Recombination dynamics in planar and three-dimensional InGaN/GaN light emitting diode structures

2017 ◽  
Vol 32 (13) ◽  
pp. 2456-2463 ◽  
Author(s):  
Angelina Vogt ◽  
Jana Hartmann ◽  
Hao Zhou ◽  
Matin Sadat Mohajerani ◽  
Sönke Fündling ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Light Emitting ◽  
Image Position ◽  
Recombination Dynamics

Abstract

scholarly journals Comparative Study of Four TiO2-Based Photocatalysts to Degrade 2,4-D in a Semi-Passive System

Water ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 621 ◽  
Author(s):  
Gisoo Heydari ◽  
Jordan Hollman ◽  
Gopal Achari ◽  
Cooper Langford
Keyword(s):  
Energy Consumption ◽  
Degradation Rate ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Dichlorophenoxyacetic Acid ◽  
Light Emitting ◽  
Glass Spheres ◽  
Degradation Rate Constant ◽  
2,4 Dichlorophenoxyacetic Acid ◽  
Mode Energy

In this study, the relative efficiency of four forms of supported titanium dioxide (TiO2) as a photocatalyst to degrade 2,4-dichlorophenoxyacetic acid (2,4-D) in Killex®, a commercially available herbicide was studied. Coated glass spheres, anodized plate, anodized mesh, and electro-photocatalysis using the anodized mesh were evaluated under an ultraviolet – light-emitting diode (UV-LED) light source at λ = 365 nm in a semi-passive mode. Energy consumption of the system was used to compare the efficiency of the photocatalysts. The results showed both photospheres and mesh consumed approximately 80 J/cm3 energy followed by electro-photocatalysis (112.2 J/cm3), and the anodized plate (114.5 J/cm3). Although electro-photocatalysis showed the fastest degradation rate (K = 5.04 mg L−1 h−1), its energy consumption was at the same level as the anodized plate with a lower degradation rate constant of 3.07 mg L−1 h−1. The results demonstrated that three-dimensional nanotubes of TiO2 surrounding the mesh provide superior degradation compared to one-dimensional arrays on the planar surface of the anodized plate. With limited broad-scale comparative studies between varieties of different TiO2 supports, this study provides a comparative analysis of relative degradation efficiencies between the four photocatalytic configurations.

Nanorod Array Structure Through a Nanomolding Process for Semiconductor Lighting and Display Applications

NANO ◽  
2019 ◽  
Vol 14 (12) ◽  
pp. 1950153 ◽  
Author(s):  
Je Won Kim
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Nanorod Array ◽  
Dimensional Structure ◽  
Single Chip ◽  
Semiconductor Processing ◽  
Light Emitting ◽  
Multiple Wavelengths ◽  
Array Structure ◽  
Wavelength Control

Three-dimensional structure and growth can be more appropriately realized through a nanomanufacturing process that uses a mask patterning and etching process. Unlike conventional single-wavelength semiconductor lighting sources, the uniformity and reproducibility of the nanomolding process in this study enable multiple wavelengths to be used in lighting and display applications. This study shows the various wavelength characteristics through a newly developed nanomold and its nanorod array and also proves the feasibility of a white light without phosphors for emitting multiple wavelengths from a single chip. In this study, we proposed the possibility of wavelength control by fabricating a light-emitting diode with a three-dimensional nanostructure, using a nanomold with semiconductor processing.

Color three-dimensional display with omnidirectional view based on a light-emitting diode projector

2009 ◽  
Vol 48 (22) ◽  
pp. 4490 ◽  
Author(s):  
Caijie Yan ◽  
Xu Liu ◽  
Haifeng Li ◽  
Xinxing Xia ◽  
Haixia Lu ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Three Dimensional ◽  
Light Emitting ◽  
Three Dimensional Display

Recombination dynamics of carriers in an InGaN/AlGaN single-quantum-well light-emitting diode under reverse-bias voltages

2000 ◽  
Vol 76 (12) ◽  
pp. 1546-1548 ◽  
Author(s):  
Hiromitsu Kudo ◽  
Hiroki Ishibashi ◽  
Ruisheng Zheng ◽  
Yoichi Yamada ◽  
Tsunemasa Taguchi
Keyword(s):  
Quantum Well ◽  
Reverse Bias ◽  
Light Emitting Diode ◽  
Single Quantum ◽  
Single Quantum Well ◽  
Light Emitting ◽  
Recombination Dynamics

Reflector designed for light-emitting-diode lighting source in three-dimensional space

Optik ◽  
2015 ◽  
Vol 126 (23) ◽  
pp. 4534-4538 ◽  
Author(s):  
Guangzhen Wang ◽  
Yu Hou ◽  
Lichun Hu ◽  
Wanwei Tang ◽  
Jian Gao ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Dimensional Space ◽  
Three Dimensional ◽  
Light Emitting ◽  
Three Dimensional Space

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

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