Study of Oxidation Properties of Amorphous Si:B Films

1991 ◽  
Vol 219 ◽  
Author(s):  
G.-R. Yang ◽  
T. C. Nason ◽  
Y.-J. Wu ◽  
B. Y. Tong ◽  
S. K. Wong
Keyword(s):  
Thermal Oxidation ◽  
Boron Content ◽  
Boron Concentration ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Spectroscopic Properties ◽  
Threshold Temperature ◽  
Oxide Layers ◽  
Pressure Chemical ◽  
Secondary Ion

ABSTRACTThin films of an amorphous silicon-boron alloy with boron content 1–50 at.% have been deposited by low pressure chemical vapor deposition (LPCVD). The boron content and film thickness of the samples were controlled by regulating the ratio of diborane and silane gases during the deposition. It was observed that the crystallization of the amorphous alloy took place at higher temperatures as boron concentration was increased. After a thermal oxidation was performed, the stoichiometry of die resulting oxide layers on various samples was determined by the secondary ion mass spectrometry and Auger depth profile methods. While the threshold temperature for thermal oxidation was determined to be inversely proportional to the boron concentration, the oxidation rate showed a dramatic increase with boron content. In particular, an alloy containing 30% boron was readily oxidized at 500°C. Mechanisms for the enhancement of oxidation consistent with stoichiometric and spectroscopic properties of the oxide layers are discussed.

Electrical Properties of Undoped 6H- and 4H-SiC Bulk Crystals Grown by Halide Chemical Vapor Deposition

2006 ◽  
Vol 527-529 ◽  
pp. 625-628
Author(s):  
Hun Jae Chung ◽  
Sung Wook Huh ◽  
A.Y. Polyakov ◽  
Saurav Nigam ◽  
Qiang Li ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Boron Concentration ◽  
Secondary Ion Mass Spectrometry ◽  
Nitrogen Concentration ◽  
Chemical Vapor ◽  
Bulk Crystals ◽  
Hall Effect Measurements ◽  
Site Competition ◽  
Secondary Ion

Undoped 6H- and 4H-SiC crystals were grown by Halide Chemical Vapor Deposition (HCVD). Concentrations of impurities were measured by various methods including secondary-ion-mass spectrometry (SIMS). With increasing C/Si ratio, nitrogen concentration decreased and boron concentration increased as expected for the site-competition effect. Hall-effect measurements on 6H-SiC crystals showed that with the increase of C/Si ratio from 0.06 to 0.7, the Fermi level was shifted from Ec-0.14 eV (nitrogen donors) to Ev+0.6 eV (B-related deep centers). Crystals grown with C/Si > 0.36 showed high resistivities between 1053 and 1010 4cm at room temperature. The high resistivities are attributed to close values of the nitrogen and boron concentrations and compensation by deep defects present in low densities.

Thermal Stability Of SiGe/Si Quantum Well Structures Grown By APCVD

1998 ◽  
Vol 533 ◽  
Author(s):  
Q. X. Zhao ◽  
O. Nur ◽  
U. Södervall ◽  
C. J. Patel ◽  
M. Willandera ◽  
...  
Keyword(s):  
Quantum Well ◽  
Atmospheric Pressure ◽  
Annealing Temperature ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Quantum Well Structures ◽  
Pressure Chemical ◽  
Different Temperatures ◽  
Secondary Ion ◽  
Thermal Stability Of

AbstractSingle and double Si1-xGexx/Si quantum well (QW) structures, which were grown by atmospheric pressure chemical vapor deposition (APCVD), are characterized by photoluminescence and secondary ion mass spectrometry. Systematic post-growth annealing treatments were carried out at temperatures between 600°C and 1100°C in pure N2 ambient. The interdiffusion between the Si layer and the Si1-xGex, well layers occurs at the annealing temperature around 900°C. The diffusion coefficient is deduced at different temperatures from SIMS measurements for single QW structures. The activation energy is about 3.9 eV in the temperature range between 950°C and 1100°C. The double QW structures show a similar value, but the accurate value is more difficult to obtain because it is more complicated to analyze the SIMS profile of the double QW structures. The intensity of the exciton recombination related to carriers confined in the double QW structures decreases with increasing annealing temperatures and becomes strongly suppressed at 750°C. When the annealing temperature is increased further, the intensity of the QW emission recovers. The results indicate that nonradiative centers were generated at annealing temperature of about 750°C

scholarly journals Growth and Device Performance of GaN Schottky Rectifiers

1999 ◽  
Vol 4 (1) ◽  
Author(s):  
Jen-Inn Chyi ◽  
C. -M. Lee ◽  
C.C. Chuo ◽  
G. C. Chi ◽  
G. T. Dang ◽  
...  
Keyword(s):  
Breakdown Voltage ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Negative Temperature ◽  
Organic Chemical ◽  
Schottky Rectifiers ◽  
Metal Organic ◽  
Increasing Temperature ◽  
Organic Chemical Vapor Deposition ◽  
Secondary Ion

