Improvement of Minority-Carrier Properties of GaAs on Si

1989 ◽  
Vol 145 ◽  
Author(s):  
S.M. Vernon ◽  
R.K. Ahrenkiel ◽  
M.M. Al-Jassim ◽  
T.M. Dixon ◽  
K.M. Jones ◽  
...  
Keyword(s):  
Minority Carrier ◽  
Defect Density ◽  
Growth Parameters ◽  
Chemical Vapor ◽  
Minority Carrier Lifetime ◽  
Atomic Layer ◽  
Buffer Layers ◽  
Nucleation Layer ◽  
Material Quality ◽  
Gaas On Si

AbstractGaAs-on-Si structures have been grown by atmospheric-pressure metalorganic chemical vapor deposition (MOCVD); in some samples, the GaAs nucleation layer was deposited by atomic layer epitaxy (ALE). Material quality has been characterized by Nomarski microscopy, time-resolved photoluminescence, trans- mission electron microscopy, and the performance of photovoltaic devices. The minority-carrier lifetime has been correlated with defect density and growth parameters. The use of a thermal-cycle-growth technique is seen to be a major factor in improving GaAs-on-Si material quality without resorting to the use of thick buffer layers.

scholarly journals Study on Annealing Process of Aluminum Oxide Passivation Layer for PERC Solar Cells

Coatings ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1052
Author(s):  
Yu-Chun Huang ◽  
Ricky Wenkuei Chuang
Keyword(s):  
Carrier Lifetime ◽  
Defect Density ◽  
Surface Recombination ◽  
Chemical Vapor ◽  
Minority Carrier Lifetime ◽  
Atomic Layer ◽  
Film Structure ◽  
Open Circuit ◽  
Annealing Process ◽  
Surface Recombination Velocity

In this study, Atomic Layer Deposition (ALD) equipment was used to deposit Al2O3 film on a p-type silicon wafer, trimethylaluminum (TMA) and H2O were used as precursor materials, and then the post-annealing process was conducted under atmospheric pressure. The Al2O3 films annealed at different temperatures between 200–500 °C were compared to ascertain the effect of passivation films and to confirm the changes in film structure and thickness before and after annealing through TEM images. Furthermore, the negative fixed charge and interface defect density were analyzed using the C-V measurement method. Photo-induced carrier generation was used to measure the effective minority carrier lifetime, the implied open-circuit voltage, and the effective surface recombination velocity of the film. The carrier lifetime was found to be the longest (2181.7 μs) for Al2O3/Si post-annealed at 400 °C. Finally, with the use of VHF (40.68 MHz) plasma-enhanced chemical vapor deposition (PECVD) equipment, a silicon nitride (SiNx) film was plated as an anti-reflection layer over the front side of the wafer and as a capping layer on the back to realize a passivated emitter and rear contact (PERC) solar cell with optimal efficiency up to 21.54%.

The Heteroepitaxy and Characterization of Inp and GaInP on Silicon for Solar Cell Applications

1990 ◽  
Vol 198 ◽  
Author(s):  
M.M. Al-Jassim ◽  
R.K. Ahrenkiel ◽  
M.W. Wanlass ◽  
J.M. Olson ◽  
S.M. Vernon
Keyword(s):  
Carrier Lifetime ◽  
Minority Carrier ◽  
Defect Density ◽  
Minority Carrier Lifetime ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Threading Dislocation Density ◽  
Direct Growth

ABSTRACTInP and GaInP layers were heteroepitaxially grown on (100) Si substrates by atmospheric pressure MOCVD. TEM and photoluminescence (PL) were used to measure the defect density and the minority carrier lifetime in these structures. The direct growth of InP on Si resulted in either polycrystalline or heavily faulted single-crystal layers. The use of GaAs buffer layers in InP/Si structures gave rise to significantly improved morphology and reduced the threading dislocation density. The best InP/Si layers in this study were obtained by using GaAs-GaInAs graded buffers. Additionally, the growth of high quality GaInP on Si was demonstrated. The minority carrier lifetime of 7 ns in these layers is the highest of any III-V/Si semiconductor measured in our laboratory.

A Model for Indium Incorporation in the Growth of InGaN Films

1996 ◽  
Vol 449 ◽  
Author(s):  
E. L. Piner ◽  
F. G. McIntosh ◽  
J. C. Roberts ◽  
K. S. Boutros ◽  
M. E. Aumer ◽  
...  
Keyword(s):  
Metalorganic Chemical Vapor Deposition ◽  
Growth Parameters ◽  
Chemical Vapor ◽  
Atomic Layer ◽  
Atomic Layer Epitaxy ◽  
Reaction Pathways ◽  
Balance Model ◽  
Mass Balance Model ◽  
Structural And Optical Properties ◽  
Indium Metal

ABSTRACTThe development of high quality indium based III-nitride compounds is lagging behind the corresponding aluminum and gallium based compounds. Potential problems confronting the growth of epitaxial and double heterostructure InGaN will be discussed. A mass balance model is presented describing the competing reaction pathways occurring during the growth of indium containing compounds. Atomic layer epitaxy and metalorganic chemical vapor deposition grown InGaN films will be used to explain this model. Also, the growth parameters leading to the attainment of high InN percentages, reduced indium metal formation, and improved structural and optical properties of indium containing nitrides will be discussed.

