The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.
Keyword(s):
AbstractMultilayer interconnection structures incorporating a novel polymeric dielectric derived from a bis-benzocyclobutene(bis-BCB) monomer have been fabricated. This paper discusses the processing conditions for the construction of these circuits and describes electrical characteristics of the dielectric layers. The relative dielectric constant of the BCB film was 2.7. Thermal cycling produced no significant change in the conductance of three level metal via chains through two layers of the polymer.
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