Benefit of textured CIGS cells for low reflecting nanogrid application

MRS Advances ◽  
2017 ◽  
Vol 2 (53) ◽  
pp. 3175-3180 ◽  
Author(s):  
Joop van Deelen ◽  
Y. Tezsevin ◽  
A. Omar ◽  
M. Xu ◽  
M. Barink

ABSTRACTWe show the results of nanotextured device designs combined with carefully placed nanogrids in order to minimize optical losses. Finite element method (FEM) based optical modeling indicates that the reflection of both the layer stack and the metal is diminished by the proposed configuration in which the metallic nanowires at the front of a device are placed into the relatively shallow crevices, whereby the metal is not covered by other materials of the cell stack. The electric field distribution and energy dissipation (i.e. absorption) diagrams of the texture show how the light is distributed and where it is absorbed. It shows that light is ‘concentrated’ in the tips of the texture (depending on the size and wavelength of the light). Simultaneously, for wavelengths above 750 nm there appears to be a reduction of the E-field in the lower part of the texture and, therefore, putting a metallic nanowire in this position has hardly any negative optical effect.Furthermore, the impact of the texture height up to 1000 nm and the nanowire width up to 150nm was systematically investigated for a texture and wire period of 500 nm. The spectra reveal dimension dependent and wavelength specific optical features. This is the case even if the flat nanowire remains fully exposed to the front glass medium (i.e. not embedded underneath absorbers). At a texture height of 900 nm, the reflection related current loss is reduced by an order of magnitude compared to flat layer stacks, virtually regardless of the width of the metal nanowire. This opens up exciting new ways of creating nano-metal containing devices without the usual optical losses.

Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


2018 ◽  
Vol 934 ◽  
pp. 24-29
Author(s):  
Prapasiri Pongprayoon ◽  
Attaphon Chaimanatsakun

Graphene nanopore has been widely employed in nanofilter or nanopore devices due to its outstanding properties. The understanding of its mechanical properties at nanoscale is crucial for device improvement. In this work, the mechanical properties of graphene nanopore is thus investigated using atomistic finite element method (AFEM). Four graphene models with different pore shapes (circular (CR), horizontal rectangle (RH), and vertical rectangle (RV)) in sub-nm size which could be successfully fabricated experimentally have been studied here. The force normal to a pore surface is applied to mimic the impact force due to a fluid flow. Increasing pore size results in the reduction in its strength. Comparing among different pore shapes with comparable sizes, the order of pore strength is CR>RH>RV>SQ. In addition, we observe that the direction of pore alignment and geometries of pore edge also play a key role in mechanical strength of nanopores.


2011 ◽  
Vol 268-270 ◽  
pp. 412-417 ◽  
Author(s):  
Ferhat Tighilt

The voltage and electric field distribution in an arrester are very important for its long operation 15 kV with and without pollution. In order to clarify the influence of pollution severity conditions on metal oxide surge arrester, the finite element method (FEM) compilation of the voltage distribution in the ZnO column varistors under different pollution layer conductivity (200 μS, 70μS, 20μS) and clean was employed using the FEMLAB package.


2013 ◽  
Vol 404 ◽  
pp. 232-236
Author(s):  
Xiu Ying Yang

In order to study the performance of steel beam in the cooling process, a series of numerical analysis has been carried out in this paper. The solid model of the beam was established firstly using finite element method, the beam was heated and cooled gradually under the certain uniform load, then the internal forces and deformation of the beam were analyzed in the whole fire process. Based on this, the parameters of the highest temperature, heating rate and the cooling rate were changed, and their affect on the beam performance was studied by comparing.


2021 ◽  
pp. 136943322110542
Author(s):  
Mahdi Usefvand ◽  
Ahmad Maleki ◽  
Babak Alinejad

Coupled steel plate shear wall (C-SPSW) is one of the resisting systems with high ductility and energy absorption capacity. Energy dissipation in the C-SPSW system is accomplished by the bending and shear behavior of the link beams and SPSW. Energy dissipation and floor displacement control occur through link beams at low seismic levels, easily replaced after an earthquake. In this study, an innovative coupled steel plate shear wall with a yielding FUSE is presented. The system uses a high-ductility FUSE pin element instead of a link beam, which has good replaceability after the earthquake. In this study, four models of coupled steel plate shear walls were investigated with I-shaped link beam, I-shaped link beam with reduced beam section (RBS), box-link beam with RBS, and FUSE pin element under cyclic loading. The finite element method was used through ABAQUS software to develop the C-SPSW models. Two test specimens of coupled steel plate shear walls were validated to verify the finite element method results. Comparative results of the hysteresis curves obtained from the finite element analysis with the experimental curves indicated that the finite element model offered a good prediction of the hysteresis behavior of C-SPSW. It is demonstrated in this study that the FUSE pin can improve and increase the strength and energy dissipation of a C-SPSW system by 19% and 20%, respectively.


2018 ◽  
Vol 196 ◽  
pp. 01055
Author(s):  
Sławomir Dudziak ◽  
Zofia Kozyra

Dynamic analyses play an important role in the process of designing buildings in the vicinity of transportation routes. The Finite Element Method is the most popular modelling technique, because it allows to simulate the structure response in the higher frequency range properly. However, the results of such analyses depend on many factors and can differ a lot. This paper discusses the impact of the building mass estimation and neglecting or including damping in the analysis on the assessment of influence of vibrations due to traffic on people.


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