Effect of microstructural evolution on electrical property of the Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste

2005 ◽  
Vol 20 (10) ◽  
pp. 2854-2865 ◽  
Author(s):  
Po-Cheng Shih ◽  
Kwang-Lung Lin
Keyword(s):  
Heat Treatment ◽  
Electrical Property ◽  
Microstructural Evolution ◽  
Electrical Resistance ◽  
Ball Grid Array ◽  
Solder Paste ◽  
Testing Conditions ◽  
Average Resistance ◽  
Solder Balls ◽  
Testing Condition

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates. The correlation between microstructural evolution and the electrical resistance of the joints under various testing conditions of reflow cycles and heat treatment was investigated. The electrical resistance of the Sn–Ag–Cu joints without Sn–Zn–Bi was also conducted for comparison. The average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (single reflow) to 7.3 (10 cycles) mΩ and from 7.2 (single reflow) to 7.6 (10 cycles) mΩ. Furthermore, the average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (aging 0 h) to 7.8 (aging 1000 h) mΩ and from 7.2 (aging 0 h) to 7.9 (aging 1000 h) mΩ. It was also noticeable that the average resistance values of Sn–Ag–Cu/Sn–Zn–Bi samples were higher than those of Sn–Ag–Cu samples in each specified testing condition. The possible reasons for the greater resistance exhibited by the Sn–Zn–Bi incorporated joints were discussed.

Electrical resistance of Sn–Ag–Cu ball grid array packages with Sn–Zn–Bi addition jointed at 240 °C

2007 ◽  
Vol 22 (1) ◽  
pp. 113-123
Author(s):  
Po-Cheng Shih ◽  
Kwang-Lung Lin
Keyword(s):  
Control System ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Electrical Resistance ◽  
Ball Grid Array ◽  
Solder Paste ◽  
Solder Balls ◽  
Solder Bulk ◽  
Ball Grid Array Packages

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously at 240 °C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn–Zn–Bi addition (only Sn–Ag–Cu) were studied as a control system. Electrical resistance was measured after multiple reflows and aging. The electrical resistance of the joint (R1) consisted of three parts: the solder bulk (Rsolder bulk, upper solder highly beyond the mask), interfacial solder/intermetallic compound (Rsolder/IMC), and the substrate (Rsubstrate). R1 increased with reflows and aging time. Rsolder/IMC, rather than Rsolder bulk and Rsubstrate, seemed to increase with reflows and aging time. The increase of R1 was ascribed to the Rsolder/IMC rises. Rsubstrate was the major contribution to R1. However Rsolder/IMC dominated the increase of R1 with reflows and aging. R1 of Sn–Zn–Bi/Sn–Ag–Cu samples were higher than that of Sn–Ag–Cu samples in various tests.

Interfacial Bonding Behavior with Introduction of Sn–Zn–Bi Paste to Sn–Ag–Cu Ball Grid Array Package During Multiple Reflows

2005 ◽  
Vol 20 (1) ◽  
pp. 219-229 ◽  
Author(s):  
Po-Cheng Shih ◽  
Kwang-Lung Lin
Keyword(s):  
Intermetallic Compounds ◽  
Ball Grid Array ◽  
Interfacial Bonding ◽  
Solder Paste ◽  
Soldering Temperature ◽  
Ball Grid Array Package ◽  
Solder Balls ◽  
Multiple Reflow Cycles

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates to investigate the interfacial bonding behaviors for multiple reflow cycles at two different soldering temperature of 210 and 240 °C. The different intermetallic compounds that formed at the interface after one reflow cycle were respectively the island-shaped Ag–Au-Cu-Zn (near the solder) compounds and the Ni–Sn–Cu-Zn (near the metallized pad) compounds in 210 or 240 °C soldering systems. Layered Ag–Au–Cu–Zn, Ag5Zn8, and Ag–Zn–Sn compounds were also observed within the solder near the interface after single reflow cycle. After ten reflow cycles, the Ag–Au–Cu–Zn compounds significantly decomposed, while the Ag3Sn and Ni–Sn–Cu–Zn compounds coarsened obviously.

