Free standing GaN nano membrane by laser lift-off method

2012 ◽  
Vol 1432 ◽  
Author(s):  
Liang Tang ◽  
Yuefeng Wang ◽  
Gary Cheng ◽  
Michael J. Manfra ◽  
Timothy D. Sands

ABSTRACTIn this work, we present a method able to fabricate thin GaN nanomembranes fit for device applications. Starting from commercial GaN on sapphire substrates, MBE was used to deposit a sacrificial layer, which comprises of a superlattice of InN/InGaN, after which thin a GaN film of hundreds of nanometers thickness was grown on top. Pulsed laser irridiation with photon energy of 2.3eV gives rise to the controlled decomposition of the sacrificial intermediate layer, which can be followed by easy separation of the top GaN membrane from the substrate. This process can be used to manufacture GaN membranes with low defect density and a wider range of thickness. We demonstrated that large area, free-standing GaN membranes, with a thickness from 200nm and up, could be made using this method, and the high crystal quality of the lift-off GaN layers is well preserved in this process.

2007 ◽  
Vol 31 ◽  
pp. 17-19
Author(s):  
Zong You Yin ◽  
Xiao Hong Tang ◽  
Ji Xuan Zhang ◽  
Deny Sentosa ◽  
Jing Hua Teng ◽  
...  

Morphology and crystal-quality of InAs/In0.53Ga0.47As/InP quantum dots (QDs) grown by metal-organic vapor phase epitaxy (MOVPE) in N2 ambient using different growth modes have been studied. It is found that the morphology and crystal-quality of InAs QDs are dependant on the growth modes. After optimizing the dots’ growth modes, dots’ size dispersion and crystal-quality are both improved greatly, resulting in the enhancement factor of ∼ 2.9 in the photoluminescence (PL) peak-intensity from single QD. When the dots are buried, the dot size decrease compared with the free-standing dots due to the soon capping layer deposition during dots’ being buried. The thermal activation energy measured is comparable to the valence-band offset in the QD system calculated by 8 kp theory model. This indicates the PL quenching induced by the interface defects is suppressed due to the defect density lowering in the QDs grown by such optimized growth mode.


1995 ◽  
Vol 377 ◽  
Author(s):  
S. Sherman ◽  
P-Y. Lu ◽  
R. A. Gottscho ◽  
S. Wagner

ABSTRACTWe evaluated the characteristics of a-Si:H/a-SiNx:H thin film transistors (TFTs), and of separately deposited a-Si:H films, as functions of the a-Si:H deposition power in a high-rate, large-area, 40 MHz PE-CVD system. TFT performance and a-Si:H film properties improve with decreasing power density and deposition rate. However, low defect density a-Si:H material was deposited at rates as high as 1500 Å/min. TFTs with gate nitride deposited at 1000 A/min show excellent I-V characteristics when the a-Si:H deposition power is low enough. The TFT electron mobility in the linear regime correlates well with the Urbach energy of the a-Si:H films, suggesting that the quality of the a-Si: H controls the performance of our TFTs.


2008 ◽  
Vol 53-54 ◽  
pp. 111-118
Author(s):  
Ze Wei Yuan ◽  
Zhu Ji Jin ◽  
B.X. Dong ◽  
Ren Ke Kang

Although various diamond polishing techniques have been studied for many years, no individual method can polish free-standing CVD diamond film with high efficiency and high polishing quality. This paper investigates polishing CVD diamond film by the combination of electro-discharge machining (EDM) and chemical mechanical polishing (CMP). Scanning electro microscopy, Optical microscopy, Energy dispersive X-ray analysis, Talysurf surface profiler and Raman spectroscopy were used to evaluate the surface integrity and quality of diamond film before and after polishing. Based on the experimental results, the material removal during EDM process can be a chemo-mechanical process, including gasification, melting, sputtering, oxidation and graphitization. While in CMP process, diamond was removed under the mechanical and tribochemical interaction. The combination of EDM and CMP has advantages of high efficiency, high polishing quality and low damage. It is suitable to polish large area free-standing CVD diamond film.


1999 ◽  
Vol 557 ◽  
Author(s):  
M. Boucinha ◽  
V. Chu ◽  
V. Soares ◽  
J. P. Condee

AbstractSurface micromachining is used with amorphous silicon, microcrystalline silicon, silicon nitride and aluminum films as structural materials to form bridge and cantilever structures. Low temperature processing (between 110 and 250 °C) allowed fabrication of structures and devices on glass substrates. Two processes involving different materials as the sacrificial layer are presented: silicon nitride and photoresist. The mechanical integrity of the fabricated structures is discussed. As examples of possible device applications of this technology, air-gap thin film transistors and the electrostatic actuation of bridges and cantilevers are presented.


2011 ◽  
Vol 325 (1) ◽  
pp. 85-88 ◽  
Author(s):  
Youngji Cho ◽  
Sungkuk Choi ◽  
Gyung-Suk Kil ◽  
Hyun-Jae Lee ◽  
Takafumi Yao ◽  
...  

2000 ◽  
Vol 77 (12) ◽  
pp. 1819 ◽  
Author(s):  
E. A. Stach ◽  
M. Kelsch ◽  
E. C. Nelson ◽  
W. S. Wong ◽  
T. Sands ◽  
...  

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