Development of high-k hafnium–aluminum oxide dielectric films using sol–gel process

2014 ◽  
Vol 29 (15) ◽  
pp. 1620-1625 ◽  
Author(s):  
Leyong Zhu ◽  
Yana Gao ◽  
Xifeng Li ◽  
X.W. Sun ◽  
Jianhua Zhang

Abstract

2018 ◽  
Vol 44 (8) ◽  
pp. 9125-9131 ◽  
Author(s):  
Wenwen Xia ◽  
Guodong Xia ◽  
Guangsheng Tu ◽  
Xin Dong ◽  
Sumei Wang ◽  
...  

2014 ◽  
Vol 71 (3) ◽  
pp. 458-463 ◽  
Author(s):  
Juan Peng ◽  
Chenhang Sheng ◽  
Jifeng Shi ◽  
Xifeng Li ◽  
Jianhua Zhang

2009 ◽  
Vol 469 (1-2) ◽  
pp. 332-335 ◽  
Author(s):  
Xiaofei Qu ◽  
Jinhui Dai ◽  
Jintao Tian ◽  
Xiang Huang ◽  
Zhongfang Liu ◽  
...  

2007 ◽  
Vol 353 (5-7) ◽  
pp. 692-696 ◽  
Author(s):  
A.R. Phani ◽  
D. Di Claudio ◽  
M. Passacantando ◽  
S. Santucci

2012 ◽  
Vol 38 (2) ◽  
pp. 1677-1682 ◽  
Author(s):  
Chien-Yie Tsay ◽  
Chia-Hsiang Cheng ◽  
Yu-Wu Wang

2013 ◽  
Vol 2 (10) ◽  
pp. N35-N38 ◽  
Author(s):  
H. Pu ◽  
H. Li ◽  
Z. Yang ◽  
Q. Zhou ◽  
C. Dong ◽  
...  

2018 ◽  
Vol 33 (22) ◽  
pp. 3793-3800 ◽  
Author(s):  
Yangyang Jiang ◽  
Lingjun Zhu ◽  
Shu Cai ◽  
Sibo Shen ◽  
Yue Li ◽  
...  

Abstract


Author(s):  
V. Kaushik ◽  
P. Maniar ◽  
J. Olowolafe ◽  
R. Jones ◽  
A. Campbell ◽  
...  

Lead zirconium titanate films (Pb (Zr,Ti) O3 or PZT) are being considered for potential application as dielectric films in memory technology due to their high dielectric constants. PZT is a ferroelectric material which shows spontaneous polarizability, reversible under applied electric fields. We report herein some results of TEM studies on thin film capacitor structures containing PZT films with platinum-titanium electrodes.The wafers had a stacked structure consisting of PZT/Pt/Ti/SiO2/Si substrate as shown in Figure 1. Platinum acts as electrode material and titanium is used to overcome the problem of platinum adhesion to the oxide layer. The PZT (0/20/80) films were deposited using a sol-gel method and the structure was annealed at 650°C and 800°C for 30 min in an oxygen ambient. XTEM imaging was done at 200KV with the electron beam parallel to <110> zone axis of silicon.Figure 2 shows the PZT and Pt layers only, since the structure had a tendency to peel off at the Ti-Pt interface during TEM sample preparation.


Author(s):  
J.M. Schwartz ◽  
L.F. Francis ◽  
L.D. Schmidt ◽  
P.S. Schabes-Retchkiman

Ceramic thin films and coatings are of interest for electrical, optical, magnetic and thermal barrier applications. Critical for improved properties in thin films is the development of specific microstructures during processing. To this end, the sol-gel method is advantageous as a versatile processing route. The sol-gel process involves depositing a solution containing metalorganic or colloidal ceramic precursors onto a substrate and heating the deposited layer to form a crystalline or non-crystalline ceramic coating. This route has several advantages, including the ability to create tailored microstructures and properties, to coat large or small areas, simple or complex shapes, and to more easily prepare multicomponent ceramics. Sol-gel derived coatings are amorphous in the as-deposited state and develop their crystalline structure and microstructure during heat-treatment. We are particularly interested in studying the amorphous to crystalline transformation, because many key features of the microstructure such as grain size and grain size distribution may be linked to this transformation.


Sign in / Sign up

Export Citation Format

Share Document