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

2003 ◽  
Author(s):  
Xingjia Huang ◽  
S. W. Ricky Lee ◽  
Ming Li ◽  
William Chen
Keyword(s):  
Aging Time ◽  
Microstructural Evolution ◽  
Thermal Aging ◽  
Electrical Resistance ◽  
Flip Chip ◽  
Solder Bumps ◽  
Aging Test ◽  
Solder Balls

The present study is aimed at investigating the effects of thermal aging and Au addition on the electrical resistance of solder balls (bumps) in flip chip (FC) and UltraCSP packages. The specimens include one FC with eutectic Sn-Ag-Cu solder bumps and two types of UltraCSP, which have 20-mil and 30-mil eutectic Sn-Pb solder balls, respectively. The thermal aging test is performed with thermal aging at 175°C for FC, and 150°C for CSPs for up to 2000 hours, respectively. The electrical resistance of each daisy-chain pair of solder balls is measured using the Four Point Kelvin Method. With the increase in thermal aging time, electrical resistance of CSPs without Au increases gradually. After 1000 hour, the resistance seems to level off. While the resistance of CSPs with Au addition ascends monotonically with prolonged thermal aging. For Sn-Ag-Cu flip chip solder bumps, at 175°C for only 24 hours, the electrical resistance of a daisy-chain pair of solder bumps drops substantially. From 24 to 2000 hours, the electrical resistance increases at first and soon becomes stable. The change in the electrical resistance is related to the microstructural evolution in the solder balls.

EFFECTS OF Ru AND Cr ON γ/γ' MICROSTRUCTURAL EVOLUTION OF Ni--BASED SINGLE CRYSTAL SUPERALLOYS DURING HEAT TREATMENT

2010 ◽  
Vol 46 (8) ◽  
pp. 897-906 ◽  
Author(s):  
Jingyang CHEN ◽  
Bin ZHAO ◽  
Qiang FENG ◽  
Lamei CAO ◽  
Zuqing SUN
Keyword(s):  
Heat Treatment ◽  
Single Crystal ◽  
Microstructural Evolution

Microstructural evolution of delta ferrite in SAVE12 steel under heat treatment and short-term creep

2012 ◽  
Vol 73 ◽  
pp. 144-152 ◽  
Author(s):  
Shengzhi Li ◽  
Zumrat Eliniyaz ◽  
Lanting Zhang ◽  
Feng Sun ◽  
Yinzhong Shen ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Microstructural Evolution ◽  
Short Term ◽  
Delta Ferrite ◽  
Term Creep ◽  
Short Term Creep

TIN ADDITION TO THE (Bi, Pb) 2223 SYSTEM

1994 ◽  
Vol 08 (19) ◽  
pp. 1175-1183 ◽  
Author(s):  
G. RAVI CHANDRA ◽  
B. GOPALA KRISHNA ◽  
S. V. SURYANARAYANA ◽  
T. S. N. MURTHY
Keyword(s):  
Heat Treatment ◽  
Magnetic Susceptibility ◽  
Electrical Resistance ◽  
Volume Fraction ◽  
Ac Magnetic Susceptibility ◽  
Superconducting Properties ◽  
X Ray Diffraction ◽  
Metallic Behavior ◽  
X Ray

The effect of the addition of Sn on the superconducting properties of the Bi 1.7 Pb 0.3 Sr 2 Ca 2 Cu 3 O y system as functions of Sn concentration and heat treatment has been studied by dc electrical resistance, ac magnetic susceptibility, and X-ray diffraction. Tin addition suppresses the volume fraction of the high T c phase. Samples with Sn > 0.1 show metallic behavior up to LNT. The formation of the Ca 2 PbO 4 phase is promoted by Sn. This depletes the amount of Pb and Ca necessary for the formation of the 2223 phase, thus reducing the volume fraction of the 2223 phase. It is possible that at least a small fraction of tin substitutes some of the cationic sites of the starting composition. The results of the different measurements are presented.

Microstructural evolution and mechanical properties of cast Al-2Li-2Cu-0.5Mg-0.2Zr alloy during heat treatment

2017 ◽  
Vol 132 ◽  
pp. 312-319 ◽  
Author(s):  
Xiaolong Zhang ◽  
Liang Zhang ◽  
Guohua Wu ◽  
Wencai Liu ◽  
Chunchang Shi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Microstructural Evolution

Effect of heat-treatment on microstructural evolution and mechanical behaviour of severely deformed Inconel 718

2018 ◽  
Vol 715 ◽  
pp. 295-306 ◽  
Author(s):  
Prabhat Chand Yadav ◽  
Sandeep Sahu ◽  
Anandh Subramaniam ◽  
Shashank Shekhar
Keyword(s):  
Heat Treatment ◽  
Microstructural Evolution ◽  
Mechanical Behaviour ◽  
Inconel 718
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