scholarly journals Characterizing mechanical behavior of atomically thin films: A review

2014 ◽  
Vol 29 (3) ◽  
pp. 338-347 ◽  
Author(s):  
Changhong Cao ◽  
Yu Sun ◽  
Tobin Filleter
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Image Position

Abstract

scholarly journals Relationship between structure, surface topography and tribo-mechanical behavior of Ti-N thin films elaborated at different N2 flow rates

2021 ◽  
Vol 724 ◽  
pp. 138598
Author(s):  
Linda AISSANI ◽  
Akram ALHUSSEIN ◽  
Abdelhak AYAD ◽  
Corinne NOUVEAU ◽  
Elia ZGHEIB ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Surface Topography ◽  
Flow Rates ◽  
Structure Surface

The phase transformation and mechanical behavior of NiTi thin films

2004 ◽  
Author(s):  
Zhenyu Yuan ◽  
Xiulan Cheng ◽  
Dong Xu ◽  
Zhican Ye ◽  
YaFei Zhang ◽  
...  
Keyword(s):  
Thin Films ◽  
Phase Transformation ◽  
Mechanical Behavior

Synthesis and characterization of Ni incorporated titanium dioxide thin films

2018 ◽  
Vol 33 (24) ◽  
pp. 4165-4172 ◽  
Author(s):  
Deepak Kumar ◽  
Prasanta Mandal ◽  
Anil Singh ◽  
Charu Pant ◽  
Sudesh Sharma
Keyword(s):  
Thin Films ◽  
Titanium Dioxide ◽  
Synthesis And Characterization ◽  
Titanium Dioxide Thin Films ◽  
Image Position

Abstract

Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches

2007 ◽  
Author(s):  
T. Bannuru ◽  
S. Narksitipan ◽  
W. L. Brown ◽  
R. P. Vinci
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Au Thin Films

Microstructure and dielectric properties with CuO additions to liquid phase sintered BaTiO3 thin films

2016 ◽  
Vol 31 (8) ◽  
pp. 1018-1026 ◽  
Author(s):  
David T. Harris ◽  
Matthew J. Burch ◽  
Edward J. Mily ◽  
Elizabeth C. Dickey ◽  
Jon-Paul Maria
Keyword(s):  
Thin Films ◽  
Dielectric Properties ◽  
Liquid Phase ◽  
Image Position

Abstract

Monolithic magneto-optical oxide thin films for on-chip optical isolation

MRS Bulletin ◽  
2018 ◽  
Vol 43 (6) ◽  
pp. 413-418 ◽  
Author(s):  
Qingyang Du ◽  
Takian Fakhrul ◽  
Yan Zhang ◽  
Juejun Hu ◽  
Caroline A. Ross
Keyword(s):  
Thin Films ◽  
Oxide Thin Films ◽  
Optical Isolation ◽  
On Chip ◽  
Image Position

Abstract

A Technique for Determining the Mechanical Behavior and Electrical Performance of Thin Films

1999 ◽  
Author(s):  
Li Li ◽  
Biao Huang ◽  
Q. Qiao ◽  
M. H. Gordon ◽  
W. F. Schmidt ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Film Theory ◽  
Nonlinear Finite Element ◽  
Electrical Performance ◽  
Finite Element Models ◽  
Numerical Predictions ◽  
Acceptable Range ◽  
Solder Balls ◽  
Measured Resistance

Abstract We describe a technique to determine the mechanical behavior and electrical performance of thin films. Thin films (2 μm) are deflected with a probe, and the displacement of the thin films and total electrical resistance are recorded. Nonlinear finite element models (ANSYS) are used to predict the corresponding force and stress. Three microstructures are built and tested: cantilever (80 μm long and 100 μm wide), bridge (290 μm long and 50 μm wide), and cross (320 μm long and 30 μm wide). No failures are observed at 15 μm deflection for all three structures, and a yield strength at least 1.34 GPa (4–20 times larger than the reported bulk value, but consistent with thin film theory) is inferred. The measured total resistance for every device ranges from open to 0.2 Ω. A direct correlation between the measured resistance and numerically predicted force (or contact pressure since the same probe tip is used in all tests) is noted, validating the numerical predictions. The bridge and cross designs appear feasible as a burn-in test socket, and we predict a mating force of 80–350 N for a 25 mm square chip with 10,000 solder balls on 250 μm spacing. This force will depend on the acceptable range of resistances as measured by our system.

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