scholarly journals Heteroepitaxial Growth of Germanium Films by Supersonic Free Jet Chemical Beam Epitaxy

1989 ◽  
Vol 160 ◽  
Author(s):  
Djula Eres ◽  
J. W. Sharp ◽  
D. H. Lowndes

AbstractA supersonic free jet operated in continuous wave and pulsed mode was used to grow Ge films on (100) GaAs and (100) Si substrates. The Ge-bearing source molecule digermane (Ge2H6) was seeded (at 5% concentration) in a helium carrier gas. A free jet expansion of this gas mixture was directed toward the heated substrate surface, where Ge film growth took place by surface-induced thermal decomposition of the ballistically impinging digermane molecules. The thickness distribution across the substrate surface was fitted by a cosmJ distribution. The values of m spanned the range 6–35. The upper limit on growth resulting from “background” gas scattered out of the jet was found to be less than 10% of the Ge film thickness for growth on (100) GaAs, and around 25% for growth on (100) Si.

2006 ◽  
Vol 11-12 ◽  
pp. 265-268
Author(s):  
T. Kurimoto ◽  
Yuichiro Kuroki ◽  
Kanji Yasui ◽  
Masasuke Takata ◽  
Tadashi Akahane

The heteroepitaxial growth of 3C-SiC films on Si(100) substrates by the hot-mesh chemical vapor deposition (HM-CVD) method using monomethylsilane as a source gas was investigated. From the results of X-ray diffraction spectra, 3C-SiC crystal was epitaxially grown on Si substrates at substrate temperatures above 750°C. The SiC/Si interface was observed by cross-sectional scanning electron microscopy, and was confirmed to be void-free and smooth. The density of hydrogen radicals supplied to the substrate surface during the growth was also estimated measuring the optical absorbance change of tungsten phosphate glass plates. From the dependence of the growth rate on substrate temperature, the mechanism of SiC film growth by HM-CVD was considered.


1989 ◽  
Vol 55 (10) ◽  
pp. 1008-1010 ◽  
Author(s):  
Djula Eres ◽  
Douglas H. Lowndes ◽  
Jon Z. Tischler

Micromachines ◽  
2021 ◽  
Vol 12 (6) ◽  
pp. 710
Author(s):  
Michał Michalik ◽  
Jacek Szymańczyk ◽  
Michał Stajnke ◽  
Tomasz Ochrymiuk ◽  
Adam Cenian

The paper deals with the medical application of diode-lasers. A short review of medical therapies is presented, taking into account the wavelength applied, continuous wave (cw) or pulsed regimes, and their therapeutic effects. Special attention was paid to the laryngological application of a pulsed diode laser with wavelength 810 nm, and dermatologic applications of a 975 nm laser working at cw and pulsed mode. The efficacy of the laser procedures and a comparison of the pulsed and cw regimes is presented and discussed.


1995 ◽  
Vol 397 ◽  
Author(s):  
M. Barth ◽  
J. Knobloch ◽  
P. Hess

ABSTRACTThe growth of high quality amorphous hydrogenated semiconductor films was explored with different in situ spectroscopic methods. Nucleation of ArF laser-induced CVD of a-Ge:H on different substrates was investigated by real time ellipsometry, whereas the F2 laser (157nm) deposition of a-Si:H was monitored by FTIR transmission spectroscopy. The ellipsometric studies reveal a significant influence of the substrate surface on the nucleation stage, which in fact determines the electronic and mechanical properties of the bulk material. Coalescence of initial clusters occurs at a thickness of 16 Å for atomically smooth hydrogen-terminated c-Si substrates, whereas on native oxide covered c-Si substrates the bulk volume void fractions are not reached until 35 Å film thickness. For the first time we present a series of IR transmission spectra with monolayer resolution of the initial growth of a-Si:H. Hereby the film thickness was measured simultaneously using a quartz crystal microbalance with corresponding sensitivity. The results give evidence for cluster formation with a coalescence radius of about 20 Å. Difference spectra calculated for layers at different depths with definite thickness reveal that the hydrogen-rich interface layer stays at the substrate surface and does not move with the surface of the growing film. The decrease of the Urbach energy switching from native oxide to H-terminated substrates suggests a strong influence of the interface morphology on the bulk material quality.


2008 ◽  
Vol 600-603 ◽  
pp. 251-254 ◽  
Author(s):  
Yong Mei Zhao ◽  
Guo Sheng Sun ◽  
Xing Fang Liu ◽  
Jia Ye Li ◽  
Wan Shun Zhao ◽  
...  

