavior Based on Standard Calculation Procedure and Non-Linear FEA

2017 ◽  
Author(s):  
Jürgen Rudolph ◽  
Adrian Willuweit ◽  
Steffen Bergholz ◽  
Christian Philippek ◽  
Jevgenij Kobzarev
Keyword(s):  
Power Plants ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Hybrid Approach ◽  
Combined Cycle ◽  
Cycle Fatigue ◽  
Element Analysis ◽  
Constitutive Material Model ◽  
Standard Design ◽  
Creep Fatigue

Components of conventional power plants are subject to potential damage mechanisms such as creep, fatigue and their combination. These mechanisms have to be considered in the mechanical design process. Against this general background — as an example — the paper focusses on the low cycle fatigue behavior of a main steam shut off valve. The first design check based on standard design rules and linear Finite Element Analysis (FEA) identifies fatigue sensitive locations and potentially high fatigue usage. This will often occur in the context of flexible operational modes of combined cycle power plants which are a characteristic of the current demands of energy supply. In such a case a margin analysis constitutes a logical second step. It may comprise the identification of a more realistic description of the real operational loads and load-time histories and a refinement of the (creep-) fatigue assessment methods. This constitutes the basis of an advanced component design and assessment. In this work, nonlinear FEA is applied based on a nonlinear kinematic constitutive material model, in order to simulate the thermo-mechanical behavior of the high-Cr steel component mentioned above. The required material parameters are identified based on data of the accessible reference literature and data from an own test series. The accompanying testing campaign was successfully concluded by a series of uniaxial thermo-mechanical fatigue (TMF) tests simulating the most critical load case of the component. This detailed and hybrid approach proved to be appropriate for ensuring the required lifetime period of the component.

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