Depth sensing indentation of nanoscale graphene platelets in nanocomposite thin films

2011 ◽  
Vol 1312 ◽  
Author(s):  
Ardavan Zandiatashbar ◽  
Catalin R. Picu ◽  
Nikhil Koratkar
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Characteristic Length ◽  
Matrix Interface ◽  
Depth Sensing ◽  
Epoxy Nanocomposites ◽  
Dramatic Decrease ◽  
Graphene Platelet ◽  
Nanocomposite Thin Films

ABSTRACTSignificant improvement of mechanical properties was observed recently in graphene platelet-epoxy nanocomposites relative to unfilled epoxy, such as an increase of the fracture toughness by 50% and dramatic decrease of fatigue crack growth rate. In this work, thin films of 0.1 wt.% of graphene platelet (GPL) – epoxy nanocomposites were fabricated and the nanoscale mechanical properties of the nanocomposite were investigated by nanoindentation. This provides information about the presence of characteristic length scales induced by the microstructure and the strength of the filler-matrix interface.

scholarly journals Analyzing Time on Sample During Nanoindentation

2016 ◽  
Vol 13 (2) ◽  
pp. 74-79 ◽  
Author(s):  
A. S. Bhattacharyya ◽  
P Kumar ◽  
N Rajak ◽  
R.P Kumar ◽  
A Sharma ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Significant Contribution ◽  
Substrate Effect ◽  
Failure Zone ◽  
Indentation Fracture ◽  
Depth Sensing ◽  
Indentation Fracture Toughness ◽  
Depth Curves

Nanoindentation is an effective way of finding mechanical properties at nanoscale. They are especially useful for thin films where elimination of the substrate effect is required. The mechanism is based upon depth sensing indentation based on Oliver and Pharr modeling. The load-depth curves as well as time on sample were analyzed. Indentation impulse was found to have significant contribution in the nature of failure zone during indentation. Fracture toughness was also related to time on the sample.

DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

e-Polymers ◽  
2006 ◽  
Vol 6 (1) ◽  
Author(s):  
Newton Luiz Dias Filho ◽  
Hermes Adolfo de Aquino
Keyword(s):  
Mechanical Properties ◽  
Activation Energy ◽  
Fracture Toughness ◽  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Loss Factor ◽  
Tensile Modulus ◽  
Dielectric Analysis ◽  
Epoxy Nanocomposites ◽  
Scanning Calorimetry

AbstractNon-isothermal dielectric analysis (DEA) and differential scanning calorimetry (DSC) techniques were used to study the epoxy nanocomposites prepared by reacting 1,3,5,7,9,11,13,15-octa[dimethylsiloxypropylglycidylether] pentaciclo [9.5.1.13,9.15,15 .17,13] octasilsesquioxane (ODPG) with methylenedianiline (MDA). Loss factor (ε”) and activation energy were calculated by DEA. The relationships between the loss factor, the activation energy, the structure of the network, and the mechanical properties were investigated. Activation energies determined by DEA and DSC, heat of polymerization, fracture toughness and tensile modulus show the same profile for mechanical properties with respect to ODPG content.

scholarly journals Effects of Boron and Nitrogen Contents on the Microstructures and Mechanical Properties of Cr-B-N Nanocomposite Thin Films

2012 ◽  
Vol 36 ◽  
pp. 360-367 ◽  
Author(s):  
Jyh-Wei Lee ◽  
Chih-Hong Cheng ◽  
Hsien-Wei Chen ◽  
Yu-Chen Chan ◽  
Jenq-Gong Duh ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Nanocomposite Thin Films ◽  
Microstructures And Mechanical Properties ◽  
Nitrogen Contents

scholarly journals Reactive biased target ion beam deposited W–DLC nanocomposite thin films — Microstructure and its mechanical properties

2012 ◽  
Vol 23 ◽  
pp. 34-43 ◽  
Author(s):  
P. Vijai Bharathy ◽  
Q. Yang ◽  
M.S.R.N. Kiran ◽  
JongJoo Rha ◽  
D. Nataraj ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Ion Beam ◽  
Nanocomposite Thin Films

The Analysis of Depth-Sensing Indentation Data: Review of the Special Discussion Session

1993 ◽  
Vol 308 ◽  
Author(s):  
Shefford P. Baker ◽  
T.P. Weihs
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
State Of The Art ◽  
The State ◽  
Discussion Session ◽  
Depth Sensing ◽  
Recent Advances

