Ultra-Pure Processing: a Key Challenge for Ion Implantation Processing for Fabrication of ULSI Devices

1989 ◽  
Vol 147 ◽  
Author(s):  
M. I. Current ◽  
L. A. Larson
Keyword(s):  
Ion Implantation ◽  
Ion Beam ◽  
Wafer Surface ◽  
Physical Mechanisms ◽  
Foreign Materials ◽  
Ion Implanted

AbstractA key issue in modern ion implantation processing is the requirement for dramatic improvements in the purity of the incident ion beam and reductions in the deposition of foreign materials onto the wafer surface. These deposited materials include particles as well as sputtered and vapor deposited metals and dopants. Physical mechanisms which effect the elemental purity of atoms arriving at the surface of ion implanted wafers and progress towards achieving implantation purity levels of below 100 ppm of the implanted dose for sputtered metal and dopant films are discussed.

Ion-Beam Processing of Ion-Implanted Si

1983 ◽  
Vol 27 ◽  
Author(s):  
H.B. Dietrich ◽  
R.J. Corazzi ◽  
W.F. Tseng
Keyword(s):  
Ion Implantation ◽  
Physical Properties ◽  
Power Density ◽  
Ion Beam ◽  
Sample Temperature ◽  
Device Applications ◽  
Current Densities ◽  
Power Densities ◽  
Ion Implanted

AbstractSubstrates can undergo major temperature excursions during ion implantation if they are not well heat sunk. At power densities on the order of 50 watts per cm−2 radiatively cooled Si will melt in a matter of seconds. Such power densities can be maintained over a few sq. cms with many of the beams produced by even the moderate current machines currently used for doping Si and the III-V's. We have made use of this fact to study pulsed ion-beam annealing of implanted Si. Two types of studies have been carried out. In the first, 5–20 sec proton irradiations were done at power densities of 3–35 watts cm−2 to produce sample temperatures of 500 to 1100°C. 2×1016 cm−2 280 keV B, BF2 , As and P implants were annealed in this manner. Sheet resistances, ρs, versus power density curves were obtained for each ion and compared to psρs vs T data obtained for furnace annealed companion samples. In the second study the 2×1016cm−2 280 keV implants were carried out at progressively higher current densities so that the dopant beam itself raised the sample temperature to 500–1000°C. For each ion (other than B) it was possible to obtain power densities which resulted in self-annealing implants whose sheet resistances were as low as those obtained with the optimal furnace anneal. Details of the experiments, electrical and physical properties of the pulsed ion-beam annealed layers and device applications will be presented in this paper.

The influence of nanostructure formation on properties for Cr implanted PET

2001 ◽  
Vol 665 ◽  
Author(s):  
Wu Yuguang ◽  
Zhang Tonghe ◽  
Zhang Huixing ◽  
Zhang Xiaoji ◽  
Cui Ping ◽  
...  
Keyword(s):  
Wear Resistance ◽  
Ion Implantation ◽  
Metal Ion ◽  
Ion Beam ◽  
Dose Range ◽  
Surface Hardness ◽  
Metal Vapor ◽  
Vacuum Arc ◽  
Ion Beam Modification ◽  
Ion Implanted

ABSTRACTPolyethylene terephthalate (PET) has been modified by Cr ion implantation with a dose range from 1×1016to 2×1017ions /cm2 using a metal vapor vacuum arc MEVVA source. The surface morphology was observed by atomic force microscopy (AFM). The Cr atom precipitation was found. The changes of the structure and composition have been observed with transmission electron microscope (TEM). The TEM photos revealed the presence of Cr nano-meter particles on the implanted PET. It is believed that the change would cause the improvement of the conductive properties and wear resistance. The electrical properties of PET have been improved after metal ion implantation. The resistivity of Cr ion implanted PET decreased obviously with an increase of ion dose. When the metal ion dose with 2×1017cm−2 was implanted into PET, the resistivity of PET could be less than 0.1 Ωm. But when Si or C ions with same dose are implanted PET, the resistivity of PET would be up to several Ωm. The result show that the resistivity of Cr ion implanted sample is obviously lower than that of Si- and C-implanted one. After Cr implantation, the surface hardness and modulus could be increased. The property of the implanted PET has modified greatly. The hardness and modulus of Cr implanted PET with dose of 2×1017/cm2 is 9.5 and 3.1 times greater than that of pristine PET. So we can see that wear resistance improved greatly. The Cr ion beam modification mechanism of PET will be discussed.