Undoped, 4µm thick GaN layers grown by Metal Organic Chemical Vapor Deposition were used for fabrication of high stand off voltage (356 V) Schottky diode rectifiers. The figure of merit VRB2/RON, where VRB is the reverse breakdown voltage and RON is the on-resistance, was ~ 4.53 MW-cm−2 at 25°C. The reverse breakdown voltage displayed a negative temperature coefficient, due to an increase in carrier concentration with increasing temperature. Secondary Ion Mass Spectrometry measurements showed that Si and O were the most predominant electrically active impurities present in the GaN.

Te Induced AlAs/GaAs Superlattice Mixing

1988 ◽  
Vol 126 ◽  
Author(s):  
P. Mel ◽  
S. A. Schwarz ◽  
T. Venkatesan ◽  
C. L. Schwartz ◽  
E. Colas
Keyword(s):  
Mass Spectrometry ◽  
Activation Energy ◽  
Diffusion Coefficient ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Temperature Range ◽  
The Relationship ◽  
Secondary Ion

ABSTRACTTe enhanced mixing of AlAs/GaAs superlattice has been observed by secondary ion mass spectrometry. The superlattice sample was grown by organometallic chemical vapor deposition and doped with Te at concentrations of 2×1017 to 5×1018 cm−.3 In the temperature range from 700 to 1000 C, a single activation energy for the Al diffusion of 2.9 eV was observed. Furthermore, it has been found that the relationship between the Al diffusion coefficient and Te concentration is linear. Comparisons have been made between Si and Te induced superlattice mixing.

Reduction of Density of 4H-SiC / SiO2 Interface Traps by Pre-Oxidation Phosphorus Implantation

2014 ◽  
Vol 778-780 ◽  
pp. 575-578 ◽  
Author(s):  
Tomasz Sledziewski ◽  
Aleksey Mikhaylov ◽  
Sergey A. Reshanov ◽  
Adolf Schöner ◽  
Heiko B. Weber ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Electrical Properties ◽  
Ion Implantation ◽  
Thermal Oxidation ◽  
Secondary Ion Mass Spectrometry ◽  
Interface Traps ◽  
Ion Energy ◽  
Residual P ◽  
Conductance Method ◽  
Secondary Ion

The effect of phosphorus (P) on the electrical properties of the 4H-SiC / SiO2interface was investigated. Phosphorus was introduced by surface-near ion implantation with varying ion energy and dose prior to thermal oxidation. Secondary ion mass spectrometry revealed that only part of the implanted P followed the oxidation front to the interface. A negative flatband shift due to residual P in the oxide was found fromC-Vmeasurements. Conductance method measurements revealed a significant reduction of density of interface trapsDitwith energyEC- Eit> 0.3 V for P+-implanted samples with [P]interface= 1.5 1018cm-3in the SiC layer at the interface.

Investigation of Aluminum Incorporation in 4H-SiC Epitaxial Layers

2014 ◽  
Vol 806 ◽  
pp. 45-50 ◽  
Author(s):  
Roxana Arvinte ◽  
Marcin Zielinski ◽  
Thierry Chassagne ◽  
Marc Portail ◽  
Adrien Michon ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Vapor Deposition ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Present Contribution ◽  
Growth Pressure ◽  
Temperature Growth ◽  
Dopant Incorporation ◽  
Capacitance Voltage ◽  
Secondary Ion

In the present contribution, the trends in voluntary incorporation of aluminum in 4H-SiC homoepitaxial films are investigated. The films were grown on Si-and C-face 4H-SiC 8°off substrates by chemical vapor deposition (CVD) in a horizontal, hot wall CVD reactor. Secondary Ion Mass Spectrometry (SIMS) and capacitance-voltage (C-V) measurements were used to determine the Al incorporation in the samples. The influence of Trimethylaluminum (TMA) flow rate, growth temperature, growth pressure and C/Si ratio on the dopant incorporation was studied.

