Growth of Hexagonal Boron Nitride on Microelectronic Compatible Substrates

2015 ◽  
Vol 1781 ◽  
pp. 1-10 ◽  
Author(s):  
Michael Snure ◽  
Qing S. Paduano

ABSTRACTBoron nitride has attracted a great deal of attention as a two dimensional (2D) insulator for substrate and gate dielectric applications in 2D electronics. Development of a scalable technique to grow mono- to few-layer h-BN on microelectronics compatible substrates is desirable. Work on the growth of atomically smooth BN and graphene on sapphire and Si is presented in this paper. Two approaches are described: i) growth of h-BN and graphene on Si and sapphire substrates using a catalyzing Cu thin film, and ii) low pressure metal organic chemical vapor deposition (MOCVD) growth on sapphire. In approach i) we discuss problems associated with the thermal instability of Cu at the interface with the substrate and show how the stability may be improved through the use of a thin Ni buffer layer or careful substrate selection. The correlation between Cu film morphology and h-BN (and graphene) quality is shown. In approach ii) we find two different growth modes, 3D island growth at low V/III ratios and self-terminating growth at high V/III ratios. Under self-terminating growth atomically smooth few-layer h-BN films are produced. Nitridation of the sapphire surface is found to promote this self-terminating growth by improving nucleation of BN on the substrate. Finally, we present results from the growth of graphene/h-BN on sapphire in a single process.

2021 ◽  
Vol 59 (7) ◽  
pp. 505-513
Author(s):  
Zahid Hussain ◽  
Hye-Won Yang ◽  
Byung-Sang Choi

A three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) networked Cu-Ni (3DihBN-Cu-Ni) composite was successfully synthesized in situ using a simple two-step process which involved the compaction of mixed Cu-Ni powders (70 wt.% Cu and 30 wt.% Ni) into a disc followed by metal-organic chemical vapor deposition (MOCVD) at 1000 oC. During MOCVD, the Cu-Ni alloy grains acted as a template for the growth of hexagonal boron nitride (hBN) while decaborane and ammonia were used as precursors for boron and nitrogen, respectively. Boron and nitrogen atoms diffused into the Cu-Ni solution during the MOCVD process and precipitated out along the Cu-Ni interfaces upon cooling, resulting in the formation of the 3Di hBN-Cu-Ni composite. Energy-dispersive spectroscopic analysis confirmed the presence of boron and nitrogen atoms at the interfaces of Cu-Ni alloy grains. Optical microscopy examination indicated that there was a minimum amount of bulk hBN at a certain compaction pressure (280 MPa) and sintering time (30 min). Scanning electron microscopy and transmission electron microscopy revealed that an interconnected network of hBN layers surrounding the Cu-Ni grains developed in the 3Di-hBN-Cu-Ni composite. This 3Di-hBN network is expected to enhance the mechanical, thermal, and chemical properties of the 3Di-hBN-Cu-Ni composite. Moreover, the foam-like 3Di-hBN extracted from 3Di-hBN-Cu-Ni composite could have further applications in the fields of biomedicine and energy storage.


2015 ◽  
Vol 1726 ◽  
Author(s):  
Qing S. Paduano ◽  
Michael Snure ◽  
Jodie Shoaf

ABSTRACTIn this report, we describe a process for achieving atomically smooth, few-layer thick, hexagonal boron nitride (h-BN) films on sapphire substrates by MOCVD, using Triethylboron (TEB) and NH3 as precursors. Two different growth modes have been observed depending on the V/III ratio. Three-dimensional (3D) island growth is dominant in the low V/III range; in this range growth rate decreases with increasing deposition temperature. This island growth mode transitions to a self-terminating growth mode when V/III > 2000, over the entire deposition temperature range studied (i.e. 1000-1080oC). Raman spectroscopy verifies the h-BN phase of these films, and atomic force microscopy measurements confirm that the surfaces are smooth and continuous, even over atomic steps on the surface of the substrate. Using X-ray reflectance measurements, the thickness of each film grown under a range of conditions and times was determined to consistently terminate at 1.6nm, with a variation of less than 0.2 nm. Thus we have identified a self-terminating growth mode that enables robust synthesis of h-BN with highly uniform and reliable thickness on non-metal catalyzed substrates. Furthermore, this self-terminating growth behavior has shown signs of transitioning to continuous growth as deposition temperature increases.


2019 ◽  
Vol 3 (1) ◽  
Author(s):  
Xibiao Ren ◽  
Jichen Dong ◽  
Peng Yang ◽  
Jidong Li ◽  
Guangyuan Lu ◽  
...  

2D Materials ◽  
2017 ◽  
Vol 4 (2) ◽  
pp. 025117 ◽  
Author(s):  
Ariel Ismach ◽  
Harry Chou ◽  
Patrick Mende ◽  
Andrei Dolocan ◽  
Rafik Addou ◽  
...  

1991 ◽  
Vol 6 (11) ◽  
pp. 2393-2396 ◽  
Author(s):  
Vladimir Pavlović ◽  
Horst-Rainer Kötter ◽  
Christoph Meixner

Chemical vapor deposition (CVD) of boron nitride (BN) is most readily performed using BCl3 and NH3, which are brought into the deposition zone through two separate tubes. This causes some problems: inadequate mixing leading to a nonuniform deposit, formation of solid intermediates, etc. To avoid these problems, the process was performed by mixing BCl3 and NH3 at elevated temperatures (120–220 °C) prior to entering the deposition zone. The reaction between them took place by the forming of volatile stoichiometric B–N compounds (trichloroborazine and iminochloroborane), which were then transported through a single tube into a deposition zone. The resulting deposit was found to be hexagonal boron nitride.


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