scholarly journals Erratum: “Deformation and failure of a film/substrate system subjected to spherical indentation: Part II. Prediction of failure modes in a thin TiN film deposited on a compliant elastic substrate” [J. Mater. Res. 21, 783 (2006)]

2008 ◽  
Vol 23 (4) ◽  
pp. 1185-1185
Author(s):  
S. Math ◽  
V. Jayaram ◽  
S.K. Biswas
Keyword(s):  
Failure Modes ◽  
Spherical Indentation ◽  
Elastic Substrate ◽  
Deformation And Failure ◽  
Tin Film ◽  
Film Substrate

Deformation and failure of a film/substrate system subjected to spherical indentation: Part II. Prediction of failure modes in a thin TiN film deposited on a compliant elastic substrate

2006 ◽  
Vol 21 (3) ◽  
pp. 783-790 ◽  
Author(s):  
S. Math ◽  
V. Jayaram ◽  
S.K. Biswas
Keyword(s):  
Film Thickness ◽  
Failure Modes ◽  
Normal Load ◽  
Real Life ◽  
Plastic Substrate ◽  
Spherical Indentation ◽  
Elastic Substrate ◽  
Transform Method ◽  
Deformation And Failure ◽  
Elastic Film

We have demonstrated previously, using nanoindentation, that the film thickness and substrate plasticity, the important two external variables in the film layer, control the failure of the film in a mutually exclusive way. In this work, we used a non-iterative Hankel transform method to analyze the stresses in an elastic film bound to an elastic substrate by a no-slip boundary condition and subjected to a Hertzian traction. We vary the substrate compliance by two orders of magnitude to generate interfacial mismatch stresses, which mimic the corresponding changes found in a real-life elastic film on an elastic-plastic substrate when the hardness of the substrate is changed. The analysis is found to reproduce faithfully the experimental trends, which showed that normal load and interfacial stresses generated by strain mismatch drive different modes of fracture depending on the film thickness in a mutually exclusive way. This validation paves the way for this theoretical technique to be used to design multilayered film structures.

Deformation and failure of a film/substrate system subjected to spherical indentation: Part I. Experimental validation of stresses and strains derived using Hankel transform technique in an elastic film/substrate system

2006 ◽  
Vol 21 (3) ◽  
pp. 774-782 ◽  
Author(s):  
Souvik Math ◽  
V. Jayaram ◽  
S.K. Biswas
Keyword(s):  
Failure Modes ◽  
Analytical Framework ◽  
Hankel Transform ◽  
Spherical Indentation ◽  
Stress Distributions ◽  
Deformation And Failure ◽  
Metallic Substrates ◽  
Bulk Film ◽  
Ceramic Films ◽  
Film Substrate

Our concern here is to rationalize experimental observations of failure modes brought about by indentation of hard thin ceramic films deposited on metallic substrates. By undertaking this exercise, we would like to evolve an analytical framework that can be used for designs of coatings. In Part I of the paper we develop an algorithm and test it for a model system. Using this analytical framework we address the issue of failure of columnar TiN films in Part II [J. Mater. Res.21, 783 (2006)] of the paper. In this part, we used a previously derived Hankel transform procedure to derive stress and strain in a birefringent polymer film glued to a strong substrate and subjected to spherical indentation. We measure surface radial strains using strain gauges and bulk film stresses using photo elastic technique (stress freezing). For a boundary condition based on Hertzian traction with no film interface constraint and assuming the substrate constraint to be a function of the imposed strain, the theory describes the stress distributions well. The variation in peak stresses also demonstrates the usefulness of depositing even a soft film to protect an underlying substrate.

Numerical Analysis on the Wrinkling Instability of a Stiff Film Adhering to an Elastic Substrate with a Graded Coating

2019 ◽  
Vol 11 (02) ◽  
pp. 1950015 ◽  
Author(s):  
Feng Gao ◽  
Wang Guo ◽  
Peijian Chen ◽  
Chengzheng Cai ◽  
Guangjian Peng
Keyword(s):  
Flexible Electronics ◽  
Critical Strain ◽  
Present Finding ◽  
Elastic Substrate ◽  
Material Parameters ◽  
Numerical Result ◽  
Graded Coating ◽  
Inhomogeneous Coating ◽  
Graded Properties ◽  
Film Substrate

The wrinkling instability of a stiff film adhering to a pre-strained inhomogeneous bi-layer substrate consisting of a homogeneous substrate and a graded coating is investigated in the present paper. The critical strain, wavelength and amplitude of the film/inhomogeneous substrate system are calculated numerically and analyzed comprehensively. Compared with the numerical result, a theoretical model is introduced to approximately predict the wrinkling responses of the system. The influence of various geometric and material parameters on the wrinkling behavior is mainly focused. The wrinkling responses are found to be highly related to the graded laws and the thickness of the inhomogeneous coating as well as the Poisson’s ratio. What is more, a proper choice of graded properties of a substrate can improve the wrinkling response of a film/substrate system. The present finding should be very meaningful to guide the design of various stretchable and flexible electronics.

