The microstructural evolution and thermal stability of nanocrystalline ball-milled Ni–15 at.% W powder

2013 ◽  
Vol 28 (6) ◽  
pp. 873-886 ◽  
Author(s):  
Gayatri K. Rane ◽  
Daniel Apel ◽  
Udo Welzel ◽  
Eric Jan Mittemeijer
Keyword(s):  
Thermal Stability ◽  
Microstructural Evolution ◽  
Image Position ◽  
Thermal Stability Of

Abstract

Influence of processing route on the alloying behavior, microstructural evolution and thermal stability of CrMoNbTiW refractory high-entropy alloy

2020 ◽  
Vol 35 (12) ◽  
pp. 1556-1571
Author(s):  
Lavanya Raman ◽  
G. Karthick ◽  
K. Guruvidyathri ◽  
Daniel Fabijanic ◽  
S. V. S. Narayana Murty ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Microstructural Evolution ◽  
Processing Route ◽  
High Entropy Alloy ◽  
High Entropy ◽  
Image Position ◽  
Thermal Stability Of

Abstract

Synthesis of Fe-rich Fe–Al nanocrystalline solid solutions using ball milling

1999 ◽  
Vol 14 (5) ◽  
pp. 1760-1770 ◽  
Author(s):  
H. G. Jiang ◽  
H. M. Hu ◽  
E. J. Lavernia
Keyword(s):  
Heat Treatment ◽  
Activation Energy ◽  
Thermal Stability ◽  
Intermetallic Compound ◽  
Ball Milling ◽  
Microstructural Evolution ◽  
Solid Solutions ◽  
Al Alloys ◽  
Time Intervals ◽  
Thermal Stability Of

The synthesis of nanocrystalline Fe, Fe–4 wt% Al, and Fe–10 wt% Al solid solutions by SPEX ball milling has been studied. The microstructural evolution during ball milling, as well as subsequent heat treatment, has been characterized. The results demonstrate that ball milling promotes the formation of αFe–4 wt% Al and αFe–10 wt% Al solid solutions by reducing the activation energy of these alloys and generating thermal energy during this process. For Fe–10 wt% Al powders milled for various time intervals up to approximately 20 min, the FeAl intermetallic compound is formed. For alloys annealed at temperatures ranging from 600 to 1000 °C, the addition of 10 wt% Al to Fe significantly enhances the thermal stability of the nanocrystalline Fe–Al alloys. Interestingly, the addition of Al within the range of 4–10 wt% seems to have little effect on the thermal stability of these alloys annealed under the same conditions. Also, the thermal stability improves for alloys milled in air as opposed to those processed using Ar.

Thermal stability of the nanostructure of mechanically milled Cu–5 vol% Al2O3 nanocomposite powder particles

2014 ◽  
Vol 29 (8) ◽  
pp. 996-1005 ◽  
Author(s):  
Dengshan Zhou ◽  
Deliang Zhang ◽  
Charlie Kong ◽  
Paul Munroe ◽  
Rob Torrens
Keyword(s):  
Thermal Stability ◽  
Nanocomposite Powder ◽  
Powder Particles ◽  
Image Position ◽  
Thermal Stability Of

Abstract

Effect of the Crystallographic Orientation of Underlying Poly-Si on the Thermal Stability of the TiSi2 Film

1992 ◽  
Vol 280 ◽  
Author(s):  
Y. W. Kim ◽  
I. K. Kim ◽  
N. I. Lee ◽  
J. W. Ko ◽  
S. T. Ahn ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Solid State ◽  
Surface Energy ◽  
Microstructural Evolution ◽  
Solid State Reaction ◽  
Crystallographic Orientation ◽  
Amorphous Si ◽  
Si Films ◽  
Thermal Stability Of

ABSTRACTThe effect of the crystallographic orientation of underlying poly-Si film on the thermal stability of the TiSi2 film was studied. Different preferred orientations of the poly-Si film were obtained by annealing poly-Si or amorphous Si films at various temperatures. The TiSi2 film was formed by the solid-state reaction of the Ti film sputtered on the poly-Si film. The thermal stability of the TiSi2 film was evaluated by changes in the sheet resistance and microstructural evolution during furnace anneals. The TiSi2 film on poly-Si with the <110> preferred orientation shows more stable conductivity during high temperature anneals than with the <111> orientation. The surface energy of underlying poly-Si is expected to influence the thermal stability of the TiSi2/poly-Si structure significantly. Better thermal stability of the TiSi2 film can be obtained by the higher surface energy of underlying poly-Si.

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