Polyimide-Substrate Effects During Wet Chemical Processing of Polyimide Films in VLSI

2009 ◽  
pp. 273-273-17 ◽  
Author(s):  
DJ Belton ◽  
P van Pelt ◽  
AE Morgan
Keyword(s):  
Chemical Processing ◽  
Polyimide Films ◽  
Substrate Effects ◽  
Polyimide Substrate ◽  
Wet Chemical

Thermodynamical Calculations and Experimental Confirmation about the Mg-Al-Spinel Reaction Path in the Sol-Gel-Process

2006 ◽  
Vol 317-318 ◽  
pp. 135-138 ◽  
Author(s):  
Wilfried Wunderlich ◽  
Krupathi Vishista ◽  
Francis D. Gnanam ◽  
Daniel Doni Jayaseelan
Keyword(s):  
Thermal Analysis ◽  
Reaction Path ◽  
Sol Gel ◽  
Chemical Processing ◽  
Aluminium Isopropoxide ◽  
Spinel Formation ◽  
Sol Gel Process ◽  
Wet Chemical ◽  
Enthalpy Data ◽  
Good Agreement

The aim of this research is, to clarify which route the sol-gel-process is taking in the case of a Al-Mg-spinel slurry, in particular, whether the hydrolysis reaction or the spinel formation is faster and which of the intermediate hydroxide phases Al(OH)3, and Mg(OH)2, or MgO and Al2O3 or MgAl2O4H2O are formed during the spinel formation. The spinel-alloy was produced using the polymeric route during wet chemical processing. Aluminium-isopropoxide was hydrolyzed in order to form the boehmite-sol and then the same amount of magnesia was added and mixed. This sol precipitated as boehmite (AlOOH) and brucite (Mg(OH)2) after ageing for 12h as confirmed by differential thermal analysis (DTA), and differential thermal gravity (DTG) measurements. After that, the powders were subsequently annealed at 900oC for 3h in air and observed by TEM. Calculations using thermodynamic enthalpy data are in good agreement with the experiments and can be used to predict reaction paths in other system as well.

Microfluidic paper-based analytical devices fabricated by low-cost photolithography and embossing of Parafilm®

Lab on a Chip ◽  
2015 ◽  
Vol 15 (7) ◽  
pp. 1642-1645 ◽  
Author(s):  
Ling Yu ◽  
Zhuan Zhuan Shi
Keyword(s):  
Low Cost ◽  
Chemical Processing ◽  
Wet Chemical

The combination of photolithography-patterning and embossing of a Parafilm® can fabricate microfluidic paper-based analytical devices (μPADs) without the use of a wax printer, cutter plotter and wet-chemical processing of paper.

Wet Chemical Processing of Ge in Acidic H2O2 Solution: Nanoscale Etching and Surface Chemistry

2020 ◽  
Vol 9 (8) ◽  
pp. 084002
Author(s):  
Graniel Harne A. Abrenica ◽  
Mathias Fingerle ◽  
Mikhail V. Lebedev ◽  
Sophia Arnauts ◽  
Thomas Mayer ◽  
...  
Keyword(s):  
Surface Chemistry ◽  
Chemical Processing ◽  
Wet Chemical ◽  
H2o2 Solution

Synthesis of Submicron AlON Powder by Wet Chemical Processing

2012 ◽  
Vol 624 ◽  
pp. 42-46 ◽  
Author(s):  
Fei Zhong Ma ◽  
Jing Xuan Lei ◽  
Ying Shi ◽  
Jian Jun Xie ◽  
Fang Lei
Keyword(s):  
Carbothermal Reduction ◽  
Single Phase ◽  
Preparation Method ◽  
Process Conditions ◽  
Chemical Processing ◽  
Particle Sizes ◽  
Synthetic Process ◽  
Median Particle ◽  
Wet Chemical ◽  
Partical Size

The single-phase Υ-AlON powders were synthesized from three different precursors: Υ-Al2O3+C, Al(OH)3+C, NH4Al(OH)2CO3+C at 1750°C by carbothermal reduction and nitridation . The effects of aluminium source and synthetic process conditions on the characteristic of Υ-AlON powders were investigated in order to optimize the preparation method. It was revealed that the wet chemical processing was helpful to reduce partical size. The median particle sizes (d50) of AlON powders synthesized from different precusors were 15.33 μm, 2.886 μm, 405.6 nm, respectively.

