Passivation of Silicon Surfaces by Treatment in Water at 110°C

2015 ◽  
Vol 1770 ◽  
pp. 37-42 ◽  
Author(s):  
Tomohiko Nakamura ◽  
Toshiyuki Sameshima ◽  
Masahiko Hasumi ◽  
Tomohisa Mizuno

ABSTRACTWe report effective passivation of silicon surfaces by heating single crystalline silicon substrates in liquid water at 110°C for 1 h. High values of photo-induced effective minority carrier lifetime τeff in the range from 1.9x10-4 to 1.8x10-3 s were obtained for the n-type samples with resistivity in the range from 1.7 to 18.1 Ωcm. τeff ranged from 8.3x10-4 to 3.1x10-3 s and from 1.2x10-4 to 6.0x10-4 s over the area of 4 inch sized 17.0 Ωcm n- and 15.0 Ωcm p-type samples, respectively. The heat treatment in liquid water at 110°C for 1 h resulted in low surface recombination velocities ranging from 7 to 34 cm/s and from 49 to 250 cm/s for those 4 inch sized n- and p-type samples, respectively. The thickness of the passivation layer was estimated to be approximate only 0.7 nm. Metal-insulator-semiconductor type solar cell was demonstrated with Al and Au metal formation on the passivated surface. Rectified current voltage and solar cell characteristics were observed. Open circuit voltage of 0.47 V was obtained under AM 1.5 light illumination at 100 mW/cm2.

2012 ◽  
Vol 1426 ◽  
pp. 353-358
Author(s):  
Toshiyuki Sameshima ◽  
Kochi Betsuin ◽  
Shinya Yoshidomi

ABSTRACTChange in the light-induced minority carrier effective lifetime τeff of crystalline silicon caused by rapid laser heating is reported. The top surface of n- and p-type silicon substrates with thicknesses of 520 μm coated with thermally grown SiO2 layers were heated by a 940 nm semiconductor laser for 4 ms. τeff was measured by a method of microwave absorption caused by carriers induced by 620 nm light illumination at 1.5 mW/cm2. τeff for light illumination of the top surfaces was decreased to 1.0x10-5 and 4.8x10-6 s by laser heating at 5.0x104 W/cm2 for n- and ptype 520-μm-thick silicon substrates, respectively. The decrease in τeff resulted from the generation of defect states associated with the carrier recombination velocity at the top surface region, Stop. Laser heating increased Stop to 6000 and 10000 cm/s for n- and p-type silicon samples, respectively. Heat treatment at 400oC for 4h markedly decreased Stop to 21 and 120 cm/s, respectively, for n- and p-type silicon samples heated at 5.0x104 W/cm2. Laser heating at 4.0x104 W/cm2 for 4 ms was also applied to samples treated with Ar plasma irradiation at 50 W for 60 s, which decreased τeff (top) to 2.0x10-5 s and 3.9x10-6 s for n- and p-type silicon samples, respectively. Laser heating successfully increased τeff (top) to 2.8x10-3 and 4.1x10-4 s for n- and p-type samples, respectively. Laser irradiation at 4x104 W/cm2played a role of curing recombination defect sites.


2013 ◽  
Vol 2013 ◽  
pp. 1-13 ◽  
Author(s):  
Atteq ur Rehman ◽  
Soo Hong Lee

The p-type crystalline silicon wafers have occupied most of the solar cell market today. However, modules made with n-type crystalline silicon wafers are actually the most efficient modules up to date. This is because the material properties offered by n-type crystalline silicon substrates are suitable for higher efficiencies. Properties such as the absence of boron-oxygen related defects and a greater tolerance to key metal impurities by n-type crystalline silicon substrates are major factors that underline the efficiency of n-type crystalline silicon wafer modules. The bi-facial design of n-type cells with good rear-side electronic and optical properties on an industrial scale can be shaped as well. Furthermore, the development in the industrialization of solar cell designs based on n-type crystalline silicon substrates also highlights its boost in the contributions to the photovoltaic industry. In this paper, a review of various solar cell structures that can be realized on n-type crystalline silicon substrates will be given. Moreover, the current standing of solar cell technology based on n-type substrates and its contribution in photovoltaic industry will also be discussed.


Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 592
Author(s):  
Myeong Sang Jeong ◽  
Yonghwan Lee ◽  
Ka-Hyun Kim ◽  
Sungjin Choi ◽  
Min Gu Kang ◽  
...  

In the fabrication of crystalline silicon solar cells, the contact properties between the front metal electrode and silicon are one of the most important parameters for achieving high-efficiency, as it is an integral element in the formation of solar cell electrodes. This entails an increase in the surface recombination velocity and a drop in the open-circuit voltage of the solar cell; hence, controlling the recombination velocity at the metal-silicon interface becomes a critical factor in the process. In this study, the distribution of Ag crystallites formed on the silicon-metal interface, the surface recombination velocity in the silicon-metal interface and the resulting changes in the performance of the Passivated Emitter and Rear Contact (PERC) solar cells were analyzed by controlling the firing temperature. The Ag crystallite distribution gradually increased corresponding to a firing temperature increase from 850 ∘C to 950 ∘C. The surface recombination velocity at the silicon-metal interface increased from 353 to 599 cm/s and the open-circuit voltage of the PERC solar cell decreased from 659.7 to 647 mV. Technology Computer-Aided Design (TCAD) simulation was used for detailed analysis on the effect of the surface recombination velocity at the silicon-metal interface on the PERC solar cell performance. Simulations showed that the increase in the distribution of Ag crystallites and surface recombination velocity at the silicon-metal interface played an important role in the decrease of open-circuit voltage of the PERC solar cell at temperatures of 850–900 ∘C, whereas the damage caused by the emitter over fire was determined as the main cause of the voltage drop at 950 ∘C. These results are expected to serve as a steppingstone for further research on improvement in the silicon-metal interface properties of silicon-based solar cells and investigation on high-efficiency solar cells.