A Study of Nucleation and Growth in MOCVD: The Growth of Thin Films of Alumina

2000 ◽  
Vol 648 ◽  
Author(s):  
M.P. Singh ◽  
S. Mukhopadhayay ◽  
Anjana Devi ◽  
S.A. Shivashankar
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Secondary Ion Mass Spectrometry ◽  
Film Growth ◽  
Depth Profiling ◽  
Chemical Vapor ◽  
Nucleation And Growth ◽  
Cross Sectional ◽  
Alumina Films ◽  
Pressure Chemical

AbstractWe have studied the nucleation and growth of alumina by metalorganic chemical vapor deposition (MOCVD). The deposition of alumina films was carried out on Si(100) in a horizontal, hot-wall, low pressure chemical vapor deposition (CVD) reactor, using aluminum acetylacetonate{Al(acac)3}as the CVD precursor. We have investigated growth of alumina films as a function of different CVD parameters such as substrate temperature and total reactor pressure during film growth. Films were characterized by optical microscopy, X-ray diffractometry (XRD), scanning electron microscopy (SEM), cross-sectional SEM, and secondary ion mass spectrometry (SIMS) compositional depth profiling. The chemical analysis reveals that the carbon is present throughout the depth of the films.

Ftir and UV Study of Amorphous Silicon-Boron Alloys Deposited by LPCVD

1996 ◽  
Vol 426 ◽  
Author(s):  
G.-R. Yang ◽  
Y.-P. Zhao ◽  
B. Y. Tong
Keyword(s):  
Boron Content ◽  
Optical Band Gap ◽  
Uv Spectroscopy ◽  
Oxidation Mechanism ◽  
Chemical Vapor ◽  
Structure Change ◽  
Narrow Gap ◽  
Photovoltaic Devices ◽  
Pressure Chemical ◽  
Oxidation Behaviors

AbstractAs-deposited and wet oxidized a-Si:B alloy deposited by low pressure chemical vapor deposition (LPCVD) with various boron content was studied by UV Spectroscopy and Fourier Transform Infrared Spectroscopy. It is found that the optical band gap of a-Si:B varies with respect to the boron content, which provides potential application probability in narrow-gap photovoltaic devices. This effect is associated with the structure change induced by B content. The oxidation behaviors of a-Si:B films with boron content 3 at.% – 25 at.% are different from those with boron content exceeded 30 at.%. Possible oxidation mechanism for different boron content a-Si:B film are proposed.

Investigation of the Dopant Distribution in thin Epitaxial Silicon Layers by Means of Spreading Resistance Probe and Secondary Ion Mass Spectrometry

1997 ◽  
Vol 500 ◽  
Author(s):  
Ilya Karpov ◽  
Catherine Hartford ◽  
Greg Moran ◽  
Subramania Krishnakumar ◽  
Ron Choma ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Chemical Vapor ◽  
Doping Profile ◽  
Epitaxial Silicon ◽  
Spreading Resistance ◽  
Boron Doped ◽  
Ion Mass Spectrometry ◽  
Chemical Profiles ◽  
Secondary Ion

ABSTRACTIn this paper, we examine the dopant distributions in 1.8 to 4 micron-thick boron- and phosphorus-doped epitaxial silicon layers. These layers were grown by chemical vapor deposition (CVD) on arsenic-, antimony-, or boron-doped (100)- and (111)-oriented substrates. We performed doping profile studies by means of local resistivity measurements using a spreading resistance probe (SRP). Chemical profiles of the dopants were also obtained using secondary ion mass spectrometry (SIMS).

Deuterium Diffusion, Trapping and Stability in Buried Silicon Dioxide Layers

1998 ◽  
Vol 513 ◽  
Author(s):  
A. Boutry-Forveille ◽  
A. Nazarov ◽  
D. Ballutaud
Keyword(s):  
Mass Spectrometry ◽  
Silicon Dioxide ◽  
Isothermal Annealing ◽  
Secondary Ion Mass Spectrometry ◽  
Oxide Layers ◽  
Buried Oxide ◽  
Different Temperatures ◽  
Hydrogen Deuterium ◽  
Secondary Ion ◽  
Diffusion Profiles

ABSTRACTThe interaction of hydrogen (deuterium used as tracer) with Si-Si02-Si buried oxide layers (BOX) prepared by thermal oxidation or by oxygen implantation (SIMOX) are investigated using Secondary Ion Mass Spectrometry (SIMS) measurements combined with effusion experiments. The sample deuteration is performed at different temperatures between 150 and 300°C using a radiofrequency plasma. In SIMOX samples, the deuterium diffusion profiles analysed by SIMS show deuterium trapping on implantation defects, and deuterium diffusion in the silicon substrate by permeation through the oxide layer for temperatures higher than 250°C. The deuterium is still detected in the buried oxide layers after isothermal annealing at 600°C during 2 hours. The deuterium trapping at the siliconsilicon dioxide interfaces is analysed.

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