scholarly journals Individualization and Electrical Characterization of SiGe Nanowires

2012 ◽  
Vol 1408 ◽  
Author(s):  
M. Monasterio ◽  
A. Rodríguez ◽  
T. Rodríguez ◽  
C. Ballesteros
Keyword(s):  
Electrical Characterization ◽  
Ex Situ ◽  
Electrical Measurements ◽  
Measured Resistance ◽  
Single Nanowires ◽  
Very High

ABSTRACTSiGe nanowires of different Ge atomic fractions up to 15% were grown and ex-situ n-type doped by diffusion from a solid source in contact with the sample. The phenomenon of dielectrophoresis was used to locate single nanowires between pairs of electrodes in order to carry out electrical measurements. The measured resistance of the as-grown nanowires is very high, but it decreases more than three orders of magnitude upon doping, indicating that the doping procedure used has been effective.

scholarly journals Very High Sustainable Forward Current Densities on 4H-SiC p-n Junctions Formed by VLS Localized Epitaxy of Heavily Al-Doped p++ Emitters

2017 ◽  
Vol 897 ◽  
pp. 63-66
Author(s):  
Selsabil Sejil ◽  
Loic Lalouat ◽  
Mihai Lazar ◽  
Davy Carole ◽  
Christian Brylinski ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Electrical Measurements ◽  
Pin Diodes ◽  
Low Leakage ◽  
Forward Current ◽  
Low Leakage Current ◽  
Current Densities ◽  
P Type ◽  
Electrical Characterizations ◽  
Very High

This study deals with the electrical characterization of PiN diodes fabricated on a 4°off-axis 4H-SiC n+ substrate with a n- epilayer (1×1016 cm-3 / 10 µm). Optimized p++ epitaxial areas were grown by Vapour-Liquid-Solid (VLS) transport to form p+ emitters localized in etched wells with 1 µm depth. Incorporated Al level in the VLS p++ zones was checked by SIMS (Secondary Ion Mass Spectroscopy), and the doping level was found in the range of 1-3×1020 at.cm-3. Electrical characterizations were performed on these PiN diodes, with 800 nm deposit of aluminium as ohmic contact on p-type SiC. Electrical measurements show a bipolar behaviour, and very high sustainable forward current densities ≥ 3 kA.cm-2, preserving a low leakage current density in reverse bias. These measurements were obtained on structures without any passivation and no edge termination.

Advanced Electrical Characterization of 90 nm Soft Bit Failure by Nano Probing Technique

2005 ◽  
Author(s):  
Christelle Giret ◽  
Damien Faure
Keyword(s):  
Failure Analysis ◽  
Electrical Characterization ◽  
Physical Analysis ◽  
Electrical Measurements ◽  
Device Failure ◽  
Sram Cell ◽  
Visual Defects ◽  
Difficult Challenge ◽  
Type Of Failure

Abstract The Soft Bit failure (Single Bit Failure sensitive to voltage) of a 90nm SRAM cell presented a difficult challenge for the Failure Analysis (FA) group. Physical analysis of these Soft SRAM failures did not show any visual defects; therefore the FA required an accurate electrical characterization. The transistor characteristics of the failing SRAM transistors are needed in order to speculate on the possible failure mechanism. The Nano-Probing technique performed at Nice Device Failure Analysis of Laboratory (NDAL) allowed us to identify anomalies of I/V characteristics like Vt imbalance, low Gain, asymmetrical Vt, ID (Drive current) and Ron. Case studies of an asymmetry phenomenon reported here lead to a correlation between the failure mode and the electrical measurements. This paper demonstrates a suitable electrical methodology and characterization by Nano-Probing in order to successfully manage a FA approach on this type of failure.

scholarly journals Epitaxial Growth of III-Nitride Layers on Aluminum Nitride Substrates

1999 ◽  
Vol 4 (S1) ◽  
pp. 411-416 ◽  
Author(s):  
L.J. Schowalter ◽  
Y. Shusterman ◽  
R. Wang ◽  
I. Bhat ◽  
G. Arunmozhi ◽  
...  
Keyword(s):  
Epitaxial Growth ◽  
Electrical Characterization ◽  
High Quality ◽  
Force Microscopy ◽  
Ion Channeling ◽  
Atomic Force ◽  
Image Position ◽  
Nitride Layers ◽  
Very High