In light of recent advances in the analysis of depth-sensing indentation data and of the importance of this technique in the study of the mechanical properties of thin films, a special discussion session was held in order to explore the state of the art and to provide an informal forum for discussion. This is a brief review of that discussion. The discussion was focused by the four main sources of deviation from model behavior described in the previous paper.

scholarly journals Multiscale Characterization of Nanoengineered Fiber-Reinforced Composites: Effect of Carbon Nanotubes on the Out-of-Plane Mechanical Behavior

2017 ◽  
Vol 2017 ◽  
pp. 1-9 ◽  
Author(s):  
Carlos Medina ◽  
Eduardo Fernandez ◽  
Alexis Salas ◽  
Fernando Naya ◽  
Jon Molina-Aldereguía ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Carbon Nanotubes ◽  
Fracture Toughness ◽  
Shear Strength ◽  
Mechanical Behavior ◽  
Matrix Interface ◽  
Short Beam ◽  
The Matrix ◽  
Fiber Matrix Interface ◽  
Fiber Matrix

The mechanical properties of the matrix and the fiber/matrix interface have a relevant influence over the mechanical properties of a composite. In this work, a glass fiber-reinforced composite is manufactured using a carbon nanotubes (CNTs) doped epoxy matrix. The influence of the CNTs on the material mechanical behavior is evaluated on the resin, on the fiber/matrix interface, and on the composite. On resin, the incorporation of CNTs increased the hardness by 6% and decreased the fracture toughness by 17%. On the fiber/matrix interface, the interfacial shear strength (IFSS) increased by 22% for the nanoengineered composite (nFRC). The influence of the CNTs on the composite behavior was evaluated by through-thickness compression, short beam flexural, and intraply fracture tests. The compressive strength increased by 6% for the nFRC, attributed to the rise of the matrix hardness and the fiber/matrix IFSS. In contrast, the interlaminar shear strength (ILSS) obtained from the short beam tests was reduced by 8% for the nFRC; this is attributed to the detriment of the matrix fracture toughness. The intraply fracture test showed no significant influence of the CNTs on the fracture energy; however, the failure mode changed from brittle to ductile in the presence of the CNTs.

Mechanical properties of interference thin films on colored stainless steel evaluated by depth-sensing nanoindentation

2006 ◽  
Vol 201 (6) ◽  
pp. 2431-2437 ◽  
Author(s):  
Rosa M.R. Junqueira ◽  
Margareth S. Andrade ◽  
Célia R.O. Loureiro ◽  
Vicente T.L. Buono
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Stainless Steel ◽  
Depth Sensing

scholarly journals Material Structure and Mechanical Properties of Silicon Nitride and Silicon Oxynitride Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition

Surfaces ◽  
2018 ◽  
Vol 1 (1) ◽  
pp. 59-72 ◽  
Author(s):  
Zhenghao Gan ◽  
Changzheng Wang ◽  
Zhong Chen
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Silicon Nitride ◽  
Flow Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Oxynitride ◽  
Flow Rates ◽  
Silicon Nitride Films

Silicon nitride and silicon oxynitride thin films are widely used in microelectronic fabrication and microelectromechanical systems (MEMS). Their mechanical properties are important for MEMS structures; however, these properties are rarely reported, particularly the fracture toughness of these films. In this study, silicon nitride and silicon oxynitride thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) under different silane flow rates. The silicon nitride films consisted of mixed amorphous and crystalline Si3N4 phases under the range of silane flow rates investigated in the current study, while the crystallinity increased with silane flow rate in the silicon oxynitride films. The Young’s modulus and hardness of silicon nitride films decreased with increasing silane flow rate. However, for silicon oxynitride films, Young’s modulus decreased slightly with increasing silane flow rate, and the hardness increased considerably due to the formation of a crystalline silicon nitride phase at the high flow rate. Overall, the hardness, Young modulus, and fracture toughness of the silicon nitride films were greater than the ones of silicon oxynitride films, and the main reason lies with the phase composition: the SiNx films were composed of a crystalline Si3N4 phase, while the SiOxNy films were dominated by amorphous Si–O phases. Based on the overall mechanical properties, PECVD silicon nitride films are preferred for structural applications in MEMS devices.

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