scholarly journals Capacitance-voltage differintegral characteristics of fractal field-effect device

2020 ◽  
Vol 28 (2) ◽  
pp. 57-62
Author(s):  
V. M. Onufrienko
Keyword(s):  
Charge Density ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Oxide Semiconductor ◽  
Field Size ◽  
Electrical Characteristics ◽  
High Frequencies ◽  
Semiconductor Structures ◽  
Capacitance Voltage ◽  
Charge Channel

In the present paper, we use the theoretical model of fractal elements to study the charge and capacitance-voltage differintegral characteristics of a fractal field-effect device. The control of the charge channel and the capacity of a fractal nanotransistor is revealed by changing the scaling of the nanolayer, the charge density in which is determined from the sum of the charges of electrons, holes, and ionized impurities. The significant influence of fractal charge distribution carriers on the device capacitance at high frequencies is noted. This fact theoretically confirms the possibility of increasing the capacitance of metal-oxide-semiconductor structures to increase the efficiency of the field-effect-transistors. The comparison of the obtained expressions shows the strong influence of fractal medium on the electric field size and charge density in a semiconductor that is followed by the change of capacitive device parameters. The differential-integral method for modeling artificial metamaterial fractal radioelements with necessary electrical characteristics is proposed.

Change in Characteristics of SiC MOSFETs by Gamma-Ray Irradiation at High Temperature

2016 ◽  
Vol 858 ◽  
pp. 860-863 ◽  
Author(s):  
Takuma Matsuda ◽  
Takashi Yokoseki ◽  
Satoshi Mitomo ◽  
Koichi Murata ◽  
Takahiro Makino ◽  
...  
Keyword(s):  
Field Effect ◽  
Gamma Ray ◽  
Field Effect Transistors ◽  
Absorbed Dose ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Radiation Response ◽  
Electrical Characteristics ◽  
Gamma Ray Irradiation

Radiation response of 4H-SiC vertical power Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) was investigated at 150°C up to 10.4 MGy. Until irradiation at 1.2 MGy, the drain current – gate voltage curves of the SiC MOSFETs shifted to the negative voltage side, and the leakage of drain current at gate voltages below threshold voltage increased with increasing absorbed dose. However, no significant change in the electrical characteristics of SiC MOSFETs was observed at doses above 1.2 MGy. For blocking characteristics, there were no degradations of the SiC MOSFETs irradiated at 150°C even after irradiated at 10.4 MGy.

A Study on Optimization of Planar Gate Type Metal-Oxide-Semiconductor Field-Effect-Transistors Multi Epitaxial Process in Super-Junction Structure

2021 ◽  
Vol 16 (5) ◽  
pp. 738-743
Author(s):  
Chang Hyeon Jo ◽  
Dea Hee Kim ◽  
Hyeong Seong Jo ◽  
O Yong Kwon ◽  
Ey Goo Kang
Keyword(s):  
Metal Oxide ◽  
Breakdown Voltage ◽  
Field Effect ◽  
Field Effect Transistors ◽  
High Reliability ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Electrical Characteristics ◽  
High Breakdown Voltage ◽  
Junction Structure

Power metal-oxide-semiconductor field-effect-transistors (MOSFET) is a high voltage control device that requires high reliability and efficiency and is used to improve efficiency in areas such as renewable energy generators, electric vehicles, power supply unit, converters and motor control. Electrical characteristics of the MOSFET include a Threshold voltage which is a voltage for operating the device, an On-resistance which is a device resistance in an on-state, and a breakdown voltage which means a device withstand voltage. A Super-Junction structure is proposed to design the device with a high breakdown voltage and a low on-resistance. A multi-epitaxial Super-Junction MOSFET forms a Pillar layers by injecting continuously P-type impurity at edge on stacked N-Pillar layer. By forming the Pillar region which is higher doping concentration than N-drift, the on resistance can be reduced. In the forward blocking mode, the depletion layer of the Pillar region is extended to both vertical and horizontal sides, for a high breakdown voltage can be obtained. By using a T-CAD tool which is a process simulator, electrical characteristics of 1,200 V class super-junction MOSFET are analyzed along process variables (pillar lateral length, pillar concentration). When the breakdown voltage of the super junction MOSFET and the Planar MOSFET are equal, On-resistance (based on 10 A) has a gain of approximately 20% by a difference of 0.189 ohm×cm. It is believed that this can contribute to the development of super junction MOSFET with improved reliability and electrical characteristics.

Shallow Traps at P-Doped SiO2/4H-SiC(0001) Interface

2011 ◽  
Vol 679-680 ◽  
pp. 338-341 ◽  
Author(s):  
Dai Okamoto ◽  
Hiroshi Yano ◽  
Shinya Kotake ◽  
Tomoaki Hatayama ◽  
Takashi Fuyuki
Keyword(s):  
Photoelectron Spectroscopy ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Interface Traps ◽  
Channel Mobility ◽  
X Ray ◽  
Capacitance Voltage ◽  
Shallow Traps

We report on electrical and physical investigations aimed to clarify the mechanisms behind the high channel mobility of 4H-SiC metal–oxide–semiconductor field-effect transistors processed with POCl3 annealing. By low-temperature capacitance–voltage analysis, we found that the shallow interface traps are effectively removed by P incorporation. Using x-ray photoelectron spectroscopy, we found that the three-fold coordinated P atoms exist at the oxide/4H-SiC interface. The overall results suggest that P atoms directly remove the Si–Si bonds and thus eliminate the near-interface traps.

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