Properties of a Photoimageable Thin Polyimide Film
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ABSTRACTMechanical properties (tensile modulus, tensile strength, elongation at break), thermal properties (T8' CTE, thermo-decomposition temperature, and rate of weight loss) and electrical properties of Problmlde 414 cured films have been determined. The mechanical properties of Probimide 414 thin films are highly dependent on the hard-bake temperature, hard-bake time, and purge gas, but not dependent on the level of the exposure energy or the presence of 1% Irganox 1010 (w/w) as a stabilizer. At a hard-bake temperature of 350ºC and a nitrogen purge rate of 15 SCFH, Probimide 414 films showed excellent retention of the mechanical properties during extended heat treatment.
2013 ◽
Vol 834-836
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pp. 847-854
2014 ◽
Vol 136
(6)
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2013 ◽
Vol 750-752
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pp. 858-862
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2012 ◽
Vol 626
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pp. 828-833
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2014 ◽
Vol 695
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pp. 709-712
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2011 ◽
Vol 328-330
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pp. 1512-1516
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