Paper-Like Display Utilizing Organic Electroluminescent Diodes Fabricated on 10 Micron-Thick Polyimide Films

2002 ◽  
Vol 736 ◽  
Author(s):  
Yutaka Ohmori ◽  
Hirotake Kajii ◽  
Takayuki Taneda ◽  
Makoto Hikita ◽  
Hisataka Takenaka
Keyword(s):  
Glass Substrate ◽  
Emission Characteristics ◽  
Polyimide Films ◽  
Light Emitting ◽  
Polyimide Substrate ◽  
Organic Light ◽  
Organic Electroluminescent

ABSTRACTAn organic light emitting device (OLED) has been successfully fabricated on a thin paper-like polyimide substrate (about 10 μm-thick), which is sandwiched between silicone oxide and silicone nitride films. The emission characteristics of the OLEDs, which consist of diamine derivative (α-NPD) and 8-hydroxyquinoline aluminum (Alq3), are similar to those fabricated on a conventional glass substrate. Since the substrates and the OLEDs are very thin like a paper, the devices can be applicable for paper-like displays.

Synthesis of polycrystalline γ-AlON powders by novel wet chemical processing

2012 ◽  
Vol 55 (12) ◽  
pp. 3405-3410 ◽  
Author(s):  
JingXuan Lei ◽  
FeiZhong Ma ◽  
Ying Shi ◽  
JianJun Xie ◽  
Wei Hu ◽  
...  
Keyword(s):  
Chemical Processing ◽  
Wet Chemical

scholarly journals Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 546
Author(s):  
Seong Hyun Jang ◽  
Young Joon Han ◽  
Sang Yoon Lee ◽  
Geonho Lee ◽  
Jae Woong Jung ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Chemical Structure ◽  
Surface Characteristics ◽  
Dielectric Constants ◽  
Flash Lamp ◽  
Next Generation ◽  
Polyimide Films ◽  
Chemical Structures ◽  
Polyimide Substrate ◽  
Lift Off

Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.

Dependence of Surface Microroughness of CZ, FZ, and EPI Wafers on Wet Chemical Processing

1992 ◽  
Vol 139 (8) ◽  
pp. 2133-2142 ◽  
Author(s):  
M. Miyashita ◽  
T. Tusga ◽  
K. Makihara ◽  
T. Ohmi
Keyword(s):  
Chemical Processing ◽  
Wet Chemical ◽  
Surface Microroughness

Nanostructured Ceramic Thin Films and Membranes by Wet Chemical Processing Methods

2006 ◽  
Vol 45 ◽  
pp. 1252-1259
Author(s):  
Jing Yu Shi ◽  
Matthew L. Mottern ◽  
Krenar Shqau ◽  
Henk Verweij
Keyword(s):  
Thin Films ◽  
Colloidal Stability ◽  
Synthesis Process ◽  
Narrow Particle Size Distribution ◽  
Chemical Processing ◽  
Organic Additives ◽  
Ambient Conditions ◽  
Ceramic Thin Films ◽  
Nanostructured Ceramic ◽  
Wet Chemical

Nanostructured ceramic thin films and membranes are used for protective or functional purposes and prepared on dense or porous substrate materials. Wet chemical methods enable cheap, low-temperature, mass-scale manufacturing routes. They produce fine-grained porous and dense micro-structures that cannot be realized otherwise. In wet-chemical processing, clean nanoparticle dispersions are deposited on the substrate at, primarily, ambient conditions. The deposition is followed by a (rapid) thermal processing treatment to remove liquids and organic additives, to convert precursors to the target composition, and to establish the final porous and dense micro-structure. In the synthesis of precursor dispersions it is very important to obtain nanoparticles with a near-isometric shape and a fairly narrow particle size distribution, without the formation of secondary (agglomerate) structures. In particular the latter requires careful control of solution and interfacial chemistry to achieve proper colloidal stability, during and after the synthesis process. Characterization of coating integrity, defect morphology and defect population is done by decoration methods, microscopy, ellipsometry and statistical methods that employ membrane transport properties.

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