Ion Beam Modification of Silicone Rubber

1989 ◽  
Vol 153 ◽  
Author(s):  
Yoshiaki Suzuki ◽  
Masahiro Kusakabe ◽  
Masaya Iwaki ◽  
Masaaki Suzuki
Keyword(s):  
Raman Spectroscopy ◽  
Ion Implantation ◽  
Silicone Rubber ◽  
Ion Beam ◽  
Chemical Properties ◽  
Ion Beam Modification ◽  
Chemical States ◽  
Ft Ir ◽  
Ion Species ◽  
Ion Implanted

AbstractIon implantation in silicone rubber has been carried out in order to study its effects on structure and chemical states. H+-, He+-, C+-, N+-, N2+-, O+-, O2+-, Ne+-, Na+-, Ar+-, and K+- ion implantations were performed at an energy of 150 keV with doses ranging from 1×1013 to 1×1017 ions/cm2 at room temperature. The depth profiles of the ion implanted elements and host elements were investigated by means of XPS and SIMS. The chemical properties were studied by FT-IR-ATR and Raman spectroscopy. XPS results indicated that most of the implanted elements showed a Gaussian like distribution in the silicone polymer matrix, but implanted He+, Ne+, and Ar+ could not be detected. Results of FT-IR-ATR showed that ion implantation broke CH3 and Si-O bonds to form new radicals such as SiOH, >C=0, CH2 and SiHx and the effects varied depending on the implanted ion species. The Raman spectroscopy results showed that ion implanted silicone contained both sp3 and sp2 bonded carbon.

Electron Diffraction Analysis of Microtwin Structures in Regrown (III) Silicon

1982 ◽  
Vol 40 ◽  
pp. 460-461
Author(s):  
P. Ling ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
Electron Diffraction ◽  
Ion Implantation ◽  
Diffraction Analysis ◽  
Diffraction Pattern ◽  
Direct Consequence ◽  
The Other ◽  
Electron Diffraction Analysis ◽  
Defect Microstructures ◽  
Ion Implanted

The defect microstructures of Si arising from ion implantation and subsequent regrowth for a (111) substrate have been found to be dominated by microtwins. Figure 1(a) is a typical diffraction pattern of annealed ion-implanted (111) Si showing two groups of extra diffraction spots; one at positions (m, n integers), the other at adjacent positions between <000> and <220>. The object of the present paper is to show that these extra reflections are a direct consequence of the microtwins in the material.

Focused Ion Beam Irradiation Induced Damages on CMOS and Bipolar Technologies

1998 ◽  
Author(s):  
J. Benbrik ◽  
G. Rolland ◽  
P. Perdu ◽  
B. Benteo ◽  
M. Casari ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Electronic Devices ◽  
Complete Characterization ◽  
Bipolar Transistors ◽  
Ion Beam Irradiation ◽  
Physical Mechanisms ◽  
Dc Characteristics ◽  
Electrical Degradation ◽  
Physical Phenomena

Abstract Focused Ion Beam is commonly used for IC repairs and modifications. However, FIB operation may also induce a damaging impact which can takes place far from the working area due to the charge-up phenomenon. A complete characterization joined to an in-depth understanding of the physical phenomena arising from FIB irradiation is therefore necessary to take into account spurious FIB induced effects and to enhance the success of FIB modifications. In this paper, we present the effects of FIB irradiation on the electrical DC performances of different electronic devices such as nMOS and pMOS transistors, CMOS inverters, PN junctions and bipolar transistors. From the observed behavior of the DC characteristics evolution of the devices, some suggestions about physical mechanisms inducing the electrical degradation are proposed.

scholarly journals Production of ion beams in high-power laser–plasma interactions and their applications

2004 ◽  
Vol 22 (1) ◽  
pp. 19-24 ◽  
Author(s):  
F. PEGORARO ◽  
S. ATZENI ◽  
M. BORGHESI ◽  
S. BULANOV ◽  
T. ESIRKEPOV ◽  
...  
Keyword(s):  
Laser Pulse ◽  
Medical Physics ◽  
Ion Beam ◽  
Laser Pulses ◽  
Ion Beams ◽  
Laser Plasma Interactions ◽  
Physical Mechanisms ◽  
Short Laser Pulses ◽  
Laser Pulse Intensity ◽  
Target Design

Energetic ion beams are produced during the interaction of ultrahigh-intensity, short laser pulses with plasmas. These laser-produced ion beams have important applications ranging from the fast ignition of thermonuclear targets to proton imaging, deep proton lithography, medical physics, and injectors for conventional accelerators. Although the basic physical mechanisms of ion beam generation in the plasma produced by the laser pulse interaction with the target are common to all these applications, each application requires a specific optimization of the ion beam properties, that is, an appropriate choice of the target design and of the laser pulse intensity, shape, and duration.

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