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

1990 ◽  
Vol 112 (4) ◽  
pp. 309-316 ◽  
Author(s):  
F. Erdogan ◽  
P. F. Joseph
Keyword(s):  
Interfacial Crack ◽  
Strain Energy Release ◽  
Interfacial Zone ◽  
Stress Concentrations ◽  
Elastic Substrate ◽  
Multilayered Films ◽  
Elastic Continuum ◽  
Modeling And Analysis ◽  
Film Substrate ◽  
Homogeneous Temperature

In this paper the basic residual stress problem for multilayered or multiple films on an elastic substrate is considered. The stresses may be caused by a homogeneous temperature variation or slow thermal cycling and by far field mechanical loading. The films are approximated by orthotropic membranes and the substrate is assumed to be an elastic continuum. The interfacial zone is modeled by either an ideal interface or a homogeneous shear layer. The primary interest in the paper is in examining stress concentrations or singularities near the film ends. For the two interface conditions considered, this is done by varying the film/substrate contact angle. Also studied are strain energy release rate for the propagation of an interfacial crack and the direction and the magnitude of the maximum cleavage stress for a possible crack initiation in the substrate. The basic modeling and analysis are considered in Part I. Part II of the paper is devoted to the presentation and discussion of the results.

Spherical indentation of an elastic bilayer: A modification of the perturbation approach

2008 ◽  
Vol 23 (11) ◽  
pp. 2935-2943 ◽  
Author(s):  
Jae Hun Kim ◽  
Chad S. Korach ◽  
Andrew Gouldstone
Keyword(s):  
Analytic Solution ◽  
Effective Modulus ◽  
Spherical Indentation ◽  
Perturbation Approach ◽  
Instrumented Indentation ◽  
Flat Punch ◽  
First Order ◽  
Property Measurement ◽  
Film Substrate ◽  
Contact Size

Accurate mechanical property measurement of films on substrates by instrumented indentation requires a solution describing the effective modulus of the film/substrate system. Here, a first-order elastic perturbation solution for spherical punch indentation on a film/substrate system is presented. Finite element method (FEM) simulations were conducted for comparison with the analytic solution. FEM results indicate that the new solution is valid for a practical range of modulus mismatch, especially for a stiff film on a compliant substrate. It also shows that effective modulus curves for the spherical punch deviates from those of the flat punch when the thickness is comparable to contact size.

Indentation Load Relaxation Studies of Thin Film-Substrate Systems

1986 ◽  
Vol 72 ◽  
Author(s):  
D. Stone ◽  
W. Lafontaine ◽  
S. Ruoff ◽  
S.-P. Hannula ◽  
B. Yost ◽  
...  
Keyword(s):  
Thin Film ◽  
Aluminum Film ◽  
Indentation Load ◽  
Load Relaxation ◽  
Tin Film ◽  
Relaxation Studies ◽  
Film Substrate

AbstractResults from indentation load relaxation (ILR) tests on thin film-substrate systems are reported. In the case of a 1 pum aluminum film on silicon, the data can be interpreted as reflecting both the properties of the film and the interface between film and substrate. Data from a 37μm TiN film on 304 SS are believed to reflect the combined behavior of the film and substrate.

scholarly journals Quasistatic deformation and failure modes of composite square honeycombs

2008 ◽  
Vol 3 (7) ◽  
pp. 1315-1340 ◽  
Author(s):  
Benjamin Russell ◽  
Vikram Deshpande ◽  
Haydn Wadley
Keyword(s):  
Failure Modes ◽  
Deformation And Failure

Deformation and Failure Characteristics of Embankment upon the Slope in Permafrost Area under Different Foundation Slope

2013 ◽  
Vol 353-356 ◽  
pp. 905-910
Author(s):  
Qian Su ◽  
Jun Jie Huang ◽  
Bao Liu ◽  
Yu Jie Li
Keyword(s):  
Failure Modes ◽  
Centrifuge Modeling ◽  
Experimental Conditions ◽  
Soil Layers ◽  
Deformation And Failure ◽  
Geotechnical Centrifuge ◽  
Gravity Load ◽  
Unstable Failure ◽  
Thawing Depth ◽  
The Stability

To investigate the effect of foundation slope on stability of embankment upon the slope in permafrost area, 3 groups of model tests with different foundation slope are designed using the mechanical similarity based on geotechnical centrifuge modeling, when the freezing-thawing depth of the embankment reaches the greatest. The results show that: (1) The foundation slope has effect on the stability of the embankment. The deformation mainly concentrates on the soil layers above the freezing-thawing interface, and the deformation mutation point takes place at the freezing-thawing interface. (2) According to fracture characteristics and failure severity of the embankment, failure modes can be divided into the cracking failure in shallow layer and in deep layer. (3) The cause of unstable failure is the deficiency of shear resistance strength of the weak belt, the soil layers above the freezing-thawing interface slips along the freezing-thawing interface under gravity load. (4) Under the experimental conditions, the critical value of the foundation slope influencing on the stability of the embankment is about 1:6 when the height of the slope embankment is 5.0 m.

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