2006 ◽  
Vol 910 ◽  
Author(s):  
Qi Wang ◽  
Matt P. Page ◽  
Eugene Iwancizko ◽  
Yueqin Xu ◽  
Yanfa Yan ◽  
...  

AbstractWe have achieved an independently-confirmed 17.8% conversion efficiency in a 1-cm2, p-type, float-zone silicon (FZ-Si) based heterojunction solar cell. Both the front emitter and back contact are hydrogenated amorphous silicon (a-Si:H) deposited by hot-wire chemical vapor deposition (HWCVD). This is the highest reported efficiency for a HWCVD silicon heterojunction (SHJ) solar cell. Two main improvements lead to our most recent increases in efficiency: 1) the use of textured Si wafers, and 2) the application of a-Si:H heterojunctions on both sides of the cell. Despite the use of textured c-Si to increase the short-circuit current, we were able to maintain the same 0.65 V open-circuit voltage as on flat c-Si. This is achieved by coating a-Si:H conformally on the c-Si surfaces, including covering the tips of the anisotropically-etched pyramids. A brief atomic H treatment before emitter deposition is not necessary on the textured wafers, though it was helpful in the flat wafers. It is essential to high efficiency SHJ solar cells that the emitter grows abruptly as amorphous silicon, instead of as microcrystalline or epitaxial Si. The contact on each side of the cell comprises a thin (< 5 nm) low substrate temperature (~100°C) intrinsic a-Si:H layer, followed by a doped layer. Our intrinsic layers are deposited at 0.3-1.2 nm/s. The doped emitter and back-contact layers were deposited at a higher temperature (>200°C) and grown from PH3/SiH4/H2 and B2H6/SiH4/H2 doping gas mixtures, respectively. This combination of low (intrinsic) and high (doped layer) growth temperatures was optimized by lifetime and surface recombination velocity measurements. Our rapid efficiency advance suggests that HWCVD may have advantages over plasma-enhanced (PE) CVD in fabrication of high-efficiency heterojunction c-Si cells; there is no need for process optimization to avoid plasma damage to the delicate, high-quality, Si wafers.


2014 ◽  
Vol 21 (03) ◽  
pp. 1450041 ◽  
Author(s):  
AHMED ZARROUG ◽  
LOTFI DERBALI ◽  
RACHID OUERTANI ◽  
WISSEM DIMASSI ◽  
HATEM EZZAOUIA

This paper investigates the combined effect of mechanical grooving and porous silicon (PS) on the front surface reflectance and the electronic properties of crystalline silicon substrates. Mechanical surface texturization leads to reduce the cell reflectance, enhance the light trapping and augment the carrier collection probability. PS was introduced as an efficient antireflective coating (ARC) onto the front surface of crystalline silicon solar cell. Micro-periodic V-shaped grooves were made by means of a micro-groove machining process prior to junction formation. Subsequently, wafers were subjected to an isotropic potassium hydroxide ( KOH ) etching so that the V-shape would be turned to a U-shape. We found that the successive treatment of silicon surfaces with stain-etching, grooving then alkaline etching enhances the absorption of the textured surface, and decreases the reflectance from 35% to 7% in the 300–1200 nm wavelength range. We obtained a significant increase in the overall light path that generates the building up of the light trapping inside the substrate. We found an improvement in the illuminated I–V characteristics and an increase in the minority carrier lifetime τeff. Such a simple method was adopted to effectively reinforce the overall device performance of crystalline silicon-based solar cells.


2009 ◽  
Vol 48 (24) ◽  
pp. 4402-4405 ◽  
Author(s):  
Elizabeth A. Gibson ◽  
Amanda L. Smeigh ◽  
Loïc Le Pleux ◽  
Jérôme Fortage ◽  
Gerrit Boschloo ◽  
...  

Coatings ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1052
Author(s):  
Yu-Chun Huang ◽  
Ricky Wenkuei Chuang

In this study, Atomic Layer Deposition (ALD) equipment was used to deposit Al2O3 film on a p-type silicon wafer, trimethylaluminum (TMA) and H2O were used as precursor materials, and then the post-annealing process was conducted under atmospheric pressure. The Al2O3 films annealed at different temperatures between 200–500 °C were compared to ascertain the effect of passivation films and to confirm the changes in film structure and thickness before and after annealing through TEM images. Furthermore, the negative fixed charge and interface defect density were analyzed using the C-V measurement method. Photo-induced carrier generation was used to measure the effective minority carrier lifetime, the implied open-circuit voltage, and the effective surface recombination velocity of the film. The carrier lifetime was found to be the longest (2181.7 μs) for Al2O3/Si post-annealed at 400 °C. Finally, with the use of VHF (40.68 MHz) plasma-enhanced chemical vapor deposition (PECVD) equipment, a silicon nitride (SiNx) film was plated as an anti-reflection layer over the front side of the wafer and as a capping layer on the back to realize a passivated emitter and rear contact (PERC) solar cell with optimal efficiency up to 21.54%.


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