Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus and Boron

1987 ◽  
Vol 106 ◽  
Author(s):  
H.-J. Kim ◽  
C. V. Thompson
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Polycrystalline Silicon ◽  
Vacancy Concentration ◽  
Silicon Films ◽  
Boundary Motion ◽  
Diffusive Process ◽  
Polycrystalline Silicon Films ◽  
Diffusive Processes ◽  
Grain Boundary Motion

ABSTRACTIn previous work it has been shown that doping of silicon with P or As leads to enhanced rates of grain growth while doping with B has little effect, except in compensation of the effect of P or As. Here we report a detailed study of the effects of P doping on normal grain growth in silicon films. We also outline a kinetic model for grain growth which is consistent with the various observed effects of dopants. This model is based on the assumption that dopants primarily affect grain boundary mobilities and that grain boundary motion occurs through parallel diffusive and non-diffusive processes. It is further assumed that the rate of the diffusive process is proportional to the vacancy concentration which is a known function of the electron concentration.

Grain Growth Processes during Transient Annealing of As-Implanted, Polycrystalline-Silicon Films

1984 ◽  
Vol 35 ◽  
Author(s):  
S.J. Krause ◽  
S.R. Wilson ◽  
W.M. Paulson ◽  
R.B. Gregory
Keyword(s):  
Growth Rate ◽  
Grain Size ◽  
Grain Growth ◽  
Polycrystalline Silicon ◽  
Average Diameter ◽  
Silicon Films ◽  
Growth Processes ◽  
Cross Sectional ◽  
Polycrystalline Silicon Films ◽  
Equiaxed Grains

ABSTRACTPolycrystalline silicon films of 300 nm thickness were deposited on oxidized wafer surfaces, implanted with As, and annealed on a Varian IA 200 rapid thermal annealer. Transmission electron microscopy was used to study through-thickness and cross sectional views of grain size and morphology of as-deposited and of transient annealed films. A bimoda] distribution of grain sizes was present in as-deposited polycrystalline silicon films. The first population was due to columnar growth of some grains to a final average diameter of 20 rm. The second population of small equiaxed grains of 5 nm average diameter were formed early in the deposition process. During transient annealing grains in the first population grew rapidly up to 280-nm equiaxed grains. After this the growth rate decreased due to the grain size reaching the thickness of the film. Grains in the second population grew rapidly up to a size of 150 nm, after which the growth rate was lowered due to grains impinging upon one another. The grain growth processes for both populations have been described with a modified model for interfacially driven grain growth. This model accounts for diffusion and grain growth which occur with rapidly rising and falling temperatures during short annealing times characteristic of transient annealing processes.

Grain boundary diffusion of aluminum in polycrystalline silicon films

1980 ◽  
Vol 51 (3) ◽  
pp. 1576-1581 ◽  
Author(s):  
J. C. M. Hwang ◽  
P. S. Ho ◽  
J. E. Lewis ◽  
D. R. Campbell
Keyword(s):  
Grain Boundary ◽  
Polycrystalline Silicon ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Silicon Films ◽  
Polycrystalline Silicon Films

Grain growth of polycrystalline silicon films on SiO2by cw scanning electron beam annealing

1981 ◽  
Vol 39 (8) ◽  
pp. 645-647 ◽  
Author(s):  
Kenji Shibata ◽  
Tomoyasu Inoue ◽  
Tadahiro Takigawa ◽  
Shintaro Yoshii
Keyword(s):  
Electron Beam ◽  
Grain Growth ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Scanning Electron Beam ◽  
Polycrystalline Silicon Films ◽  
Scanning Electron
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