High quality, epitaxial growth of AlN and AlxGa1−xN by OMVPE has been demonstrated on single-crystal AlN substrates. Here we report characterization of epitaxial layers on an a-face AlN substrate using Rutherford Backscattering/ion channeling, atomic force microscopy (AFM), x-ray rocking curves, and preliminary electrical characterization. Ion channeling along the [100] axis gives a channeling minimum yield of 1.5% indicating a very high quality epitaxial layer.

Epitaxial Growth of III-Nitride Layers on Aluminum Nitride Substrates

1998 ◽  
Vol 537 ◽  
Author(s):  
L.J. Schowalter ◽  
Y. Shusterman ◽  
R. Wang ◽  
I. Bhat ◽  
G. Arunmozhi ◽  
...  
Keyword(s):  
Epitaxial Growth ◽  
Electrical Characterization ◽  
High Quality ◽  
X Ray ◽  
Force Microscopy ◽  
Ion Channeling ◽  
Atomic Force ◽  
Nitride Layers ◽  
Very High

AbstractHigh quality, epitaxial growth of AlN and AlxGal-xN by OMVPE has been demonstrated on single-crystal AIN substrates. Here we report characterization of epitaxial layers on an a-face AlN substrate using Rutherford Backscattering/ion channeling, atomic force microscopy (AFM), x-ray rocking curves, and preliminary electrical characterization. Ion channeling along the [1010] axis gives a channeling minimum yield of 1.5% indicating a very high quality epitaxial layer.

scholarly journals A high electrical performance of DG-MOSFET transistors in 4H-SiC and 6H-SiC 130 nm technology by BSIM3v3 model

2019 ◽  
Vol 70 (2) ◽  
pp. 145-151
Author(s):  
Mourad Hebali ◽  
Menaouer Bennaoum ◽  
Mohammed Berka ◽  
Abdelkader Baghdad Bey ◽  
Mohammed Benzohra ◽  
...  
Keyword(s):  
Low Power ◽  
Low Voltage ◽  
Electrical Characterization ◽  
Electrical Performance ◽  
Subthreshold Slope ◽  
Ultra Low Power ◽  
Dg Mosfet ◽  
Subthreshold Operation ◽  
Very High

Abstract In this paper, the electrical performance of double gate DG-MOSFET transistors in 4H-SiC and 6H-SiC technologies have been studied by BSIM3v3 model. In which the I–V and gm–V characteristics and subthreshold operation of the DGMOSFET have been investigated for two models (series and parallel) based on equivalent electronic circuits and the results so obtained are compared with the single gate SG-MOSFET, using 130 nm technology and OrCAD PSpice software. The electrical characterization of DG-MOSFETs transistors have shown that they operate under a low voltage less than 1.2 V and low power for both models like the SG-MOSFET transistor, especially the series DG-MOSFET transistor is characterized by an ultra low power. The different transistors are characterized by an ultra low OFF leakage current of pA order, very high ON/OFF ratio of and high subthreshold slope of order 0.1 V/dec for the transistors in 6H-SiC and 4H-SiC respectively. These transistors also proved higher transconductance efficiency, especially the parallel DG-MOSFET transistor.

scholarly journals Structural, Optical, and Electrical Characterization of β-Ga2O3 Thin Films Grown by Plasma-Assisted Molecular Beam Epitaxy Suitable for UV Sensing

2018 ◽  
Vol 2018 ◽  
pp. 1-6 ◽  
Author(s):  
Abraham Arias ◽  
Nicola Nedev ◽  
Susmita Ghose ◽  
Juan Salvador Rojas-Ramirez ◽  
David Mateos ◽  
...  
Keyword(s):  
Thin Films ◽  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Uv Light ◽  
Electrical Characterization ◽  
High Energy ◽  
Ex Situ ◽  
Rf Plasma ◽  
Light Illumination ◽  
Electrical Measurements

