Kinetics of Grain Growth Across Bond Interface During Diffusion Bonding

1990 ◽  
Vol 196 ◽  
Author(s):  
Huang Yan ◽  
Cui Jianzhong ◽  
Ma Longxiang

ABSTRACTGenerally, the elimination of the voids in bond interface is considered to be the rate-controlling mechanism for diffusion bonding. In an earlier paper, the author proposed a new theoretical model for solid-state diffusion bonding of similar matals, in which the grain growth across the bond interface was considered to be the governing mechanism for diffusion bonding. The aim of the model is to understand how the joint strength is affected both by process variables (temperature, pressure, time) and by the microstructures of the materials being joined. In this paper, the mechanism of grain growth and recrystallization is discussed, and the calculation of an appropriate kinetic equation is made based on a diffusion bonding experiment on a hot-rolled 7075 aluminum alloy. The calculated results basically agree with those of the experiment.

2011 ◽  
Vol 689 ◽  
pp. 472-478 ◽  
Author(s):  
Yue Fei ◽  
Bin Tang ◽  
Hui Chang ◽  
Zhi Shou Zhu ◽  
Zhong Bo Zhou ◽  
...  

A study on the kinetics of β grain growth of a fine-grained, hot-rolled TB-13 alloy was carried out by isochronal and isothermal solution treatments. The grain size of the as-rolled and as-solution-treated samples was determined by metallographic observation using the linear intercept method. The kinetic equations and the Arrhenius-type equation were applied to calculate the β grain growth exponent and the activation energy for β grain growth at special temperatures. The results showed that the β grain growth rate decreased with elongating solution treated time, but increased with increasing solution treated temperature. The β grain growth exponents (n) were 0.394, 0.403 and 0.406 during the solution treated temperatures at 1103K, 1153K and 1203K, respectively. The values of n increased with increasing solution treated temperature and the determined activation energy (Qm) for β grain growth after holding for 0.5h at 1103K-1203K was around 156KJ/mol.


2021 ◽  
Vol 11 (20) ◽  
pp. 9660
Author(s):  
Chun-Hao Chen ◽  
Yu-Kai Sun ◽  
Yu-Chang Lai ◽  
Shih-Ying Chang ◽  
Tung-Han Chuang

The precipitation-hardenable aluminum alloy 6061 (AA 6061) is favored for aerospace components and automotive parts. However, the tenacious oxide layer on the surface greatly limits the quality and applicability of joining AA 6061. In this study, the joining method of solid-state diffusion bonding was implemented for AA 6061 plates, and the effects of post-weld heat treatment (PWHT) on the joint interface were investigated. The bonding temperatures were within the range of 500–530 °C, and the time periods varied from 30 to 240 min under a static pressure of 5 MPa in a vacuum. The diffusion bonded specimens were subjected to T4- and T6-PWHT to improve the bonding quality. The interfacial microstructure of the joints was analyzed by scanning electron microscopy, and the mechanical properties were evaluated with shear tests. The experimental results showed that the shear strength of the diffusion bonded joint could reach around 71.2 MPa, which was highly dependent on bonding temperature and holding time, and T6-PWHT further enhanced it to over 100 MPa. The effects of PWHT on the diffusion bonded AA 6061 joint were investigated, and the fractography on the sheared surfaces indicated that PWHT-T6 played an important role in enhancing joint strength, which was consistent with the measured shear strength. The sequential PWHT for AA 6061 after diffusion bonding was proven to be feasible for bonding of AA 6061 parts, and the joint strength was sufficient for industrial needs.


1990 ◽  
Vol 196 ◽  
Author(s):  
Huang Yan ◽  
Cui Jianzhong ◽  
Ma Longxiang

ABSTRACTBecause of the presence of surface oxide films, aluminum alloys are very difficult to join by diffusion bonding processes when there are no interlayers between mating surfaces. In the present investigation, the diffusion bonding of superplastic 7075 aluminum alloy has been carried out using a special method for surface treatment in the temperature range 500∼520°C, at pressures of 2.07∼3.OMPa, times of 90∼150min and a vaccum of 1×10−5torr. The joint strength obtained is the same as the base metal strength of the alloy, and the joint microstructure is indistinguishable from that of the base metal. In this paper, the effect of the superplastic treatment of the alloy on the bonding process is discussed, and it is proposed that the bonding mechanism is the migration of the initial bond interface caused both by the diffusion of atoms and by the growth of grains during the diffusion bonding process.


2010 ◽  
Vol 89-91 ◽  
pp. 153-158 ◽  
Author(s):  
F. de las Cuevas ◽  
Mónica Reis ◽  
A. Ferraiuolo ◽  
G. Pratolongo ◽  
L. Pentti Karjalainen ◽  
...  

Hot rolled, laboratory-cast, TWIP steel samples (5.4 mm thick) of 22% Mn - 0.6% C (in mass-%) were cold rolled to different reductions (from 40 % to 70 %) and subsequently isothermally annealed for various times at temperatures ranging from 450º C to 1100º C. The evolution of recrystallization and grain growth was followed by control of the softening kinetics complemented by metallographic, OIM and microtexture observations. A map of the recovery, recrystallization and grain growth in the temperature-time space was obtained. In all instances, the grain size at the end of recrystallization was very fine, D ≤ 2 µm and larger grain sizes were the result of grain growth. A range of grain sizes 2 µm ≤ D ≤ 50 µm was covered by the grain growth experiments. A phenomenological grain growth equation that is useful for the annealing control of this steel was derived from the measurements.


2013 ◽  
Vol 747-748 ◽  
pp. 844-849 ◽  
Author(s):  
Yue Fei ◽  
Xin Nan Wang ◽  
Zhi Shou Zhu ◽  
Jun Li ◽  
Guo Qiang Shang ◽  
...  

Ti-Mo-Nb-Cr-Al-Fe-Si alloy is a new metastable β titanium alloy with excellent combination of strength and ductility. The β grain-growth exponent and the activation energies for β grain growth for the investigated alloy at specified temperature were computed by the kinetic equations and the Arrhenius-type equation. The rate of β grain growth decreases with elongating solution treated time and increases with the increasing solution-treated temperature. The β grain-growth exponents, n, are 0.461, 0.464 and 0.469 at 1113, 1133 and 1153K, respectively. The β grain growth activation energy is determined to be 274 KJ/mol.


2005 ◽  
Vol 475-479 ◽  
pp. 1137-1140
Author(s):  
Lili Zhao ◽  
Feng Gao ◽  
Wei Min Wang ◽  
Chang Sheng Tian

The oriented 0.67Pb (Mg1/3Nb2/3)O3-0.33PbTiO3 (PMNT) polycrystals were prepared by the conventional ceramic technique and the templated grain growth method adding excess PbO in the matrix. Kinetics of the development of oriented structure was investigated systemically. In the presence of PbO liquid phase, the oriented PMNT polycrystals mainly grow by the dissolution-precipitation mechanism. The diffusion is determined by the sintering temperature and the PbO-excess content in the matrix. The thickness of oriented PMNT polycrystals displays a t1/3 dependence, which is characteristic of diffusion-controlled growth. For the thicker oriented structure, 20% excess PbO in the PMNT matrix and 1150oC for 10h are the proper experimental conditions. Moreover, the addition of PbO in the matrix hardly affects the final composition of ceramic matrix.


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