Using AlN as a buffer layer, 3C-SiC film has been grown on Si substrate by low pressure chemical vapor deposition (LPCVD). Firstly growth of AlN thin films on Si substrates under varied V/III ratios at 1100oC was investigated and the (002) preferred orientational growth with good crystallinity was obtained at the V/III ratio of 10000. Annealing at 1300oC indicated the surface morphology and crystallinity stability of AlN film. Secondly the 3C-SiC film was grown on Si substrate with AlN buffer layer. Compared to that without AlN buffer layer, the crystal quality of the 3C-SiC film was improved on the AlN/Si substrate, characterized by X-ray diffraction (XRD) and Raman measurements.


2011 ◽  
Vol 1305 ◽  
Author(s):  
Ikurou Umezu ◽  
Shunto Okubo ◽  
Akira Sugimura

ABSTRACTThe Si nanocrystal-films are prepared by pulsed laser ablation of Si target in a mixture of helium and hydrogen gas. The total gas pressure and hydrogen partial gas pressure were varied to control structure of nanocrystal-film. The surface of Si nanocrystallite was hydrogenated and degree of hydrogenation increased with increasing hydrogen partial gas pressure. The aggregate structure of nanocrystal-film depended on both the total gas pressure and the hydrogen partial gas pressure. The former and the latter alter spatial confinement of Si species during deposition and the surface hydrogenation of individual nanocrystal, respectively. Spatial confinement increases probability of collision between nanocrystals in the plume. While, surface hydrogenation prevents coalescence of nanocrystals. The individual or aggregated nanocrystals formed in the plume reach the substrate and the nanocrystal-film is deposited on the substrate. The non-equilibrium growth processes during pulsed laser ablation are essential for the formation of the surface structure and the subsequent nanocrystal-film growth. Our results indicate that the structure of nanocrystal-film depends on the probabilities of collision and coalescence between nanocrystals in the plume. These probabilities can be varied by controlling the total gas pressure and the hydrogen partial gas pressure.


1996 ◽  
Vol 441 ◽  
Author(s):  
Robert A. Bellman ◽  
Rishi Raj

AbstractSingle crystal heteroepitaxial ferroelectric films are desired for non-linear optical applications to maximize the electro-optic coefficient and minimize waveguide losses. In this study, lithium tantalate films were deposited on (0001) sapphire from lithium hexaethoxytantalate by chemical beam epitaxy. Characterization showed that films had nearly stoichiometric composition, epitaxial orientation, and a high degree of crystalline perfection. However, the films exhibited high optical waveguide losses. Additional characterization by TEM revealed that the films had a two dimensional grain structure with epitaxial variants related by translation and a twin orientation to the substrate. To better understand the nature of the heteroepitaxial growth of lithium tantalate on (0001) sapphire, a model was developed to explain the observed epitaxial orientations, misfit dislocation networks, and grain boundary structures of lithium tantalate on (0001) sapphire.


2007 ◽  
Vol 22 (5) ◽  
pp. 1275-1280 ◽  
Author(s):  
Y. Morikawa ◽  
M. Hirai ◽  
A. Ohi ◽  
M. Kusaka ◽  
M. Iwami

We have studied the heteroepitaxial growth of 3C–SiC film on an Si(100) substrate by plasma chemical vapor deposition using monomethylsilane, a single-molecule gas containing both Si and C atoms. We have tried to introduce an interval process, in which we decrease the substrate temperature for a few minutes at a suitable stage of film growth. It was expected that, during the interval process, stabilization such as desorption of nonreacted precursors and lateral diffusion of species produced at the initial stage of film growth would occur. From the results, it appears that the interval process using a substrate temperature of 800 °C effectively suppresses polycrystallization of 3C–SiC growth on the Si(100) surface


2004 ◽  
Vol 811 ◽  
Author(s):  
Koji Kita ◽  
Masashi Sasagawa ◽  
Masahiro Toyama ◽  
Kentaro Kyuno ◽  
Akira Toriumi

ABSTRACTHfO2 films were deposited by reactive sputtering on Ge and Si substrates simultaneously, and we found not only the interface layer but the HfO2 film was thinner on Ge substrate compared with that on Si substrate. A metallic Hf layer has a crucial role for the thickness differences of both interface layer and HfO2 film, since those thickness differences were observed only when an ultrathin metallic Hf layer was predeposited before HfO2 film deposition. The role of metallic Hf is understandable by assuming a formation of volatile Hf-Ge-O ternary compounds at the early stage of film growth. These results show an advantage of HfO2/Ge over HfO2/Si systems from the viewpoint of further scaling of electrical equivalent thickness of the gate oxide films.


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