β-Ga2O3 thin films were grown on c-plane sapphire substrates by plasma-assisted molecular beam epitaxy. The films were grown using an elemental gallium source and oxygen supplied by an RF plasma source. Reflection high-energy electron diffraction (RHEED) was used to monitor the surface quality in real time. Both in situ RHEED and ex situ X-ray diffraction confirmed the formation of single crystal β-phase films with excellent crystallinity on c-plane sapphire. Spectroscopic ellipsometry was used to determine the film thicknesses, giving values in the 11.6–18.8 nm range and the refractive index dispersion curves. UV-Vis transmittance measurements revealed that strong absorption of β-Ga2O3 starts at ∼270 nm. Top metal contacts were deposited by thermal evaporation for I-V characterization, which has been carried out in dark, as well as under visible and UV light illumination. The optical and electrical measurements showed that the grown thin films of β-Ga2O3 are excellent candidates for deep-ultraviolet detection and sensing.

Electrical Characterization of a Double Barrier Direct Tunneling Diode Structure

1999 ◽  
Vol 567 ◽  
Author(s):  
E. M. Dons ◽  
C. S. Skowronski ◽  
K. R. Farmer
Keyword(s):  
Nonvolatile Memory ◽  
Electrical Characterization ◽  
Diode Structure ◽  
Electrical Measurements ◽  
Si Substrates ◽  
Direct Tunneling ◽  
Tunneling Diode ◽  
Nonvolatile Memory Devices ◽  
Interface Potential

ABSTRACTWe report the electrical characterization of a direct tunneling diode structure that incorporates a multilayer dielectric. The dielectric consists of a stack of two thermally grown, ultrathin SiO2 layers, each ∼3.5 rin thick, separated by a deposited, continuous, undoped, ultrathin nanocrystalline Si layer ∼5.0 nm thick. Electrical measurements of this structure are reported for both n-type and p-type Si substrates. We find that the room temperature transport through this structure is accounted for by describing the intermediate Si layer as a quantum well with a continuum of states, and by otherwise assuming bulk properties for the ultrathin layers, such as the existence of a bandgap in the Si well and the usual Si-SiO2 interface potential barrier height at all interfaces. This structure is expected to be useful as the active dielectric in nonvolatile memory devices.

Electrical Characterization of MOS Structures with Silicon Nanocrystals Suitable for X-Ray Detection

2013 ◽  
Vol 543 ◽  
pp. 150-153
Author(s):  
David Mateos ◽  
Nicola Nedev ◽  
Diana Nesheva ◽  
Mario Curiel ◽  
Emil Manolov ◽  
...  
Keyword(s):  
Silicon Nanocrystals ◽  
Gate Dielectric ◽  
Defect Density ◽  
Electrical Characterization ◽  
Oxide Semiconductor ◽  
Electrical Measurements ◽  
Transmission Electron ◽  
Interface Defect ◽  
Mos Structures

Metal-Oxide-Semiconductor structures with silicon nanocrystals in the oxide layer are prepared and characterized by Transmission Electron Microscopy and electrical measurements. High temperature annealing of SiO1.15 films at 1000 °C for 30 or 60 min leads to formation of silicon nanocrystals with diameters of 2-3 or 4-6 nm. The processes used to obtain the multilayer gate dielectric and to grow nanocrystals do not deteriorate the properties of the cSi wafer/thermal SiO2 interface. For the interface defect density and the fixed oxide charge values 1010 cm-2 eV-1 and ~ 1010 cm-2 were obtained.

Electrical Characterization of Crystallized—Silicon Thin Films

1985 ◽  
Vol 53 ◽  
Author(s):  
N. M. Johnson
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electrical Characterization ◽  
Electrical Measurements ◽  
Silicon Thin Films ◽  
Thin Film Capacitors ◽  
Current Voltage ◽  
Transient Capacitance ◽  
Electronic Defects

ABSTRACTA review is presented on the application of electrical measurements to evaluate the existence and effects of residual electronic defects in crystallized—silicon thin films. Experimental techniques include current—voltage characterization, electronbeam—induced conductivity, transient—capacitance measurements on thin—film capacitors, transient—conductance spectroscopy on thin—film transistors, and photoconductivity.

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