In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient

2016 ◽  
Vol 31 (5) ◽  
pp. 609-617 ◽  
Author(s):  
Yi Zhong ◽  
Mingliang Huang ◽  
Haitao Ma ◽  
Wei Dong ◽  
Yunpeng Wang ◽  
...  
Keyword(s):  
Temperature Gradient ◽  
Solder Joints ◽  
In Situ Study ◽  
Image Position

Abstract

In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient

2016 ◽  
Vol 682 ◽  
pp. 1-6 ◽  
Author(s):  
N. Zhao ◽  
Y. Zhong ◽  
M.L. Huang ◽  
W. Dong ◽  
H.T. Ma ◽  
...  
Keyword(s):  
Temperature Gradient ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
In Situ Study

Unusual irradiation-induced disordering in Cu3Au near the critical temperature: An in situ study using electron diffraction

2018 ◽  
Vol 33 (22) ◽  
pp. 3841-3848
Author(s):  
Calvin Robert Lear ◽  
Robert S. Averback ◽  
Pascal Bellon ◽  
Andrea E. Sand ◽  
Marquis A. Kirk
Keyword(s):  
Critical Temperature ◽  
Electron Diffraction ◽  
In Situ Study ◽  
Image Position

Abstract

In-situ study of microscale fracture of diffusion aluminide bond coats: Effect of platinum

2015 ◽  
Vol 30 (21) ◽  
pp. 3343-3353 ◽  
Author(s):  
Balila Nagamani Jaya ◽  
Sanjit Bhowmick ◽  
S.A. Syed Asif ◽  
Vikram Jayaram
Keyword(s):  
Bond Coats ◽  
In Situ Study ◽  
Image Position

Abstract

scholarly journals In-situ Study of Electromigration-induced Grain Rotation in Pb-free Solder Joint by Synchrotron Microdiffraction

2008 ◽  
Vol 1116 ◽  
Author(s):  
Kai Chen ◽  
Nobumichi Tamura ◽  
King-Ning Tu
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Solder Joints ◽  
Electric Resistance ◽  
Grain Rotation ◽  
X Ray ◽  
In Situ Study ◽  
Free Solder ◽  
Interconnect Lines

AbstractThe rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

In situ study of thermally activated flow and dynamic restoration of ultrafine-grained pure Cu at 373 K

2017 ◽  
Vol 32 (24) ◽  
pp. 4514-4521
Author(s):  
Wolfgang Blum ◽  
Petr Král ◽  
Jiri Dvořák ◽  
Martin Petrenec ◽  
Philip Eisenlohr ◽  
...  
Keyword(s):  
Thermally Activated ◽  
In Situ Study ◽  
Ultrafine Grained ◽  
Image Position ◽  
Pure Cu

Abstract

scholarly journals An in situ study on Kr ion–irradiated crystalline Cu/amorphous-CuNb nanolaminates

2019 ◽  
Vol 34 (13) ◽  
pp. 2218-2228 ◽  
Author(s):  
Zhe Fan ◽  
Cuncai Fan ◽  
Jin Li ◽  
Zhongxia Shang ◽  
Sichuang Xue ◽  
...  
Keyword(s):  
In Situ Study ◽  
Image Position

Abstract

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