High rate growth of device grade silicon thin films for solar cells

2001 ◽  
Vol 664 ◽  
Author(s):  
M. Kondo ◽  
S. Suzuki ◽  
Y. Nasuno ◽  
A. Matsuda
Keyword(s):  
Growth Rate ◽  
Solar Cells ◽  
Defect Density ◽  
Chemical Vapor ◽  
High Growth ◽  
Ion Bombardment ◽  
High Rate ◽  
Limiting Factors ◽  
Material Quality ◽  
Deuterium Dilution

ABSTRACTWe have developed a plasma enhanced chemical vapor deposition (PECVD) technique for high-rate growth of µc-Si:H at low temperatures using hydrogen diluted monosilane source gas under high-pressure depletion conditions. It was found that material qualities deteriorate, e.g. crystallinity decreases and defect density increases with increasing growth rate mainly due to ion damage from the plasma. We have found that deuterium dilution improves not only the crystallinity but also defect density as compared to hydrogen dilution and that deuterium to hydrogen ratio incorporated in the film has a good correlation with crystallinity. The advantages of the deuterium dilution are ascribed to lower ion bombardment due to slower ambipolar diffusion of deuterium ion from the plasma. Further improvement of material quality has been achieved using a triode technique where a mesh electrode inserted between cathode and anode electrodes prevents from ion bombardment. In combination with a shower head cathode, the triode technique remarkably improves the crystallinity as well as defect density at a high growth rate. As a consequence, we have succeeded to obtain much better crystallinity and uniformity at 5.8 nm/s with a defect density of 2.6×1016cm−3. We also discuss the limiting factors of growth rate and material quality for µc-Si solar cells.

Large scale MOCVD growth of GaAs-on-Si by atomic layer epitaxy using initial buffer layers

1990 ◽  
Vol 106 (2-3) ◽  
pp. 421-425 ◽  
Author(s):  
Norio Hayafuji ◽  
Motoharu Miyashita ◽  
Hisao Kumabe ◽  
Toshio Murotani
Keyword(s):  
Large Scale ◽  
Atomic Layer ◽  
Buffer Layers ◽  
Atomic Layer Epitaxy ◽  
Gaas On Si ◽  
Mocvd Growth ◽  
Initial Buffer

Mobility-Lifetime Products in a-Si:H and the Dangling Bond Recombination Model

1992 ◽  
Vol 258 ◽  
Author(s):  
E. Morgado
Keyword(s):  
Fermi Level ◽  
Carrier Lifetime ◽  
Minority Carrier ◽  
Defect Density ◽  
Minority Carrier Lifetime ◽  
Localized States ◽  
Correlated Electrons ◽  
Recombination Model ◽  
Model Equations ◽  
Determinant Factor

ABSTRACTFermi level and light intensity dependences of electron and hole lifetimes have been calculated using a recombination model which considers positively correlated dangling bonds as the only localized states in the gap. The model equations have been solved numerically taking into account the non-equilibrium statistics of correlated electrons and the Fermi level dependence of the defect density. The results are in agreement with the anticorrelated behavior of the majority' and minority carrier μτ products observed in a-Si:H. The majority carrier lifetime is found to be more sensitive to the photogeneration rate than the minority carrier lifetime. The position of the Fermi level with respect to the energies of the D° and D- centers in the gap is a determinant factor of the (°τ)e/(μτ)h ratio.

TEM and SEM Studies of MOCVD-Grown GaP on Si

1985 ◽  
Vol 62 ◽  
Author(s):  
M. M. Ai-Jassim ◽  
J. M. Olson ◽  
K. M. Jones
Keyword(s):  
Defect Density ◽  
Growth Parameters ◽  
Three Dimensional ◽  
Chemical Vapor ◽  
Structural Defects ◽  
Organic Chemical ◽  
Cross Sectional ◽  
Plan View ◽  
Si Substrates ◽  
Antiphase Domains

ABSTRACTGaP and GaP/GaAsP epitaxial layers have been grown on Si substrates by metal-organic chemical vapor deposition (MOCVD). These layers were characterized by SEM and TEM plan-view and cross-sectional examination. At growth temperatures ranging from 600° C to 800° C, the initial stages of growth were dominated by three-dimensional nucleation. TEM studies showed that at high temperatures the nuclei were generally misoriented with respect to each other yielding, upon coalescence, polycrystalline layers. The growth of single-crystal layers was achieved by nucleating a 30–50 nm layer of GaP at 500° C, followed by annealing and continued growth at 750 ° C. The defect density in these structures was investigated as a function of various growth parameters and substrate conditions. A high density of structural defects was generated at the Si/GaP interface. The use of 2° off (100) Si substrates resulted in GaP layers free of antiphase domains. These results and their implications are discussed.

Improved MOCVD Growth of GaAs on Si

1987 ◽  
Vol 91 ◽  
Author(s):  
R.M. Lum ◽  
J.K. Klingert ◽  
B.A. Davidson ◽  
M.G. Lamont
Keyword(s):  
Buffer Layer ◽  
Rutherford Backscattering Spectrometry ◽  
Growth Parameters ◽  
Buffer Layers ◽  
Double Crystal ◽  
Gaas On Si ◽  
Mocvd Growth ◽  
Gaas Films ◽  
Gaas Buffer Layer ◽  
Direct Growth

ABSTRACTIn the direct growth of GaAs on Si by MOCVD the overall quality of the heteroepitaxial film is controlled to a large extent by the growth parameters of the initial GaAs buffer layer. We have investigated the structural properties of this layer using Rutherford Backscattering Spectrometry (RBS) and X-ray double crystal diffractometry. The crystallinity of the buffer layer was observed to improve with increasing layer thickness in the range 10–100nm, and then to rapidly degrade for thicker layers. High temperature (750°C) annealing of the buffer layers resulted in considerable reordering of all but the thicker (>200 nm) layers. Alteration of the usual GaAs/Si growth sequence to include an in-situ anneal of the buffer layer after growth interruption yielded GaAs films with improved structural, optical and electrical properties.

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