The Photoluminescence and TEM Studies of Patterned GaAs films on Si Substrate Grown by Molecular Beam Epitaxy

1988 ◽  
Vol 116 ◽  
Author(s):  
Henry P. Lee ◽  
Yi-He Huang ◽  
Xiaoming Liu ◽  
Hong Lin ◽  
John. S. Smith ◽  
...  

AbstractPatterned epitaxial GaAs films have been formed on Si substrates by either growth over patterned substrate (selective -area epitaxy) or chemical etching of patterns after growth. The optical properties of these samples are studied by 77K photoluminescence (PL) and the defect structures are investigated by transmission electron microscope (TEM). The patterned substrate consisted of bare Si stripes with width ranging from 10 µm to 100 µm surrounded by Si3N4 films on both sides and a reference area of bare Si. For 1.5 µmiann d 3 µm thick films, PL intensities from the films inside the 10 µm stripe shows 140% and 75% increase over unpatterned areas while the residual tensile stress in the patterned films is very similar to that of the unpatterned area. The increase in the photoluminescence intensity is ascribed to the reduction of crystalline defects inside the the window area. In the chemically etched sample, the pattern consisted of 4 µm by 4 µm squares and 1 mm long stripes with widths ranging from 100 µm to 4 plm. From the shift of PL peaks, a monotonic decrease in the tensile stress versus stripe width is observed. In particular, when the width of the stripe is less than 7 µm. tensile stress becomes essentially uniaxial in agreement with the results obtained by Yacobi et al [16] on a GaAs on InP sample. The polarization of the luminescence spectra parallel and perpendicular to the uniaxial stress of a 4 µm wide stripe agrees well with theoretical prediction. It is also observed that tensile stress is almost completely relieved in the 4 µm by 4 muentc hed squares.

1987 ◽  
Vol 91 ◽  
Author(s):  
T. Yao ◽  
Y. Okada ◽  
H. Kawanami ◽  
S. Matsui ◽  
A. Imagawa ◽  
...  

ABSTRACTResidual stress in molecular beam epitaxially (MBE) grown GaAs films on 4°-off (100)Si substrates is investigated with X-ray diffraction technique. It is experimentally confirmed that the GaAs lattice suffers tetragonal deformation with the c-axis being [100]. The GaAs lattice tilts by approximately 0.2° towards the tilted direction of the substrate. It is found that two-dimensional compressive stress dominates in GaAs films thinner than 0.3 μm in thickness, while two-dimensional tensile stress dominates in thicker films. The variation of the stress is understood in terms of a combination of misfit stress and thermal stress. The residual tensile stress is larger than 1 × 109 dyn/cm2 in the films thicker than I pm. The effect of the stress on the reliability of semiconductor laser diodes is discussed.


2002 ◽  
Vol 729 ◽  
Author(s):  
Gabe Kuhn ◽  
Todd Myers ◽  
Susmita Bose ◽  
Amit Bandyopadhyay

AbstractIn our research, PZT film actuated micro-machined Si substrates are being developed for numerous applications in which membranes are actuated primarily in flexural mode. Silicon wafers, 3-inches in diameter, underwent boron doping in order to act as an etch stop. Approximately 200-nm of SiO2 was grown on the boron-doped side of the wafers. Photolithography and backside etching using EDP resulted in 2-μm thick membranes. Using reactive ion etching (RIE), beam structures resulted from the membranes. Nano-mechanical testing of the beams indicated that there were substantial residual tensile stresses in these structures. Initial calculations reveal a tensile stress of 57.7 MPa in the Si/SiO2 beams. The residual tensile stress subsequently caused the overall beam stiffness to be two orders of magnitude higher than it would be without stress. After stripping the oxide with a buffered oxide etchant (BOE), a residual stress of 26.5 MPa was measured, which is presumably caused from the remaining boron concentration. The aim of this paper is to understand influences of boron doping and processing variables on residual stresses.


1988 ◽  
Vol 53 (24) ◽  
pp. 2394-2396 ◽  
Author(s):  
Henry P. Lee ◽  
Xiaoming Liu ◽  
Hong Lin ◽  
John S. Smith ◽  
Shyh Wang ◽  
...  

1999 ◽  
Vol 594 ◽  
Author(s):  
Mengcheng Lu ◽  
C. Jeffrey Brinker

AbstractLow dielectric constant silica films are made using a surfactant templated sol-gel process (K∼2.5) or an ambient temperature and pressure aerogel process (K∼1.5). This paper will present the in-situ measurement and analysis of stress development during the making of these films, from the onset of drying till the end of heating. The drying stress is measured by a cantilever beam technique; the thermal stress is measured by monitoring the wafer curvature using a laser deflection method. During the course of drying, the surfactant templated films experience a low drying stress due to the influence of the surfactant on surface tension and extent of siloxane condensation. The aerogel films first develop a biaxial tensile stress due to solidification and initial drying. At the final stage of drying where the drying stress vanishes, dilation of the film recreates the porosity of the wet gel state, reducing the residual stress to zero. For the surfactant templated films, very small residual tensile stress remains after the heat treatment is finished (∼30MPa). Aerogel film has almost no measurable stress developed in the calcination process. In situ spectroscopic ellipsometry analysis during drying and heating, and TGA/DTA are all used to help understand the stress development.


