Gas Phase Decomposition of an Organometallic Chemical Vapor Deposition Precursor to Ain: [A1(CH3)2NH2]3

1990 ◽  
Vol 204 ◽  
Author(s):  
Carmela C. Amato ◽  
John B. Hudson ◽  
Leonard V. Interrante
Keyword(s):  
Gas Phase ◽  
Mass Spectra ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Phase Decomposition ◽  
Mass Spectral ◽  
Organometallic Precursor ◽  
Deuterated Analogue ◽  
Precursor Decomposition ◽  
Reactor Temperature

ABSTRACTA CVD reactor has been coupled to a molecular beam apparatus in order to study the gas phase decomposition of an organometallic precursor to AIN, tris-dimethylaluminum amide, [(CH3)2AINH2]3. The onset of decomposition occurs at a reactor temperature of 125°C. By 300°C, all mass spectral signals due to precursor have disappeared. With the addition of helium as a carrier gas in the CVD process, the temperature at which all precursor signals disappear is raised to 400°C. The evolution of methane accompanies the precursor decomposition. Mass spectra of the precursor and its deuterated analogue, [(CH3)2 AIND2]3, obtained between 50°C and 90°C, offer support for the existence of trimer-dimer-monomer equilibria in this temperature range.

Gas Phase Decomposition of an Organometallic Chemical Vapor Deposition Precursor to AIN:[AI(CH3)2NH2]3

1989 ◽  
Vol 168 ◽  
Author(s):  
Carmela C. Amato ◽  
John B. Hudson ◽  
Leonard V. Interrante
Keyword(s):  
Chemical Vapor Deposition ◽  
Gas Phase ◽  
Vapor Deposition ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Decomposition Temperature ◽  
Phase Decomposition ◽  
Novel Technique ◽  
Organometallic Precursor ◽  
Chemical Vapor Deposition Reaction

AbstractA novel technique for probing chemical vapor deposition reaction mechanisms is presented. A conventional hot-wall Pyrex reactor is coupled to a molecular beam apparatus. Preliminary results of the decomposition of an organometallic precursor to AIN, [AI(CH3)2NH2]3, indicate a decomposition temperature between 200 and 270°C. The mass spectrum of the precursor at 100°C provides evidence for the existence of a trimer-dimer equilibrium of the precursor at this temperature

scholarly journals Gas-phase aluminium acetylacetonate decomposition: Revision of the current mechanism by VUV synchrotron radiation

2021 ◽  
Author(s):  
Sebastian Grimm ◽  
Seung-Jin Baik ◽  
Patrick Hemberger ◽  
Andras Bodi ◽  
Andreas Kempf ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Synchrotron Radiation ◽  
Gas Phase ◽  
Vapor Deposition ◽  
Aluminium Oxide ◽  
Chemical Vapor ◽  
Phase Decomposition ◽  
Common Precursor ◽  
Current Mechanism

Although aluminium acetylacetonate, Al(C5H7O2)3, is a common precursor for chemical vapor deposition (CVD) of aluminium oxide, its gas phase decomposition is not very well investigated. Here, we studied its thermal...

Depth Profile of Doping Concentration in Thick (> 100 μm) and Low-Doped (< 4 × 1014 cm-3) 4H-SiC Epilayers

2017 ◽  
Vol 897 ◽  
pp. 83-86 ◽  
Author(s):  
Keisuke Fukada ◽  
Naoto Ishibashi ◽  
Yoshihiko Miyasaka ◽  
Akira Bandoh ◽  
Kenji Momose ◽  
...  
Keyword(s):  
Depth Profile ◽  
Gas Flow ◽  
Doping Concentration ◽  
Chemical Vapor ◽  
Constant Depth ◽  
Depth Profiles ◽  
Dopant Incorporation ◽  
In Doping ◽  
Precursor Decomposition ◽  
Reactor Temperature

The depth profiles of n-type doping concentration in thick (>100 μm) and low-doped (< 4 × 1014 cm-3) 4H-SiC epilayers grown by chemical vapor deposition (CVD) were investigated. The variation in doping concentration during epitaxial growth are considered to be caused by: (1) variation in gas flow due to parasitic deposition, (2) variation in precursor decomposition rate due to change in reactor temperature, (3) variation in dopant incorporation rate due to change in wafer temperature, and (4) variation in supply of background dopants. By controlling all these parameters, a constant depth profile in thick (> 100um) epilayers was realized.

