Magnetic Recording Disk Specimen Preparation for Transmission Electron Microscopy

1990 ◽  
Vol 199 ◽  
Author(s):  
Michael A. Parker ◽  
K. L. Parker ◽  
M. Meininger ◽  
A. Bermea
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Magnetic Recording ◽  
Specimen Preparation ◽  
Disk Specimen ◽  
Transmission Electron ◽  
Preparation Techniques

ABSTRACTModifications to conventional techniques required to prepare specimens from magnetic recording disks are described. Both the preparation of through-foil and cross-section specimens are discussed. The differences between preparation techniques for particulate and thin film disks are elucidated. Micrographs of specimens prepared by various techniques from both types of disk technology are presented that show the relative merits of these methods.

The Challenge and Methods of TEM Cross-Sectioning of < 0.25 Micron Plugs

1998 ◽  
Vol 523 ◽  
Author(s):  
C. Amy Hunt ◽  
Yuhong Zhang ◽  
David Su
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Adhesion Layer ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Sectional Plane ◽  
Preparation Techniques

AbstractTransmission electron microscopy (TEM) is a useful tool in process evaluation and failure analysis for semiconductor industries. A common focus of semiconductor TEM analyses is metalization vias (plugs) and it is often desirable to cross-section through a particular one. If the cross-sectional plane deviates away from the center of the plug, then the thin adhesion layer around the plug will be blurred by surrounding materials such as the inter-layer dielectric and the plug material. The importance of these constraints, along with the difficulty of precision sample preparation, has risen sharply as feature sizes have fallen to 0.25 μm and below. The suitability of common sample preparation techniques for these samples is evaluated.

Structure of composition-modulated Cu/Ni thin films prepared by electrodeposition

1989 ◽  
Vol 4 (4) ◽  
pp. 755-758 ◽  
Author(s):  
J. Yahalom ◽  
D. F. Tessier ◽  
R. S. Timsit ◽  
A. M. Rosenfeld ◽  
D. F. Mitchell ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Film Structure ◽  
Composition Modulation ◽  
Transmission Electron ◽  
Electron Energy Loss ◽  
Multilayered Thin Films

Copper/nickel multilayered thin-films prepared by electrodeposition have been examined in cross section by electron energy loss spectroscopy and high-resolution transmission electron microscopy. The results of the examinations provide the first direct experimental evidence of the large composition modulation across successive layers in the thin-film structure and the coherent nature of Cu/Ni interfaces.

Recent Developments in Failure Analysis in an Ultra thin Film Evaluation System

2000 ◽  
Vol 6 (S2) ◽  
pp. 136-137
Author(s):  
T. Kamino ◽  
M. Konno ◽  
T. Yaguchi ◽  
T. Hashimoto ◽  
H. Tanaka ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Spatial Resolution ◽  
Evaluation System ◽  
Image Resolution ◽  
Specimen Preparation ◽  
Transmission Electron ◽  
Microelectronics Industry ◽  
Ultra Thin Film

The increased demand in the microelectronics industry for higher spatial resolution in the analysis of device defects has focused attention on the use of transmission electron microscopy(TEM). However, in contrast to scanning electron microscopes(SEM), the number of TEM units in the microelectronics industry is still limited. This is because TEM operation and TEM specimen preparation are rather complicated and the results dependent upon operator experience.A innovative solution using a dedicated ultra thin film evaluation system(HD-2000) based upon a 200kV cold field emission scanning transmission electron microscopy(STEM) technique has been developed[1]. The system has STEM image resolution of 0.24nm and 0.3nm spatial resolution for elemental analysis using energy dispersive X-ray(EDX) spectroscopy with 0.3sr collection solid angle. The system therefore allows materials characterization to be performed at atomic resolution. Another advantage of the system is the ease of use due to newly developed PC-SEM operation software.

Minimization of Non-Uniform Ion-Thinning Effects in Thin Film Transverse Specimens for Transmission Electron Microscopy

1991 ◽  
Vol 254 ◽  
Author(s):  
F. Shaapur ◽  
K. A. Watson
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Processing Time ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Transmission Electron ◽  
Rotation Method ◽  
Computer Controlled

AbstractA computer-controlled, specimen rotation attachment was developed and installed on a commercial ion-milling system for TEM specimen preparation. This rotation method produced relatively large thin areas on a variety of thin film transverse specimens with a difference in the ion-milling rates between the film and the substrate. The results were generally comparable to those obtained by a newly developed low-angle ion-thinning procedure and the overall processing time was considerably shortened.

Direct Observation of Heat Exchanger Deposits by Cross Sectioning

1967 ◽  
Vol 25 ◽  
pp. 364-365
Author(s):  
R. W. Anderson ◽  
D. L. Senecal
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Heat Exchanger ◽  
Direct Observation ◽  
Cross Sections ◽  
Preparation Method ◽  
Specimen Preparation ◽  
Flowing Water ◽  
Transmission Electron ◽  
Deposit Layer

A problem was presented to observe the packing densities of deposits of sub-micron corrosion product particles. The deposits were 5-100 mils thick and had formed on the inside surfaces of 3/8 inch diameter Zircaloy-2 heat exchanger tubes. The particles were iron oxides deposited from flowing water and consequently were only weakly bonded. Particular care was required during handling to preserve the original formations of the deposits. The specimen preparation method described below allowed direct observation of cross sections of the deposit layers by transmission electron microscopy.The specimens were short sections of the tubes (about 3 inches long) that were carefully cut from the systems. The insides of the tube sections were first coated with a thin layer of a fluid epoxy resin by dipping. This coating served to impregnate the deposit layer as well as to protect the layer if subsequent handling were required.

Transmission Electron Microscopy studies of texture of Cr underlayer of magnetic recording hard disk

1991 ◽  
Vol 49 ◽  
pp. 580-581
Author(s):  
L. Tang ◽  
G. Thomas ◽  
M. R. Khan ◽  
S. L. Duan
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Magnetic Recording ◽  
Magnetic Thin Films ◽  
Magnetic Films ◽  
Substrate Bias ◽  
Epitaxial Relationship ◽  
Transmission Electron

Cr thin films are often used as underlayers for Co alloy magnetic thin films, such as Co1, CoNi2, and CoNiCr3, for high density longitudinal magnetic recording. It is belived that the role of the Cr underlayer is to control the growth and texture of the Co alloy magnetic thin films, and, then, to increase the in plane coercivity of the films. Although many epitaxial relationship between the Cr underlayer and the magnetic films, such as ﹛1010﹜Co/ {110﹜Cr4, ﹛2110﹜Co/ ﹛001﹜Cr5, ﹛0002﹜Co/﹛110﹜Cr6, have been suggested and appear to be related to the Cr thickness, the texture of the Cr underlayer itself is still not understood very well. In this study, the texture of a 2000 Å thick Cr underlayer on Nip/Al substrate for thin films of (Co75Ni25)1-xTix dc-sputtered with - 200 V substrate bias is investigated by electron microscopy.

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