1999 ◽  
Vol 564 ◽  
Author(s):  
J. P. Lokker ◽  
R. S. A. van Winden ◽  
A. M. Janssen ◽  
S. Radelaar

AbstractThis paper reports on the influence of the copper concentration on the mechanical behaviour during thermal cycling and during isothermal holds of Al-Cu thin films on Si substrates. The Cu concentration has been varied in the range between 0 to 1 at.%Upon heating, the films with the larger amount of Cu showed a clear maximum in compressive stress. Moreover, during cooling these samples show a tensile stress increase at the onset precipitation temperature. Further cooling below 200 °C leads to the characteristic tensile stress increase often observed for Al-Cu thin films. An isothermal hold during cooling at 250 °C leads to temporary strengthening of all Al-Cu. The extent of the strengthening is dependent on the Cu concentration and is clearly dependent on the duration of the isothermal hold. Upon further cooling the strengthening disappears and the stress develops according to the original stress temperature dependence. The observations are discussed in terms of solid solution hardening and precipitation hardening.


1986 ◽  
Vol 67 ◽  
Author(s):  
N. Otsuka ◽  
C. Choi ◽  
Y. Nakamura ◽  
S. Nagakura ◽  
R. Fischer ◽  
...  

ABSTRACTRecent studies have shown that high quality GaAs films can be grown by MBE on Si substrates whose surfaces are slightly tilted from the (100) plane. In order to investigate the effect of the tilting of substrate surfaces on the formation of threading dislocations, the GaAs/Si epitaxial interfaces have been observed with a 1 MB ultra-high vacuum, high voltage electron microscope. Two types of misfit dislocations, one with Burgers vectors parallel to the interface and the other with Burgers vectors inclined from the interface, were found in these epitaxial interfaces. The observation of crosssectional samples perpendicular to each other has shown that the tilting of the substrate surface directly influences the generation of these two types of misfit dislocations. The mechanism of the reduction of threading dislocations by the tilting of the substrate surface is discussed based on these observations.


2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xiaoyu Zhang ◽  
Dichen Li ◽  
Jiale Geng

Purpose Laser cladding deposition is limited in industrial application by the micro-defects and residual tensile stress for the thermal forming process, leading to lower fatigue strength compared with that of the forging. The purpose of this paper is to develop an approach to reduce stress and defects. Design/methodology/approach A hybrid process of laser cladding deposition and shot peening is presented to transform surface strengthening technology to the overall strengthening technology through layer-by-layer forming and achieve enhancement. Findings The results show that the surface stress of the sample formed by the hybrid process changed from tensile stress to compressive stress, and the surface compressive stress introduced could reach more than four times the surface tensile stress of the laser cladding sample. At the same time, internal micro-defects such as pores were reduced. The porosity of the sample formed by the hybrid process was reduced by 90.12% than that of the laser cladding sample, and the surface roughness was reduced by 43.16%. Originality/value The authors believe that the hybrid process proposed in this paper can significantly expand the potential application of laser cladding deposition by solving its limitations, promoting its efficiency and applicability in practical cases.


Crystals ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 114 ◽  
Author(s):  
Vladyslav Seminko ◽  
Pavel Maksimchuk ◽  
Iryna Bespalova ◽  
Yuri Malyukin

Luminescence properties of Lu2SiO5:Ce3+ and Y2SiO5:Ce3+ nanocrystals were studied using photo- and X-ray luminescence techniques. The crystal structure of Re2SiO5 nanocrystals (P21/c space group) differs from the crystal structure of Re2SiO5 bulk crystals (C2/c space group) with 9- and 7-oxygen-coordinated cation positions instead of 6- and 7-coordinated ones observed for Re2SiO5 bulk crystals. Two optical centers (Ce1 and Ce2) were observed for Re2SiO5:Ce3+ nanocrystals originating from cerium ions substituting 9- and 7-oxygen-coordinated cation sites. Preferential substitution of larger cation sites by cerium ions leads to higher photoluminescence intensity of Ce1 centers, however, Ce2 centers are the main centers for electron-hole recombination, so only Ce2 band is observed in X-ray luminescence spectra. The features of oxygen coordination of Ce1 and Ce2 centers and high content of oxygen vacancies in Re2SiO5:Ce3+ nanocrystals can provide preferential trapping of electrons near Ce2 centers, and therefore, the dominant role of Ce2 band in X-ray luminescence spectra.


1991 ◽  
Vol 8 (3) ◽  
pp. 149-152
Author(s):  
Xiao Guangming ◽  
Yin Shiduan ◽  
Zhang Jingping ◽  
Ding Aiju ◽  
Dong Aihua ◽  
...  

1998 ◽  
Vol 37 (Part 1, No. 1) ◽  
pp. 39-44 ◽  
Author(s):  
Kenzo Maehashi ◽  
Hisao Nakashima ◽  
Frank Bertram ◽  
Peter Veit ◽  
Jürgen Christen

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