Aspects of Gas Phase Chemistry During Chemical Vapor Deposition of Ti-Si-N Thin Films With Ti(NMe2)4 (TDMAT), NH3, and SiH4

1999 ◽  
Vol 606 ◽  
Author(s):  
Carmela Amato-Wierda ◽  
Edward T. Norton ◽  
Derk A. Wierda
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Gas Phase ◽  
Vapor Deposition ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Similar Process ◽  
Process Conditions ◽  
Gas Phase Chemistry ◽  
Phase Chemistry

AbstractSilane activation, predominantly in the gas phase, has been observed during the chemical vapor deposition of Ti-Si-N thin films using Ti(NMe2)4, tetrakis(dimethylamido)titanium, silane, and ammonia at 450°C, using molecular beam mass spectrometry. The extent of silane reactivity was dependent upon the relative amounts of Ti(NMe2)4and NH3. Additionally, each TDMAT molecule activates multiple silane molecules. Ti-Si-N thin films were deposited using similar process conditions as the molecular beam experiments, and RBS and XPS were used to determine their atomic composition. The variations of the Ti:Si ratio in the films as a function of Ti(NMe2)4 and NH3 flows were consistent with the changes in silane reactivity under similar conditions.

Molecular Beam Mass Spectrometry Studies of the Thermal Decomposition of Tetrakis(dimethylamino)Titanium

1999 ◽  
Vol 606 ◽  
Author(s):  
Carmela C. Amato-Wierda ◽  
Edward T. Norton ◽  
Derk A. Wierda
Keyword(s):  
Mass Spectrometry ◽  
Gas Phase ◽  
Vapor Deposition ◽  
Molecular Beam ◽  
Flow Reactor ◽  
Chemical Vapor ◽  
Molecular Beam Mass Spectrometry ◽  
Gas Phase Chemistry ◽  
Temperature Rate ◽  
Phase Chemistry

AbstractTetrakis(dimethylamino)titanium (TDMAT) is an important precursor for TiN, TiCN, and TiSiN thin films in chemical vapor deposition. In order to better understand how the gas phase chemistry influences the formation of these films, the decomposition of TDMAT has been studied in a high-temperature flow reactor (HTFR) by molecular beam mass spectrometry (MBMS). Two kinetic regimes have been observed as a function of temperature. Rate expressions and mechanistic implications will be presented. Further studies are in progress to identify the gas phase species relevant to the decomposition mechanism of TDMAT.

Kinetic study of silicon carbide deposited from methyltrichlorosilane precursor

1994 ◽  
Vol 9 (1) ◽  
pp. 104-111 ◽  
Author(s):  
Ching Yi Tsai ◽  
Seshu B. Desu ◽  
Chien C. Chiu
Keyword(s):  
Silicon Carbide ◽  
Gas Phase ◽  
Present Model ◽  
Equilibrium Constants ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Reaction Scheme ◽  
Phase Decomposition ◽  
Reaction Constants ◽  
Kinetics Of

The kinetics of silicon carbide (SiC) deposition, in a hot-wall chemical vapor deposition (CVD) reactor, were modeled by analyzing our own deposition rate data as well as reported results. In contrast to the previous attempts which used only the first order lumped reaction scheme, the present model incorporates both homogeneous gas phase and heterogeneous surface reactions. The SiC deposition process was modeled using the following reactions: (i) gas phase decomposition of methyltrichlorosilane (MTS) molecules into two major intermediates, one containing silicon and the other containing carbon, (ii) adsorption of the intermediates onto the surface sites of the growing film, and (iii) reaction of the adsorbed intermediates to form silicon carbide. The equilibrium constant for the gas phase decomposition process was divided into the forward and backward reaction constants as 2.0 × 1025 exp[(448.2 kJ/mol)/RT] and 1.1 × 1032 exp[(-416.2 kJ/mol)/RT], respectively. Equilibrium constants for the surface adsorption reactions of silicon-carrying and carbon-carrying intermediates are 0.5 × 1011 exp[(-21.6 kJ/mol)/RT] and 7.1 × 109 exp[(-33.1 kJ/mol)/RT], while the rate constant for the surface reaction of the intermediates is 4.6 × 105 exp[(-265.1 kJ/mol)/RT].

STM studies of crystal growth

1991 ◽  
Vol 49 ◽  
pp. 374-375
Author(s):  
M. G. Lagally
Keyword(s):  
Crystal Growth ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Sputter Deposition ◽  
Field Of View ◽  
Scanning Tunneling ◽  
Wide Field ◽  
Tunneling Microscopy ◽  
Wide Field Of View ◽  
The One

It has been recognized since the earliest days of crystal growth that kinetic processes of all Kinds control the nature of the growth. As the technology of crystal growth has become ever more refined, with the advent of such atomistic processes as molecular beam epitaxy, chemical vapor deposition, sputter deposition, and plasma enhanced techniques for the creation of “crystals” as little as one or a few atomic layers thick, multilayer structures, and novel materials combinations, the need to understand the mechanisms controlling the growth process is becoming more critical. Unfortunately, available techniques have not lent themselves well to obtaining a truly microscopic picture of such processes. Because of its atomic resolution on the one hand, and the achievable wide field of view on the other (of the order of micrometers) scanning tunneling microscopy (STM) gives us this opportunity. In this talk, we briefly review the types of growth kinetics measurements that can be made using STM. The use of STM for studies of kinetics is one of the more recent applications of what is itself still a very young field.

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